JP4969328B2 - Compression molding die and compression molding die apparatus - Google Patents

Description

  The present invention relates to a compression mold, and more particularly to a compression mold that can effectively prevent variations in compression pressure in a plurality of cavities and a compression mold apparatus that uses the compression mold.

  Conventionally, as described in Patent Document 1, mounting materials such as semiconductor chips mounted on a substrate or a lead frame are placed in a plurality of cavities formed by combining an upper mold and a lower mold. There is a known resin-sealing mold (compression molding mold) that seals resin by compression molding by putting a sealing material such as thermosetting resin into each cavity and applying pressure to each cavity. It has been.

  As described above, when a plurality of seals are simultaneously performed by a single compression process, even if the sealing pressure actually occurs between the cavities (even if an equal sealing pressure is applied to the charged resin in each cavity). “Variation” is inevitably generated in the pressure. This is due to the variation in the amount of resin (molding material) introduced into each cavity or the variation in the volume of the molded product (or molded part) itself. This is because the size of the volume of the molded product + the volume of the input resin changes.

  As a method of solving this, in Patent Document 1, the sealing pressure between the cavities is made uniform by connecting the plurality of cavities with flow paths (runners) through which the injected resin can freely flow. This configuration is disclosed (paragraph 0010). In this publication, the cavity block (pressing block) for applying pressure to each cavity is made independent, and further, each cavity block is supported by an independent coil spring, so that the sealing pressure applied to each cavity is given. Also disclosed is a configuration that suppresses the variation in the above (paragraph 0011).

JP 2003-133350 A

  However, in the case of a resin sealing device in which the above-described cavities are connected by a flow path (runner) through which resin can flow, between a plurality of mounting materials such as semiconductor chips arranged on a substrate or a lead frame. In many cases, a slit is provided, and the flow path may not be easily set. Further, the slit is mainly intended to relieve stress due to contraction of each molding block, and connecting them may distort the entire molded product such as a substrate and a lead frame.

  In addition, the original advantage of compression molding is to suppress the flow of resin injected into the cavity and minimize the influence on the internal structure (bonding wire, etc.) of the molded product. If provided, the flow of the resin is induced, and the internal structure may be adversely affected (for example, cutting of a bonding wire, short circuit, etc.). In addition, depending on the viscosity of the resin, a pressure difference exceeding the allowable range may remain between the cavities due to pressure loss when passing through the connected flow paths.

  Further, in a resin sealing device in which independent cavity blocks (pressing blocks) for applying pressure to each cavity are supported by coil springs, the pressing block is used to maintain the thickness accuracy of the molded product after resin sealing. Therefore, it is difficult to move the pressing block up and down while the pressing surface (cavity surface) is not inclined (flat state), and a separate guide structure is required. Further, when the area of the pressing surface in the pressing block becomes larger than a certain level, a single coil spring cannot cover the burden, and a plurality of coil springs may be required. In such a case, it is difficult to accurately and reliably align the load and spring constant of each spring, even if there is a plurality of pressing blocks, even if it is difficult even for one pressing block. To master.

  The present invention has been made to solve these problems, and it is possible to accurately perform variations in sealing pressure between the cavities with a simple configuration while performing compression molding in a plurality of cavities at a time. The purpose is to suppress well.

  The present invention includes a first mold and a second mold that is disposed to face the first mold and that can form a plurality of cavities with the first mold. A plurality of pressing molds provided in the second mold, each of which constitutes a part of the plurality of cavities, and is arranged to be movable forward and backward with respect to the first mold. A block, a base member that allows the plurality of pressing blocks to be moved forward and backward simultaneously with respect to the first mold, a pair of column portions standing on the base member, and a pair of column portions And a beam portion on which the pressing block is placed, and is interposed between the pressing block and the base member so that each pressing block is independent of the base member. And an elastic support mechanism coupled to be displaceable, The cross-sectional area of the beam portion in the specific position between the mounting area of the pressing block and the support area of the support column is greater than the cross-sectional area in the area where the pressing block is mounted. By adopting a smaller configuration, the above-described problem is solved.

  As a result, the sealing pressure difference between the cavities, that is, the variation in the compressive force applied to the pressing block, is absorbed by the bending of the beam portion, and the sealing can be performed with a substantially uniform sealing pressure.

