200906589 九、發明說明 【發明所屬之技術領域】 本發明是關於壓縮成型模具，更詳細而言是關於可有 效防止複數個模腔的壓縮壓力不均一的壓縮成型模具及利 用該壓縮成型模具的壓縮成型模具裝置。 【先前技術】 以往，如專利文獻1所記載，在可合倂上模具與下模 具的複數個模腔內，載放複數個搭載在基板或導板的半導 體晶片等的安裝材，同時對於各模腔內投入熱硬化性樹脂 等的密封材料，賦予各模腔內壓力，藉壓縮成型進行樹脂 密封的樹脂密封模具（壓縮成型模具）爲人所熟知。 如上述，藉一次的壓縮步驟同時進行複數個密封時， (例如即使對於各模腔內投入樹脂賦予均等的密封壓力時 )在各模腔間實際產生的密封壓力會產生不可避免的「不 均一」。這是因爲投入各模腔內的樹脂（成型材料）的量 的不均一，或者由於被成型品（或被成型部）本身體積的 不均一等，導致壓縮開始時各模腔的密封空間（被成型品 的體積+投入樹脂的體積）大小變化的原因。 解決以上的方法有在上述日本專利文獻1中’揭示以 可自由流動的流路（runner )連結投入複數個模腔間的樹 脂，藉以使得各模腔間的密封壓力的構成（段落00 1 0 ) 。並且，同公報中，同時揭示使賦予各模腔壓力的模腔塊 (推壓塊）分別獨立，並以獨立的螺旋彈簧支撑各模腔塊 -4- 200906589 ，藉此抑制賦予各模腔塊的密封壓力不均一的構成（專利 文獻1、段落0011)。 〔專利文獻1〕 日本特開2 0 0 3 - 1 3 3 3 5 0號公報 〔專利文獻2〕 日本特開平9- 1 8783 1號公報 【發明內容】 〔發明所欲解決之課題〕 但是’以可流動樹脂的流路（r u η n e r )連結上述各模 腔間的樹脂密封裝置的場合，多是在配置於基板或導架的 半導體晶片等的複數安裝材之間設有縫隙，會有不容易設 定流路的場合。另外，該縫隙是以各成型塊等收縮對應力 的緩和爲主目的，對此的連結會有因爲基板或導架等被成 型品整體扭曲之虞。 又，壓縮成型原來的優點可舉例如抑制投入模腔內的 樹脂的流動，使得對被成型品的內部構造（接合線等）的 影響爲最小限，但是設置流路反而導致樹脂的流動，而有 對於該等內部構造產生不良影響（例如，接合線的斷裂、 短路等）之虞。除此之外，會因爲樹脂的黏度，致通過連 結的流路時的壓力損失而在模腔間殘留超過容許範圍的壓 力差。 並且，分別以螺旋彈簧支撐賦予各模腔壓利用的獨立 的模腔塊（推壓塊）的樹脂密封裝置中，使壓縮模具分別 上下進退移動可以吸收各模腔間的密封壓力。但是，爲了 維持樹脂密封後成型品的厚度精度’在推壓塊的推壓面（ -5- 200906589 模腔面）的無傾斜狀態（平坦狀態）下，使該推壓塊上下 困難’而需要另外的引導構造。另外，推壓塊的推壓面的 面積在形成某一程度面變大時’丨個螺旋彈簧不足以應付 其負擔’而有必須要複數個螺旋彈簧的場合。在以上的場 合’精度良好地確實使各彈簧的負載、彈簧常數一致，即 使是1個推壓塊即有其困難，更何況複數個推壓塊的存在 更顯得極爲困難。 此外’專利文獻2所記載的每1個半導體晶片在進行 樹脂密封的場合’爲了樹脂密封1片的基板或導板必須要 實施複數次的壓縮成型，生產效率差。 申請人已提案有解決該等問題點的發明（日本特願 2005-353916號（台灣的096118841號申請案））。在此 ’將各複數個壓縮模具以所謂的「樑」加以支撐，緩和各 壓縮模具間的密封壓力差的同時，可精度良好地支撐壓縮 模具。根據此一提案後的發明雖然可大爲降低密封異常的 發生，但是時而會有超過假設範圍的異常事態的發生。亦 即，根據利用樑的彈性機構，可以消除產生在各模腔間的 密封壓力差之物也會產生即使利用該彈性機構仍有不能消 除程度的壓力差，或該彈性機構產生某種的異常（例如， 對於樑施加超過降伏點的負載使得樑本身彎曲等），對於 框型模具的壓縮模具的滑動阻力形成過大而有不能因應原 本不會產生密封壓力等的異常事態。 本發明是爲了解決以上問題點所硏創而成’可一次在 複數個模腔內持續進行壓縮成型，將各模腔間產生的密封 -6- 200906589 壓力的不均一以簡易的構成精度良好地加以抑制爲目的， 除此之外以改良上述所提案的發明而附加簡易構成的高精 度的失效保險機構，早期的異常檢測及防止不良品的連續 生產爲其課題。 〔解決課題的手段〕 本發明，具備：第1模具，及與該第1模具相對配置 ，在與上述第1模具之間可形成複數個模腔的第2模具所 成的壓縮成型模具，具有：上述第2模具所具備分別構成 上述複數個模腔一部份的同時，相對於上述第1模具可自 由進退移動配置的複數個推壓塊；使該複數個推壓塊同時 相對於上述第1模具可自由進退移動的基礎構件；豎立設 置在該基礎構件的一對支柱部；及藉著該一對支柱部所雙 臂支撐的同時，載放上述推壓塊的樑部，具備間隔在上述 推壓塊與上述基礎構件之間，使各推壓塊相對於上述基礎 構件分別獨立而可位移地連結的彈性支撐機構，並且上述 樑部的相對於上述推壓塊所載放區域的剖面積，上述推壓 塊的載放區域與上述支撐部的支撐區域之間特定位置的剖 面積側，採用形成較小的構成，藉以解決上述課題。 藉此，藉著樑部的撓曲吸收各模腔間的密封壓力差， 即賦予推壓塊的壓縮力的不均一，可以大致均一的密封壓 力形成密封。 