JPH08757Y2 - Resin encapsulation equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a resin sealing device for a semiconductor device, which is resin-molded using a transfer molding press.

[Conventional technology]

Generally, in a resin sealing device for a semiconductor device, after clamping two upper and lower mold plates mounted on a transfer molding press,
It is known that a resin tablet in a transfer pot is pressure-fed into a cavity by a plunger to perform molding.

Conventionally, the lower mold plate of both mold plates of this type of resin sealing device is configured as shown in FIG. This will be described with reference to FIG. 1. In FIG. 1, a reference numeral 1 is a surface plate (heater block) having a heater 2 built therein, and is held on a base 3 via a large number of support pins 4.
The surface plate 1 has two large and small holes 5a and 5b opening in the pressurizing direction.
Further, an insertion hole 5 is provided which is composed of a step portion 5c perpendicular to the axes of both the holes 5a and 5b. A chase block (cavity block) 6 and a center block 7, which will be described later, are held on the upper end of the surface plate 1. A center block 7 of the two blocks 6 and 7 is provided with a pot 8 in which a plunger (not shown) moves forward and backward and a runner 9 communicating with the pot 8. The chase block 6 has a parting surface. A cavity 11 that is open to the side of 6a is provided. 12 is a mounting groove 12 that opens to the side
A spacer block having a is located below the cavity 11 and is interposed between the surface plate 1 and the base 3. Further, 13 is a bolt for fixing the surface plate 1 to the spacer block 12, 14 is a plate 15 on the press side.
It is a bolt for attaching the spacer block 12 via. An upper template A is arranged above the chase block 6.

In the resin sealing device for a semiconductor device configured as described above, a resin tablet (not shown) filled in a pot (not shown) is pressed at the time of mold clamping, and the chase block 6 is preliminarily set in the cavity 11 in advance. A semiconductor element (not shown) on the mounted lead frame is resin-sealed.

[Problems to be solved by the invention]

By the way, in the conventional resin sealing device for a semiconductor device, the surface plate 1 is fixed onto the spacer block 12 by the bolts 13, and the spacer block 12 is higher in rigidity than the support pin 4. Therefore, the elastic deformation of the spacer block 12 is smaller than the elastic deformation of the support pins 4 during mold clamping, the horizontal deformation of the surface plate 1 is restricted during heating, and the surface plate 1 is deformed so as to warp to one side. It was As a result, at the time of resin sealing, the upper and lower chase blocks 6
There is a problem that a gap is formed between both parting surfaces 6a (only one is shown), and resin burrs are generated on the lead frame on the chase block 6.

The present invention has been made in view of such circumstances, and a semiconductor device in which each parting surface can be brought into close contact with each other during resin encapsulation and thus resin flash on the lead frame on the chase block can be prevented. The present invention provides a resin sealing device.

[Means for solving problems]

A resin sealing device for a semiconductor device according to the present invention includes a heater block for holding a chase block having an insertion hole that opens in a pressurizing direction, a spacer block provided between the heater block and a base, and the spacer. The block is provided with a positioning bolt that is screwed to the block and inserted through the insertion hole, and a space is provided between the spacer block and the heater block. This space is provided by a plurality of support pins at the same height that supports the heater block. Is larger than the dimension which is compressed and deformed by the mold clamping force during mold clamping.

[Action]

In the present invention, warp deformation of the heater block can be prevented during mold clamping and heating.

[Embodiment] FIG. 1 is a sectional view showing a lower template in a resin sealing device for a semiconductor device according to the present invention.
The same members as those shown in the drawings are designated by the same reference numerals, and detailed description thereof will be omitted. In the figure, the reference numeral 21 indicates a heater block containing a heater (not shown), which is provided on the base 3 via the support pin 4.
The chase block 6 is held at the upper end.
On both side edges of the heater block 21, there are provided through holes 22 which are located outside the chase block 6 and open in the pressing direction. Reference numeral 23 is a spacer block having a mounting groove 23a that opens to the side, and is provided on the axis of the insertion hole 22 and is mounted on the base 3 by a bolt 24.
Is fixed through. A predetermined gap g is provided between the spacer block 23 and the heater block 21. A stepped bolt 26 for positioning is screwed to the upper end of the spacer block 23 and is inserted into the insertion hole 22. The stepped bolt 26 is provided with a stepped portion 26a that contacts the upper end surface of the spacer block 23 and a bolt head 26b that faces the upper end surface of the heater block 21. The stepped portion 26a of the stepped portion bolt 26 is set to have an outer diameter smaller than the diameter of the insertion hole 22, so that the heater block 21 can be thermally deformed in the horizontal direction. An upper template (not shown) is provided above the chase block 6.