  In addition, since the basic structure is a “beam structure”, the beam material, cross-sectional area, support method, shape, and shape change mode (particularly the shape that changes from the mounting area of the pressure block toward the support area of the support column) Change mode), or by appropriately setting the distance from the mounting area of the pressing block to the support area of the support column, the bending characteristics in the mounting area of each pressing block (in other words, molding in each cavity) It is possible to control the compression force applied to the material with a very high degree of design freedom and high accuracy.

  In the present invention, paying particular attention to this point, with respect to the cross-sectional area of the beam portion in the region where the pressing block is mounted, the space between the mounting region of the pressing block and the support region in the support column Since the cross-sectional area at a specific position is formed to be smaller, the stress generated in the placement region can be dispersed by positively bending the portion other than the vicinity of the center of the beam portion. As a result, not only the design relating to the structure of the beam portion is facilitated, but also the contact property between the pressure block and the beam portion can be maintained well, and the pressure block can be displaced smoothly (while suppressing the inclination). be able to.

  The concept of the base member of the present invention is a member separate from the so-called base member main body, but includes a member (for example, a plate member) that moves integrally with the base member main body.

  Various variations are conceivable for the present invention.

  For example, when the beam portion is formed in a shape in which the cross-sectional area is further reduced from the region where the pressing block is placed toward the support region of the support column, The stress can be smoothly dispersed in portions other than the central portion.

  Further, the object of the present invention can be realized even if a through hole is provided between the placement area and the support area of the beam portion.

  In this case, if the through hole is formed in a shape in which the width of the through surface increases as it goes from the area where the pressing block is placed to the support area of the support column, the stress concentration is smoothed. It can be shifted and dispersed to the support region side.

  If a spring for clamping the molded product of the compression molding die is disposed in the through hole, a compact compression molding die that effectively uses the space can be obtained.

  In view of the spirit of the present invention, the first mold and the second mold that is disposed to face the first mold and can form a plurality of cavities with the first mold. A compression mold comprising the second mold, each of which constitutes a part of the plurality of cavities, and is arranged to be movable back and forth with respect to the first mold. A plurality of pressing blocks, a base member that allows the plurality of pressing blocks to be moved forward and backward simultaneously with respect to the first mold, a pair of support columns erected on the base member, and the pair of support columns And a beam portion on which the pressing block is placed, and being interposed between the pressing block and the base member, each pressing block is attached to the base member. Elastic supporting machines that can be displaced independently of each other And a bending rigidity reducing portion for promoting the bending of the beam portion is formed between the mounting region of the pressing block and the support region of the column portion of the beam portion. It can also be taken as.

  As a typical configuration of the bending stress reducing portion, for example, a configuration in which a concave portion is formed on the surface of the beam portion can be considered.

  If this recess is formed in a shape whose depth or width in plan view increases as it goes from the area where the pressing block is placed to the support area of the support column, it will be smoothly smooth in areas other than the center as well. It becomes possible to disperse the stress.

  The shape of the concave portion is not particularly limited as long as the bending rigidity can be reduced. For example, in addition to the concave portion formed on the bottom surface or the upper surface of the beam, the so-called so-called one round of the outer periphery of the beam. It may be a concave portion included in the category of “neck”.

  In this case, if a plurality of the concave portions are formed and the formation interval is narrowed from the region where the pressing block is placed toward the support region of the support column, a smooth stress is similarly obtained. Dispersion can be performed.

  In the present invention, since the deformation (deflection) of the beam is positively used for controlling the compression pressure of the molding material in the cavity as described above, for example, the displacement of the pressing block with respect to the base member It is possible to quantitatively grasp the displacement of the beam, that is, the compression pressure of the molding material, and automatically control the compression process or automatically detect when a failure occurs. It can be developed into a compression molding die apparatus that can be satisfactorily realized.

  According to the present invention, it is possible to suppress the occurrence of a pressure difference between the cavities, and to control the bending of each beam part, that is, the compression pressure of the molding material in the cavity with a high degree of design freedom. The effect of being able to do is obtained.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a configuration diagram of a resin-sealed mold (compression molding mold) K1 to which the present invention is applied, in which (A) is a front view and (B) is a side view.

  The resin-sealed mold K1 includes an upper mold (first mold) 10 and a lower mold (second mold) 20. The upper mold 10 can hold the substrate (molded product) 5 by suction at a predetermined timing. Although not shown, a plurality of semiconductor chips (mounting materials) are arranged on the substrate 5. The upper mold 10 is supported and fixed by an upper die set 30 located on the upper part of the upper mold 10.