又，基本構造由於是「樑構造」，因此樑的原料、剖 面積'支撐方法、形狀、形狀的變化樣態（尤其是隨著推 -7- 200906589 壓塊的載放區域隨著朝支撐部的支撐區域的變化形狀的變 化樣態）或者適當設定從推壓塊的載放區域到支柱部的支 撐區域爲止的距離等’可以非常高的設計自由度高精度地 控制各推壓塊載放區域的撓曲特性（換言之，對於各模腔 內的成型原料壓縮力的賦予特性）。 本發明中，尤其著重於該點，相對於樑部的上述推壓 塊所載放區域的剖面積，使上述推壓塊的載放區域與上述 支柱部的支撐區域之間的特定位置的剖面積一側，由於形 成極小，因此積極地使樑部中央附近以外的部分撓曲，可 藉此分散載放區域產生的應力。其結果，不僅可容易形成 樑部構造的相關設計，良好維持推壓塊與樑部的抵接性， 使該推壓塊可（一邊抑制傾斜）順利地位移。 再者’本發明基礎構件的槪念雖是與所謂基礎構件主 體形成另體構件’但是同時包含與基礎主體一體移動的構 件（例如板構件）。 本發明可考慮種種的變化。 例如，上述樑部隨著從上述推壓塊的載放區域朝著上 述支柱部的支撐區域，形成其剖面積更爲減少的形狀的場 合，可順利地將應力分散到樑部的中央部以外。 又，在樑部的上述載放區域與支撐區域之間具備貫穿 孔時，也可以實現本發明的目的。 此時，將該貫穿孔隨著從上述推壓塊的載放區域朝向 支柱部的支撐區域，形成其貫穿面的寬度增大的形狀時， 可將應力的集中順利地移動•分散到支撐區域側。 • 8 - 200906589 另外’在該貫穿孔內配置夾持該壓縮成型模具的被成 型品用的彈簧時，可獲得有效利用空間的小巧型壓縮成型 模具。 本發明依其主旨’具備第1模具，及與該第1模具相 對配置’在與上述第1模具之間可形成複數個模腔的第2 模具而成的壓縮成型模具，具備在上述第2模具，分別構 成上述複數個模腔一部份的同時，具有相對於上述第1模 具可自由進退移動配置的複數個推壓塊；使該等複數個推 壓塊同時可相對於上述第1模具進退移動的基礎構件；豎 立設置在該基礎構件的一對支柱部；及藉著該一對支柱部 雙臂支撐的同時載放有上述推壓塊的樑部，藉著間隔在上 述推壓塊與上述基礎構件之間，連結使各推壓塊可相對於 上述基礎構件分別獨立位移的彈性支撐機構，並且，在上 述樑部的上述推壓塊的載放區域與上述支柱部的支撐區域 之間，也可以獲得形成促進該樑部撓曲的抗彎剛度降低部 的發明。 抗彎剛度降低部的代表性構成，例如可考慮在樑部的 表面形成凹部的構成。 該凹部隨著從推壓塊的載放區域朝向上述支柱部的支 撐區域，形成其深度或平面方向的寬度增大的形狀時’同 樣可順利地將應力分散到中央部以外。 凹部的形狀只要可降低抗彎剛度’尤其不加以限定’ 例如除了形成在樑的底面與上面的凹部之外，也可以包含 在樑的外圍形成1周的所謂「縮頸」的範疇的凹部。 -9- 200906589 此時，複數形成該等凹部’且隨著從推壓塊所載放的 區域隨著朝向上述支柱部的支撐區域’形成其形成間隔狹 窄時，可同樣地進行順利的應力分散。 再者，本發明中，由於將樑的變形（撓曲）積極利用 在模腔內成型材料的壓縮應力的控制，因此例如附設可檢 測相對於推壓塊的上述基礎構件的上述位移的檢測手段’ 藉此可定量獲取樑的位移，即成型材料的壓縮應力’可發 展出良好地實現壓縮步驟的自動管理或者問題發生時自動 檢測的壓縮成型模具裝置。 根據以上構成的採用，在每壓縮模具上，可早期且確 實地檢測出超過容許範圍的場合或彈性機構本體的異常、 相對於框型模具的壓縮模具的滑動阻力的增大等的異常。 例如，上述檢測手段檢測的上述位移量超出預定範圍的場 合，只要停止上述進退移動的同時進行預定的告知處理， 即可防止不良品的連續生產。 具體而言，上述檢測手段構成具有黏貼在上述樑部的 變形測量儀與連接在該變形測量儀的惠斯登電橋電路時， 即不需要所提案的模具設計的變更，即可構成檢測手段。 此時，在上述樑部複數黏貼上述變形測量儀，將其內 的一部份且至少1個構成藉著上述位移而根據不產生變形 的位置或其他變形測量儀的測定値黏貼在可推定變形程度 時’即可進行容易受溫度影響之變形測量儀的溫度修正， 期待精度的提昇。亦即，複數個變形測量儀中的部份變形 測量儀（從結果來看）僅使用在溫度變化的檢測之用時， -10 - 200906589 相對於檢測樑部變形（即位移量）的其他變形測量儀的檢 測結果可進行溫度修正。 又，以位置位移量構成上述檢測手段時，不須如變形 測量儀進行因黏貼位置不同所需的修正，容易獲得穩定的 檢測結果。 並且，上述檢測手段中，另外構成上述位移量可爲上 述壓縮模具的推壓力所運算時，可以壓縮模具的推壓力， 即各模腔產生的壓力基礎來管理異常檢測。 〔發明效果〕 根據本發明，可以抑制各模腔間產生壓力差的發生， 可以高設計自由度控制各樑部的撓曲，即模腔內成型材料 的壓縮壓力’同時可獲得萬一異常事態時所具備失能保險 的效果。 【實施方式】 以下’利用添附圖示針對本發明實施型態的一例詳細 說明。 第1圖爲運用本發明的樹脂密封模具（壓縮成型模具 )K1的構成圖’ （A )爲前視圖、（B )爲側視圖。 該樹脂密封模具K1具備上模具（第1模具）丨〇與下 模具（第2模具）20。上模具1 〇是以預定的時機吸附保 持者基板（被成型品）。再者，在此雖是以基板爲例加以 -說明’但是例如導板的場合也相同。