In the resin sealing device for a semiconductor device configured as described above, the stepped bolt 26 that is inserted through the insertion hole 22 is screwed into the spacer block 23, and the gap g is provided between the spacer block 23 and the heater block 21. Since the heater block 21 is provided, the warp deformation of the heater block 21 can be prevented at the time of mold clamping and heating. That is, only the support pins 4 can be elastically compressed and deformed in the pressurizing direction at the time of mold clamping, and the heater block 21 can be thermally deformed in the horizontal direction at the time of heating.

Therefore, in the present invention, the parting surfaces 6a of the chase blocks 6 can be brought into close contact with each other when the resin is sealed.

In this embodiment, the bolt head 26b of the stepped bolt 26 is opposed to the heater block 21, but the present invention is not limited to this, and as shown in FIG. There is no problem even if the elastic body 27 is interposed between the bolt 21 and the bolt head 26b. In this case, the heater block 21 is provided with an elastic force on the support pin 4 side by the elastic body 27.

[Effect of device]

As described above, according to the present invention, a heater block for holding a chase block having an insertion hole opened in the pressurizing direction, a spacer block provided between the heater block and the base, and the spacer block The spacer block and the heater block are provided with a positioning bolt that is screwed and inserted through the insertion hole, and a plurality of support pins are formed at the same height to support the heater block. Since it is larger than the size that is compressed and deformed by the mold clamping force at the time of clamping, the heater block is supported only by the support pins located directly below the part where the mold clamping force is applied, and is located on the side of the part where the mold clamping pressure is applied. It is no longer supported by the spacer block. Therefore, the mold clamping force is applied substantially uniformly over the entire area of the heater block, so that the heater block does not deform into a concave shape during mold clamping and heating. Therefore, even when the mold clamping force is variously changed, the respective parting surfaces can be brought into close contact with each other during the resin sealing, so that the occurrence of resin burrs on the lead frame on the chase block can be prevented. Further, according to the present invention, all the support pins can be formed to have the same length, and the length thereof can be set so as to project above the spacer block when the support pins are compressed and deformed during mold clamping. There is also an effect that the die manufacturing can be performed very easily.

[Brief description of drawings]

FIG. 1 is a sectional view showing a lower template of a resin sealing device for a semiconductor device according to the present invention, FIG. 2 is a sectional view showing another embodiment, and FIG. 3 is a resin sealing device for a conventional semiconductor device. It is sectional drawing which shows the lower mold plate in a stop device. 3 ... Base, 4 ... Support pin, 6 ... Chase block, 21 ... Heater block, 22 ... Insertion hole, 23 ...
Spacer block, 26 …… Stepped bolt, g …… Spacing.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hideaki Suezaki 1-1-1, Imajuku Higashi, Nishi-ku, Fukuoka City, Fukuoka Prefecture Mitsubishi Electric Corporation Fukuoka Factory (72) Hiromichi Yamada 1-chome, Imajuku Higashi, Nishi-ku, Fukuoka City, Fukuoka Prefecture 1-1 No. Ryoden Engineering Co., Ltd. LSI Design Center Fukuoka Branch (72) Creator Sueyoshi Tanaka 1-1-1 Imajuku Higashi, Nishi-ku, Fukuoka-shi, Fukuoka Mitsubishi Electric Corporation Fukuoka Factory (56) References 62-26827 (JP, A)

Claims (1)

[Scope of utility model registration request] 1. A heater block for holding a chase block, which has a through hole that is provided on the base at the same height via a plurality of support pins and opens in the pressing direction, and between the heater block and the base. A spacer block provided outside the support pin and a positioning bolt screwed into the spacer block and inserted through the insertion hole are provided, and a space is provided between the heater block and the spacer block. The resin sealing device for a semiconductor device is characterized in that the gap is made larger than a size in which the support pin is compressed and deformed by a mold clamping force during mold clamping.