  The lower mold 20 is disposed so as to face the upper mold 10. The lower mold 20 can form a plurality of cavities 32 with the upper mold 10, and includes one frame-shaped block 23 and a plurality of pressing blocks 24.

  The frame block 23 is supported by a lower die set (base member) 40 via a coil spring (not shown), and can move up and down with respect to the lower die set 40. In addition, the code | symbol 31 of FIG. 1 is a spring for clamping the board | substrate 5 (after-mentioned). The lower die set 40 is supported by a press mechanism or the like (not shown), and is configured to be able to open and close the entire lower mold 20 with respect to the upper mold 10 at a predetermined timing. The mold 10 can be moved forward and backward. That is, the plurality of pressing blocks 24 are respectively fitted into the plurality of through holes 23 </ b> A provided in the frame-shaped block 23, and constitute a part of the plurality of cavities 32, respectively, and It can move forward and backward (in this case, up and down). A plurality of spaces formed by being surrounded by the upper mold 10 and the lower mold 20 (the frame-shaped block 23 and the pressing block 24) constitute the cavity 32.

  The lower surface of the pressing block 24 is connected to the lower die set 40 via the elastic support mechanism 21.

  The elastic support mechanism 21 includes a column portion 21B standing on the lower die set 40 and a beam portion 21A hung so as to connect the column portion 21B. That is, both end portions of the beam portion 21A are both supported by the support column portion 21B. The pressing block 24 is mounted and fixed on the mounting region A0 in the center of the beam portion 21A supported on both ends. There is a gap 21C immediately below the beam 21A. For this reason, the beam portion 21A is allowed to bend and functions as an elastic body. 21 A of beam parts are comprised by the member (for example, iron etc.) which can be processed with high precision. As a result, the pressing block 24 can move in the frame-like block 23 with the entire bottom surface thereof being horizontally supported by the beam portion 21A. For this reason, when the pressing block 24 moves in the frame-shaped block 23, a moment that tilts the pressing block 24 (a moment that can be twisted with the frame-shaped block 23) hardly occurs. A separate guide mechanism for ensuring a relative displacement is not particularly provided.

  The elastic support mechanism 21 in the present embodiment is configured such that the beam portion 21A and the column portion 21B are completely independent. For example, in addition to this, each column portion 21B is integrally formed, and only the beam portion 21A is formed. May be independent. That is, it can be said that it is an “independent elastic support mechanism” as long as the beam portion 21A corresponding to each pressing block 24 can bend independently. With this configuration, one of the plurality of pressing blocks 24 is not affected by the sealing pressure received by the other pressing blocks 24 through the beam portion 21A.

  The upper die set 30 and the lower die set 40 are equipped with heaters 30H and 40H, respectively, and predetermined mold temperature control is possible.

  Here, the shape of the beam portion 21A will be described in more detail with reference to FIG.

  2A is an enlarged plan view of the portion taken along the arrow II in FIG. 1, and FIG. 2B is an enlarged front view thereof.

  In this embodiment, the mounting area A0 of the pressing block 24 is set to the midpoint X0 of the beam portion 21A. Since the pressing block 24 has a predetermined bottom area and is placed and fixed on the beam portion 21A, the beam portion 21A does not bend in the placement region A0. Therefore, the “effective bending region” in which the beam portion 21A actually functions as an elastic body is the support region A1 end portion of the support portion A1 of the support portion A1 from the support portion side end portion X1 of the support region A0 of the pressing block 24. This is an area indicated by a symbol Ae up to X2. In this specification and claims, “between the placement area (A0) where the pressing block (24) is placed and the support area (A1) at the column (21A)” is the “effective bending area”. (Ae) ". 2B corresponds to ½ of the span of the beam portion 21A.

  As shown in FIGS. 2A and 2B, in this embodiment, in the beam portion 21A, almost the entire upper surface portion 21A1 of the effective bending region Ae is inclined by an angle θ. The height (thickness) H1 of the beam portion 21A in the support region A1 is lower (thin) than the height (thickness) H0 in the placement region A0 of the beam portion 21A. That is, in the effective bending area Ae, the cross-sectional area S of the beam portion 21A is S0, S1, S2, ... Sx ... Sm from the placement area A0 of the pressing block 24 toward the support area A1 of the support column 21B. It is formed in a shape that decreases smoothly (S0> S1> S2>... Sx...> Sm).