基板5配置有未圖示 -11 - 200906589 的複數個半導體晶片（安裝材）。上模具1 〇是藉著位在 該上模具10上部的模具組30所支撐•固定。並且，在該 上部模具組3 0具備有加熱器3 0 Η溫度控制可維持預定的 溫度（例如1 7 5度）。 下模具20被配置與上模具1 0相對。下模具20在與 上模具1 〇之間可形成複數個模腔3 2，具備1個框型塊2 3 與複數個推壓塊24。 框型塊23經由未圖示的螺旋彈簧被支撐在下部模具 組（基礎構件）4 0上’可相對於下部模具組4 〇上下移動 。此外’第1圖的符號3 1是作爲夾持基板5之用的彈簧 (後述）。下部模具組4 0是以未圖示的沖壓機構等所支 撐’相對於上模具1 〇構成可以預定的時機開關下模具2 0 整體。亦即’複數個推壓塊2 4分別嵌合在設置於框型塊 23的複數個貫穿孔23Α，分別構成複數個模腔32 —部份 的同時’可相對於上模具10進退移動（在此爲上下移動 )。爲上模具10與下模具20(框型塊23與推壓塊24) 所包圍形成的複數個空間構成模腔3 2。 推壓塊24的下面是經由彈性支撐機構2 1連結在下部 模具組40上。 彈性支撐機構2 1爲豎立設置在下部模具組40的支柱 部2 1 Β與鉤掛以連結該支柱部2 1 Β樑部2 1 Α所構成。亦 即’樑部2 1 A的兩端部分別被雙臂支撐在支柱部2 ；[ b上 。推壓塊24被載放•固定在該雙臂支撐的樑部21A中央 的載放區域A0。樑部2 1 A的正下方存在有空隙部2 1 C。 -12 - 200906589 因此，樑部21 A容許撓曲，作爲彈性體的功能°樑部2 1 A 是以高精度加工的構件（例如鐵等）所構成。其結果，推 壓塊24可藉著該樑部21A使其底面整體在水平支撐的狀 態下於框型塊23內移動。因此，推壓塊24在框型塊23 內移動時，幾乎不會產生使推壓塊2 4傾斜的力矩（與框 型塊23呈交叉的力矩），因此無須特別設置確保推壓塊 24與框型塊23的順暢相對位移用的另外的引導機構。 本實施型態的彈性支撐機構2 1雖是完全地獨立構成 樑部2 1 A與支柱部2 1 B，但是也可以例如其他的一體形成 各支柱部2 1 B，或僅是樑部2 1 A獨立。以上構成的結果， 在樑部2 1 A的正下方產生空隙部2 1 C，根據該空隙部2 1 C 的存在容許樑部2 1 A的撓曲，構成具有作爲彈性機構2 1 的功能。亦即，只要可以使對應各推壓塊24的樑部2 1A 獨立地撓曲’及可稱之爲「獨立的彈性支撐機構」。藉此 一構成’使得具有複數個推壓塊2 4中的1個推壓塊通過 樑部2 1 A ’不會受到其他推壓塊2 4所受的密封壓力的影 響。 另外’在上部模具組3 0、下部模具組40分別裝設有 加熱器3 0 Η、4 0 Η，可進行預定的模具溫度控制。 在此’參照第2圖針對樑部21 Α的形狀詳細說明如 下。 第2圖的（A )爲第1圖的箭頭方向π部分的擴大上 視圖’ （B )爲同—擴大前視圖。 該貫施形態中，推壓塊2 4的載放區域A 0被設定在 -13- 200906589 樑部2 1 A的中點X0。再者，推壓塊24具有預定的底面積 被載放•固定在樑部2 1 A，因此樑部2 1 A在該載放區域 A0內不會撓曲。因此，樑部2 1 A作爲彈性體具有實際功 能的「有效抗彎區域」是以推壓塊24的載放區域A0的 支柱部側端部X 1到支柱部2 1 B的支撐區域A 1的載放區 域側端部X2爲止的符號Ae表示的區域。本說明書及申 請專利範圍的「載放推壓塊（24 )的載放區域（A0 )與 支柱部（2 1A )的支撐區域（A1 )之間」是意味著該「有 效抗彎區域（Ae)」。並且，第2圖的（B)的符號L1 是相當於樑部2 1 A的跨距的1 /2。 如第2圖的（A ) ( B )表示，該實施型態中，樑部 2 1 A其有效抗彎區域A e的上面部2 1 A 1的大致整體僅傾 斜角度0。支撐區域A1的樑部21A的高度（厚度）Η1 則是低於（較薄於）樑部2 1 Α的載放區域A 0的高度（厚 度）H0。亦即，在有效抗彎區域Ae隨著推壓塊24的載 放區域A0朝向支柱部2 1 B的支撐區域A 1，使樑部2 1 A 的剖面積S是形成S 0、S 1、S 2、…S X…S m依序逐漸減少 的形狀（SO > S 1 > S2 > …Sx …> Sm )。 另外’有效抗彎區域Ae在推壓塊24進退移動的Z 方向形成有貫穿孔29。該貫穿孔29平面方向的形狀是形 成三角形，隨著從載放區域A0朝著支撐區域A1’其平面 方向的寬度W是形成W1、W2、Wx、··· Wm順利地增大 的形狀（W 1 < W2 <…Wx…< Wm )。 藉著該等的相乘效果，有效抗彎區域A e的特定位置 -14 - 200906589 X的剖面積S X形成小於樑部2 1 A的推壓塊2 4的載放區 A 0的剖面積S 0。 又，該實施型態中，利用貫穿孔2 9的存在，配置 將上述該等樹脂密封模具K1的被成型品的基板5夾持 該貫穿孔2 9內的上述彈簧3 1。 接著，使用第3圖，針對本實施型態的推壓塊24 位移檢測系說明如下。 在推定樑部2 1 A的有效抗彎區域A e中最大彎曲的 置上，黏貼位移檢測變形測量儀4 5。本實施型態中， 移檢測變形測量儀4 5雖是黏貼在樑部2 1 A的上面側， 是不限於此一場所，只要是在樑部2 1 A的有效抗彎區 A e內，由於模腔3 2內的樹脂被壓縮時一定會產生變形 因此任意的場合都無妨。並且，本實施型態中，除了位 檢測變形測量儀45之外，將溫度修正用變形測量儀47 貼在壓縮時不會產生變形的支柱部2 1 B上，修正各位移 測變形測量儀4 5的溫度變化造成的誤差，提升其檢測 度。當然’也可以將位移檢測變形測量儀4 5與溫度修 用變形測量儀4 7也複數黏貼在不同的位置，補齊彼此 檢測値即可進行高精度的檢測。 位移檢測變形測量儀4 5、溫度修正用變形測量儀 是根據變形的產生來變化本身的電阻値，因此連接有將 等變化的電阻値作爲電壓的變化而取出用的惠斯登電橋 路60。並且’惠斯登電橋電路60是經由放大其輸出訊 的放大器70與運算部80及控制部9〇連接。 域 有 在 的 位 位 但 域 移 黏 檢 精 正 的 47 該 電 號 -15- 200906589 運算部8 0可以將惠斯登電橋電路6 0所輸出 轉換成位移量（樑部21Α的撓曲量：相對於推壓 下部模具組40的位移量）。例如以相對於預先 量的輸出値（從惠斯登電橋電路60的輸出値） 資訊預先加以記億，與該記憶的資訊對比構成可 量。此外，只要對應已知的壓力（模腔3 2產生的 壓塊24的推壓面24 Α產生的壓力）時，即可進 成型品可容許的壓力基礎的管理。 本實施形態中，根據彈性支撐機構2 1的樑g 剖面形狀的二維力矩與彈性支撐機構21的材料 彈性係數及樑部2 1的長度，相對於壓力（施加 24的密封反作用力）1 〇 MP a，設計樑部2 1 A形f 撓曲量的樑部2 1 A。 控制部90可以預先設定記憶上述位移量與 許範圍，根據運算部8 0的運算結果超過該等容 I 場合，可進行預定的處理（例如，下模具20進 停止、警示燈的點亮或警示音的發出等）。 接著’說明該樹脂密封裝置K 1的作用。 根據未圖示的供給機構，對於上模具1 〇供 行樹脂密封的基板（被成型品）5，吸附保持在i 。另一方面在下模具2 0側，利用未圖示的供給 作爲密封材料（壓縮材料）的樹脂。在此所供給 可以是在所供給的時刻已熔融的熔融樹脂（液狀 或者也可以是未熔融的例如片狀、粉狀、粒狀、 的電訊號 塊24的 已知位移 作爲已知 運算位移 J壓力=推 行每一被 β 21A 的 特性的縱 在推壓塊 ^ 0.2mm 壓力的容 許範圍的 退移動的 給即將進 :模具10 機構供給 的樹脂也 樹脂）， 板狀等的 -16- 200906589 樹脂。如果在供給時刻爲未熔融的場合，可藉著加熱器予 以熔融。 隨後，未圖示的加壓機構動作將框型塊2 3抵接在上 模具1 0上。框型塊23在抵接上模具1 0之後，更藉著未 圖示的加壓機構的動作，使推壓塊24在框型塊23的貫穿 孔23 A內朝著上模具1 0側前進。藉此一動作，使得投入 的樹脂持續地壓縮半導體晶片形成密封。在到達加壓機構 的設定負載（例如藉著配置在該加壓機構與下部模具組 4 〇之間的負載感測器檢測）的時刻，停止該加壓機構。 另一方面，在該樹脂密封裝置K1中，以1次的加壓 動作’藉著複數個推壓塊24同時在複數個模腔32內進行 樹脂密封（壓縮成型）。因此，在各個推壓塊24的推壓 面24A上’根據投入各模腔32的樹脂量與供給各模腔32 的被成型品本身的體積可以產生密封壓力差。亦即，例如 投入1個模腔內的樹脂量較其他模腔3 2多的場合，即使 根據相同的上推力予以壓縮成型的場合，和1個模腔3 2 比較其他的模腔3 2的壓力形成相對較低。其結果，不能 達成期待的壓力，導致殘留空穴等的成型不良。 但是，本實施型態的樹脂密封裝置K 1中，各推壓塊 2 4被以彈性支撐機構2 1的各樑部2 1 A的中央部份所支撐 ’因此一旦密封反作用力施加在推壓塊24的推壓面24A 上時’操部21 A可分別藉著撓曲’緩和各模腔3 2內壓力 差的產生。 例如’本實施型態中’藉著變換參數有關的上述設定 -17- 200906589 ，假設投入的樹脂比重爲2、投入各模腔3 2的樹脂量的 精度爲±50mg程度、模腔32的大小爲40mmx60mm時， 根據上述樹脂量誤差的密封部的厚度誤差形成±0.0 1 mm程 度。即使0.0 1 mm密封部的厚度變化的場合，施加在推壓 塊2 4的推壓面2 4 A的密封壓力外加於原來的密封壓力， 僅增加0.5MPa程度。此一程度的密封壓力的變化不會導 致成型不良。 當然上述的數値是表示其一例，不僅限於該等數値， 可藉著密封時被成型品的種類或材質，尤其是密封材料的 樹脂的種類等適當變更。但是，具體而言在發揮良好均壓 性時，以設定樑部的材質及形狀使其形成1 OMPa/mm以上 、：1 Ο Ο Μ P a / m m以下的撓曲特性爲佳。 在此，第4圖是表示從樑部2 1A的支撐區域A1到載 放區域A0爲止各位置的應力特性。從第4圖可得知，在 支撐區域A1完全無撓曲，應力爲0，但是該實施型態中 ，越接近支撐區域A1樑部21A的高度Η越是降低（H0 — Η1)，並且由於貫穿孔29平面方向的寬度W的增大（0 -Wm )，越接近支撐區域 A1越是形成抗彎剛性的降低 。因此應力特性是如第4圖表示，在有效抗彎區域Ae的 支柱部2 1 B側形成平順的凸狀，呈現隨著從載放區域A 0 的端部XI朝向該載放區域AO的中央X0再度上升的特性 。