  Further, a through hole 29 is formed in the effective bending area Ae in the Z direction in which the pressing block 24 moves forward and backward. The through hole 29 has a triangular shape in plan view, and has a shape in which the width W in plan view increases smoothly as W1, W2, Wx,... Wm from the placement region A0 toward the support region A1. (W1 <W2 <... Wx ... <Wm).

  Due to these synergistic effects, the cross-sectional area Sx at the specific position X of the effective bending area Ae is formed smaller than the cross-sectional area S0 in the placement area A0 of the pressing block 24 of the beam portion 21A.

  In this embodiment, the spring 31 for clamping the substrate 5 which is the molded product of the resin-sealed mold K1 is disposed in the through hole 29 by utilizing the presence of the through hole 29. Has been.

  Next, the displacement detection system of the pressing block 24 in this embodiment will be described with reference to FIG.

  A displacement detection strain gauge 45 is affixed to a position where the bending is estimated to be the largest in the effective bending area Ae in the beam portion 21A. In the present embodiment, the displacement detection strain gauge 50 is affixed to the upper surface side of the beam portion 21A. However, the displacement detection strain gauge 50 is not limited to this location. Since the displacement within the resin 32 is necessarily generated when the resin in the resin 32 is compressed, it can be used at any location. Further, in this embodiment, in addition to the displacement detection strain gauge 45, a temperature compensation strain gauge 47 is affixed on the support column 21B where no distortion occurs during compression, and an error due to a temperature change of each displacement detection strain gauge 45 is detected. Correction is made to improve detection accuracy. Of course, if a plurality of displacement detection strain gauges 45 and temperature compensation strain gauges 47 are affixed to different locations to complement each other's detection values, more accurate detection is possible.

  Since the displacement detection strain gauge 45 and the temperature compensation strain gauge 47 change their own resistance values due to the occurrence of strain, a Wheatstone bridge circuit 60 is connected to extract the changed resistance values as voltage changes. ing. The Wheatstone bridge circuit 60 is connected to the calculation unit 80 and the control unit 90 via an amplifier 70 for amplifying the output signal.

  The computing unit 80 can convert the electrical signal output from the Wheatstone bridge circuit 60 into a displacement amount (amount of deflection of the beam portion 21A: a displacement amount of the pressing block 24 relative to the lower die set 40). . For example, an output value with respect to a known displacement amount (an output value from the Wheatstone circuit 60) is stored in advance as known information, and the displacement amount can be calculated by comparing with the stored information. Further, if it is made to correspond to a known pressure (pressure generated in the cavity 32 = pressure generated on the pressing surface 24A of the pressing block 24), management based on an allowable pressure base for each product can be performed.

  In the present embodiment, the pressure (on the pressing block 24) is determined from the secondary moment of inertia due to the cross-sectional shape of the beam portion 21A of the elastic support mechanism 21, the longitudinal elastic modulus that is the material characteristic of the elastic support mechanism 21, and the length of the beam portion 21A. The beam portion 21A is designed so that the beam portion 21A has a deflection amount of 0.2 mm with respect to an applied sealing reaction force of 10 MPa.

  The control unit 90 can set and store an allowable range of the above-described displacement amount and pressure in advance, and if the calculation result by the calculation unit 80 exceeds the allowable range, a predetermined process is performed. (For example, the forward / backward movement of the lower mold 20 can be stopped, the warning lamp can be turned on, or a warning sound can be generated).

  Next, the operation of the resin sealing device K1 will be described.

  A substrate (molded product) 5 to be sealed with resin is supplied to the upper mold 10 by a supply mechanism (not shown), and is sucked and held by the upper mold 10. On the other hand, resin as a sealing material (compressed material) is supplied to the lower mold 20 side by a supply mechanism (not shown). The resin supplied here may be a molten resin (liquid resin) that has already melted at the time of supply, or a resin that is not yet melted, such as a chip, powder, granule, or plate. It may be. If it is not yet melted at the time of supply, it is melted by the heater.