因此，與例如使用相同量的材料形成等剖面積樑部的場 合比較，可減輕載放區域A 0的應力，同時可增大載放區 域A0附近的樑部2]A的撓曲曲率改善該載放區域A0的 -18 - 200906589 樑部2 1 A與推壓塊2 4的抵接性，因此在此一穩定的狀態 下（不會因傾斜而產生扭曲等）可以使該推壓塊24在框 型塊23的貫穿孔23A內位移。 此外，本實施型態中，樑部2 I A黏貼位置位移變形 測量儀4 5，從樑部2 1 A撓曲（彎曲）的程度檢測推壓塊 24的位移量。因此，萬一產生即使彈性支撐機構2 1仍不 能消除程度的壓力差，或該彈性支撐機構21發生異常（ 例如，對樑部2 1 A施加超過降伏點的負荷使得樑部2 1 A 本身彎曲等），或相對於框型塊23的推壓塊24的滑動阻 力過大而不能產生原來的密封壓力等異常事態發生的場合 ，仍可迅速停止加壓機構的動作。其結果，不致會連續生 產不良品。 再者，在上模具10及下模具20搭載加熱器30H、 4 0H ’由於是位在可產生溫度變化的環境下，爲了檢測正 確的位移値而必須進行溫度修正。本實施型態是將溫度修 正用變形測量儀47黏貼在即使根據推壓塊24的位移也不 致產生變形的支柱部21B上，因此可更爲提升位置位移變 形測量儀4 5的檢測結果的精度。 又’作爲次要的效果，也可以形成另外配置的上述負 載感測器的異常檢測。亦即，預先對應正常時負載感測器 的檢測結果與該檢測手段的檢測結果，可藉此檢測負載感 測器異常。 另外’省略溫度修正用的變形測量儀4 7仍可進行位 移的檢測。黏貼的位置不一定非在支柱部2 1 B上，也可以 -19- 200906589 黏貼在其他不產生變形的位置（例如’樑部2 1 A的推壓 塊2 4的載放區域相反側的位置）或可根據位置位移變形 測量儀4 5的測定値推定相對變形程度的位置’進行同樣 的修正，可提升該量的檢測精度。 針對本發明涉及樑部的具體形狀’考慮種種的變化。 第5圖、第6圖是表示樑部的剖面形狀的複數的例。 先前的實施型態中，雖是從載放區域A0跨支撐區域 A1緩緩降低樑部21A的高度（厚度）H的同時，增大貫 穿孔29平面方向的寬度W，但是以例如第5圖（A )表 示的階梯狀降低樑部51A的高度，仍然可獲得同樣的效 果。階梯的段數以2以上爲佳，但是僅1階梯仍可獲得適 合的效果。並且，如第5圖（A)表示，具備複數個階梯 51A1〜51A3時，隨著接近支柱部51B的支撐區域A1，構 成漸小的階梯的高度H2〜H4(H2>H3>H4) ’將應力分 散到更接近支柱部側，並可更爲有效地進行。以該第5圖 C (A)爲例的場合，整體的樑部51A可以全階梯51A0〜 5 1 A3爲一體物以一構件形成，也可以分別將其他構件層 疊形成。以其他構件構成時也可以改變其材料。 又，同樣在形成貫穿孔的場合，上述的實施型態中， 形成單一的貫穿孔29，同時設定使其平面方向的寬度w 隨著接近支撐區域A1而增大’但是例如第5圖的（B ) 表示，可以不形成貫穿孔而是在樑部52A的上面或下面 (圖示的例爲上面52A1)形成凹部52A2。此時，同樣隨 著接近支撐部52B的支撐區域A1形成凹部52A2的大小 -20- 200906589 更大或者深度D更深的構成（Dl<D2<〜<Dm)。 另外’也可以如第5圖（C )表示’跨樑部5 3 a的全 周圍形成帶狀的凹部（縮頸）53Ai、53A2、... 53Am。形 成數雖是以複數爲佳’但是也可以只有〗個。並且，此時 其形成間隔也可以構成隨著接近支柱部53b的支撐區域 A1而變窄。或者，也可以構成隨著接近支撐區域a]而增 大之凹部53A1、53A2、…53Am的大小（深度）。 又’貫穿孔與凹部的大小在平面方向，隨著接近支撐 區域而增大形成的場合，同樣除了增大單一貫穿孔或凹部 平面方向寬度的技巧之外’例如第6圖所示，也可以在棟 部54A多數形成小直徑的圓形貫穿孔（或者圓形凹部） 5 4 A 1的構成。此時同樣地’其形成數（或者深度）隨著 接近支柱部54B的支撐區域A1多數（或者深度）形成。 該第6圖的構成中’必要時也可以如先前的實施型態適當 並排設置有配置夾持被成型品用的彈簧31的大直徑貫穿 孔5 4 A 2。圓形貫穿孔5 4 A 1 (或者5 4 A 2 )在製造（形成 )上容易’藉著直徑、形成數及形成位置的設定可調整應 力分散效果的點極爲優異。 再者，貫穿孔在上述例中雖是形成在棵部的垂直方向 ，但是形成在樑部的水平方向，也可以獲得相同的效果。 該等的構成可視爲皆是於樑部的推壓塊的載放區域與 支柱部的支撐區域之間（有效抗彎區域），形成促進樑部 撓曲的抗彎剛性降低部。 另外，針對其他的構成由於和先前的實施型態相同而 -21 - 200906589 省略其重複說明。 〔產業上的可利用性〕 例如以1個基板或導架上搭載複數個半導體晶片的被 成型品，作爲藉1個加壓機構一次壓縮成型的樹脂密封裝 置的壓縮成型模具爲佳。 【圖式簡單說明】 第〗圖是表示本發實施型態之一例的樹脂密封模具的 構成圖，（A )爲前視圖、（B )爲側視圖。 第2圖是表示第1圖的箭頭方向Π部份的部份放大圖 ，（A )爲上視圖、（B )爲前視圖。 第3圖是表示位置位移檢測手段的構成方塊圖。 第4圖是表示樑部的應力變化特性的圖表。 第5圖是表示本發明其他實施型態之例的相當於第2 圖（B )的前視圖。 第6圖是表示本發明另一其他實施型態之例的相當於 第2圖（A )的上視圖。 【主要元件符號說明】 5 :基板 1 0 :上模具（第1模具） 2〇 :下模具（第2模具） 2 1 :彈性支撐基構 -22 - 200906589 2 1 A :樑部 2 1 B :支柱部 2 1 C :空隙部 2 3 :框型塊 2 3 A :貫穿孔 2 4 :推壓塊 2 4 A :推壓面 2 9 :貫穿孔 3 0 :上部模具組 3 1 :彈簧 3 2 :模腔 40 :下部模具組（基礎構件） 4 5 :位置位移變形測量儀 47 :溫度修正用變形測量儀 6 0 :惠斯登電橋電路 8 0 :運算部 9 0 :控制部 A 0 :載放區域 A1 :支撐區域 A e :有效抗彎區域 -23 -BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compression molding die, and more particularly to a compression molding die which can effectively prevent a plurality of cavity cavities from being uneven in compression pressure and compression using the compression molding die Molding device. [Prior Art] As described in Patent Document 1, a plurality of mounting materials such as semiconductor wafers mounted on a substrate or a guide are placed in a plurality of cavities of the upper and lower molds, and A resin sealing mold (compression molding die) in which a sealing material such as a thermosetting resin is introduced into a cavity and pressure is applied to each cavity, and resin sealing is performed by compression molding is known. As described above, when a plurality of seals are simultaneously performed by one compression step (for example, even when an equal sealing pressure is applied to the resin in each cavity), the sealing pressure actually generated between the cavities may inevitably become "uneven". "." This is because the amount of resin (molding material) to be injected into each cavity is not uniform, or the volume of the molded product (or the molded portion) itself is not uniform, resulting in a sealed space of each cavity at the start of compression. The reason why the size of the molded product + the volume of the input resin) changes. The above method is disclosed in the above-mentioned Japanese Patent Laid-Open Publication No. Hei- No.