  Thereafter, a press mechanism (not shown) is operated so that the frame-shaped block 23 comes into contact with the upper mold 10. Even after the frame-shaped block 23 comes into contact with the upper mold 10, a pressing mechanism (not shown) further operates, so that the pressing block 24 moves the inside of the through hole 23 </ b> A of the frame-shaped block 23 toward the upper mold 10. Go ahead. By this operation, the charged resin seals the semiconductor chip while compressing it. When the set load of the press mechanism (for example, detected by a load cell disposed between the press mechanism and the lower die set 40) is reached, the press mechanism is stopped.

  On the other hand, in the resin sealing device K1, resin sealing (compression molding) is simultaneously performed in the plurality of cavities 32 by the plurality of pressing blocks 24 by one press operation. Therefore, there is a possibility that a sealing pressure difference may occur on the pressing surface 24A of each pressing block 24 depending on the amount of resin put into each cavity 32 and the volume of the molded product itself supplied to each cavity 32. That is, for example, when the amount of resin put into one cavity is larger than that of the other cavities 32, or when the volume of the molded product itself placed in one cavity 32 is large, the same is true. Even when compression molding is performed by the pushing-up force, the pressure of the other cavities 32 is relatively lower than that of the one cavity 32. As a result, since the desired pressure is not reached, molding defects such as voids remain.

  However, in the resin sealing device K <b> 1 in the present embodiment, each pressing block 24 is supported by the central portion of each beam portion 21 </ b> A of the elastic support mechanism 21. When a force is applied, the beam portions 21 </ b> A bend, thereby reducing the pressure difference in each cavity 32.

  For example, in the present embodiment, it is assumed that the specific gravity of the resin to be input is 2, the accuracy of the resin amount to be input to each cavity 32 is about ± 50 mg, and the size of the cavity 32 is 40 mm × 60 mm by the above-described setting regarding the conversion parameter. Then, the sealing portion thickness error based on the resin amount error is about ± 0.01 mm. Even when the thickness of the 0.01 mm sealing portion changes, the sealing pressure applied to the pressing surface 24A of the pressing block 24 increases only by about 0.5 MPa in addition to the original sealing pressure. If the sealing pressure changes to this extent, there will be no molding failure.

  Of course, the above numerical values are merely examples, and are not limited to the numerical values, and can be appropriately changed depending on the type and material of the molded product to be sealed, and the type of resin as the sealing material. It is. However, it is preferable to set the material and shape of the beam portion so as to exhibit a bending characteristic of 10 MPa / mm or more and 100 MPa / mm or less in order to exhibit specifically good pressure equalization.

  Here, FIG. 4 shows stress characteristics at each position from the support region A1 to the placement region A0 of the beam portion 21A. As is clear from FIG. 4, the stress is 0 because there is no deflection in the support region A1, but in this embodiment, the height H of the beam portion 21A is reduced closer to the support region A1 (H0 → H1). In addition, since the width W of the through hole 29 in plan view is increased (0 → Wm), the bending rigidity is lower as it is closer to the support region A1. Therefore, as shown in FIG. 4, the stress characteristic becomes a smooth convex shape on the column portion 21B side of the effective bending area Ae, and again as it goes from the end X1 of the mounting area A0 toward the center X0 of the mounting area A0. It exhibits an increasing characteristic. Therefore, for example, compared with the case where a beam portion having an equal cross-sectional area is formed using the same amount of material, the stress in the placement area A0 can be reduced, and the beam portion 21A near the placement area A0 can be reduced. Since the bending curvature is increased and the contact property between the beam portion 21A and the pressing block 24 in the placement region A0 is improved, the pressing block 24 is more stable (without causing twisting or the like due to inclination). Can be displaced within the through-hole 23A of the frame-shaped block 23.

  Further, in the present embodiment, a position displacement strain gauge 45 is attached to the beam portion 21A, and the displacement amount of the pressing block 24 is detected from the degree of bending (bending) of the beam portion 21A. Therefore, in the unlikely event that there is a pressure difference that cannot be resolved by the elastic support mechanism 21, or that the elastic support mechanism 21 itself has some abnormality (for example, the beam 21A itself is subjected to a load exceeding the yield point). The press mechanism is immediately stopped even in the event of an abnormal situation such as bending of the frame block 23 or excessive sliding resistance of the pressing block 24 with respect to the frame-like block 23 and the inability to generate the original sealing pressure. It is possible to make it. As a result, defective products are not continuously produced.

  Since the upper mold 10 and the lower mold 20 are equipped with heaters 30H and 40H and are in an environment where temperature changes can occur, temperature compensation is performed to detect an accurate displacement value. Is required. In this embodiment, the temperature compensation strain gauge 47 is affixed on the support column 21B that is not distorted by the displacement of the pressing block 24, so that the accuracy of the detection result of the position displacement strain gauge 45 can be further improved. It is.

  In addition, as a secondary effect, it is possible to detect an abnormality in the load cell arranged separately. That is, it is possible to detect a load cell abnormality by associating the detection result of the load cell with the detection result of the detection means in a normal state.

  Even if the strain cage 47 for temperature compensation is omitted, the displacement can be detected. Even if the affixing position is not necessarily on the support column 21B, other distortion-free positions (for example, the position on the opposite side of the mounting area of the pressing block 24 in the beam 21A) and the measured value of the position displacement strain gauge 45 are used. Even if it is attached to a position where the degree of relative distortion can be estimated based on the above, similar compensation can be performed, and detection accuracy can be increased accordingly.

  Various variations are conceivable for the specific shape of the beam portion according to the present invention. 5 and 6 show several examples of the cross-sectional shape of the beam portion.

  In the previous embodiment, the height (thickness) H of the beam portion 21A is gradually reduced from the placement region A0 to the support region A1, and the width W in plan view of the through hole 29 is increased. For example, the same effect can be obtained even if the height of the beam portion 51A is reduced stepwise as shown in FIG. The number of steps is preferably 2 or more, but a corresponding effect can be obtained with only one step. As shown in FIG. 5A, when a plurality of stairs 51A1 to 51A3 are provided, the heights H2 to H4 of the stairs are made smaller as they approach the support area A1 of the support column 51B (H2 > H3> H4), the stress distribution can be shifted to the support column side more effectively. In the case of the example in FIG. 5A, the beam portion 51A as a whole may be formed as a single member with all the steps 51A0 to 51A3 as one body, or may be formed by laminating different members. May be. The material may be changed when it is constituted by another member.

  Even in the case where the through hole is formed, in the above-described embodiment, the single through hole 29 is formed, and the width W in plan view is set so as to increase toward the support region A1. However, for example, as shown in FIG. 5B, a through hole may not be formed, and a recess 52A2 may be formed on the upper surface or the lower surface of the beam portion 52A (the upper surface 52A1 in the illustrated example). Also in this case, the size or depth D of the recess 52A2 can be formed larger as it approaches the support region A1 of the support column 52B (D1 <D2 <... <Dm).

  Furthermore, as shown in FIG. 5C, strip-shaped recesses (constrictions) 53A1, 53A2,... 53Am may be formed over the entire circumference of the beam portion 53A. Although the number of formation is preferably plural, only one may be formed. Also in this case, the formation interval may be made narrower as it approaches the support region A1 of the column portion 53B. Or it is good also as a structure which enlarges the magnitude | size (depth) of recessed part 53A1, 53A2, ... 53Am as it approaches support area | region A1.

  Further, in the case where the size of the through hole or the recess is formed larger in plan view as it approaches the support region, in addition to the method of increasing the width of the single through hole or recess in plan view, for example, FIG. As shown in FIG. 5, a configuration may be adopted in which a large number of small-diameter circular through holes (or circular recesses) 54A1 are formed in the beam portion 54A. Also in this case, the number (or depth) of the formation may be increased (or deeper) as the support region A1 of the column portion 54B is approached. In the configuration of FIG. 6, if necessary, large-diameter through-holes 54A2 in which the springs 31 for clamping the product to be molded are arranged can be appropriately arranged as in the previous embodiment. The circular through hole 54A1 (or 54A2) is excellent in that it can be easily manufactured (formed) and the stress dispersion effect can be adjusted by setting the diameter, the number of formations, and the formation position.

  Although the through hole is formed in the vertical direction of the beam portion in the above example, the same effect can be obtained even if it is formed in the horizontal direction of the beam portion.

  In any of these configurations, a bending rigidity reducing portion that promotes bending of the beam portion is formed between the placement region of the pressing block of the beam portion and the support region of the support column (effective bending region). Can be considered.

  Since other configurations are the same as those in the previous embodiment, a duplicate description is omitted.