-- discloses a resin which is connected to a plurality of cavities by a freely flowable flow, so that the sealing pressure between the cavities is constituted (paragraph 00 1 0 ). Moreover, in the same publication, it is also disclosed that the cavity blocks (pushing blocks) for imparting pressure to the respective cavities are independent, and each cavity block is supported by a separate coil spring-4-200906589, thereby suppressing the imparting of each cavity block. The sealing pressure is not uniform (Patent Document 1, paragraph 0011). [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei 9- 1 8783 No. When the resin sealing device between the cavities is connected by a flow path of a flowable resin, a gap is formed between a plurality of mounting materials such as a semiconductor wafer disposed on a substrate or a guide. It is not easy to set the flow path. Further, the slit is mainly for the purpose of mitigating the stress by shrinkage of each molding block or the like, and the connection is caused by the distortion of the entire molded article such as the substrate or the guide. Further, the original advantage of compression molding is, for example, to suppress the flow of the resin introduced into the cavity, so that the influence on the internal structure (bonding wire or the like) of the molded article is minimized, but the flow path is reversed to cause the resin to flow. There are defects that adversely affect such internal structures (for example, breakage of a bonding wire, short circuit, etc.). In addition, due to the viscosity of the resin, a pressure difference exceeding the allowable range remains between the cavities due to pressure loss during the connected flow path. Further, in the resin sealing device which supports the individual cavity blocks (pushing blocks) for applying the respective cavity pressures by the coil springs, the compression molds are moved up and down respectively to absorb the sealing pressure between the respective cavities. However, in order to maintain the thickness accuracy of the molded article after resin sealing, it is necessary to make the pressing block difficult to perform in the non-tilted state (flat state) of the pressing surface of the pressing block (-5-200906589 cavity surface). Additional guiding structure. Further, when the area of the pressing surface of the pressing block is increased to a certain extent, "the coil spring is insufficient to cope with the burden", and it is necessary to have a plurality of coil springs. In the