  For example, it is suitable as a compression mold for a resin sealing device in which a molded product having a plurality of semiconductor chips mounted on one substrate or lead frame is compression-molded at a time by one press mechanism.

It is a figure which shows the structure of the resin sealing metal mold | die which shows an example of embodiment of this invention, Comprising: (A) is a front view, (B) is a side view. FIG. 2 shows a partial enlargement of the portion II shown in FIG. 1, where (A) is a plan view and (B) a front view. Block diagram showing the configuration of the position displacement detection means Graph showing stress change characteristics of beam Front view corresponding to FIG. 2 (B) showing an example of another embodiment of the present invention The top view equivalent to FIG. 2 (A) which shows the example of other embodiment of this invention

Explanation of symbols

5 ... Substrate 10 ... Upper mold (first mold)
20 ... Lower mold (second mold)
DESCRIPTION OF SYMBOLS 21 ... Elastic support mechanism 21A ... Beam part 21B ... Strut part 21C ... Space | gap part 23 ... Frame-shaped block 23A ... Through-hole 24 ... Press block 24A ... Press surface 29 ... Through-hole 30 ... Upper die set 31 ... Spring 32 ... Cavity 40 ... Lower die set (base member)
45 ... Position displacement strain gauge 47 ... Temperature compensation strain gauge 60 ... Wheatstone bridge circuit 80 ... Calculation unit 90 ... Control unit A0 ... Mounting area A1 ... Support area Ae ... Effective bending area

Claims (11)

A first mold;
A compression mold comprising: a second mold disposed opposite to the first mold and capable of forming a plurality of cavities with the first mold;
A plurality of pressing blocks which are provided in the second mold, respectively constitute a part of the plurality of cavities, and which are arranged so as to be movable back and forth with respect to the first mold;
A base member capable of moving the plurality of pressing blocks forward and backward simultaneously with respect to the first mold;
A pair of struts erected on the base member; and a beam portion that is both supported by the pair of struts and on which the pressing block is placed; and the pressing block and the base member An elastic support mechanism that interlinks each of the pressing blocks with the base member so as to be independently displaceable.
And a cross-sectional area at a specific position between the mounting area of the pressing block and the support area of the support column with respect to the cross-sectional area of the beam section in the area where the pressing block is mounted. A compression mold characterized in that is formed smaller. In claim 1,
The compression molding die, wherein the beam portion is formed in a shape in which a cross-sectional area is further reduced from a placement region of the pressing block toward a support region in the support column. In claim 1 or 2,
The said beam part is equipped with a through-hole between the said mounting area | region and a support area | region. The compression molding die characterized by the above-mentioned. In claim 3,
The compression molding die, wherein the through hole is formed in a shape in which a width of the through surface increases as it goes from a region where the pressing block is placed to a support region of the support column. In claim 3,
The said through-hole is comprised with the some circular through-hole. The compression molding die characterized by the above-mentioned. In any one of Claims 3-5,
A spring for clamping the molded product of the compression molding die is disposed in the through hole. A first mold;
A compression mold comprising: a second mold disposed opposite to the first mold and capable of forming a plurality of cavities with the first mold;
A plurality of pressing blocks which are provided in the second mold, respectively constitute a part of the plurality of cavities, and which are arranged so as to be movable back and forth with respect to the first mold;
A base member capable of moving the plurality of pressing blocks forward and backward simultaneously with respect to the first mold;
A pair of struts erected on the base member; and a beam portion that is both supported by the pair of struts and on which the pressing block is placed; and the pressing block and the base member An elastic support mechanism that interlinks each of the pressing blocks with the base member so as to be independently displaceable.
And a bending rigidity reducing portion for promoting the bending of the beam portion is formed between the mounting region of the pressing block and the support region of the support column portion of the beam portion. Compression mold to be used. In claim 7,
The compression molding die, wherein the bending rigidity reducing portion includes a recess formed on a surface of the beam portion. In claim 8,
The compression molding die, wherein the concave portion is formed in a shape that increases in depth or size from the region where the pressing block is placed toward the support region of the support column. In claim 8 or 9,
A compression molding die, wherein a plurality of the recesses are formed, and the formation interval is narrowed from the placement area of the pressing block toward the support area of the support column. For the compression mold according to any one of claims 1 to 10,
A compression mold apparatus comprising a detecting means capable of detecting the displacement of the pressing block with respect to the base member.

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