above-mentioned field, the load and the spring constant of each spring are surely matched with each other accurately, and even if it is one pressing block, it is difficult, and the presence of a plurality of pressing blocks is extremely difficult. Further, in the case where the resin wafer is sealed for each semiconductor wafer described in Patent Document 2, it is necessary to perform compression molding for a plurality of substrates or guide sheets for resin sealing, and the production efficiency is poor. The applicant has proposed an invention for solving such problems (Japanese Patent Application No. 2005-353916 (Application No. 096118841 in Taiwan)). Here, each of the plurality of compression dies is supported by a so-called "beam", and the pressure difference between the compression dies is relaxed, and the compression dies can be accurately supported. According to the invention after the proposal, the occurrence of the sealing abnormality can be greatly reduced, but sometimes an abnormal situation exceeding the assumed range occurs. That is, according to the elastic mechanism using the beam, it is possible to eliminate the difference in the sealing pressure generated between the cavities, and the pressure difference which cannot be eliminated even by the elastic mechanism, or the elastic mechanism generates some abnormality. (For example, if the load applied to the beam beyond the point of the bend causes the beam itself to bend, etc.), the sliding resistance of the compression mold of the frame mold is excessively large, and there is an abnormal situation in which the sealing pressure or the like is not originally generated. The present invention has been made in order to solve the above problems. The compression molding can be continuously performed in a plurality of cavities at a time, and the pressure of the seal -6-200906589 generated between the cavities can be accurately formed with a simple configuration. In addition to the purpose of suppressing the above-mentioned proposed invention, a highly accurate fail-safe mechanism having a simple configuration is provided, and early abnormality detection and continuous production of defective products are a problem. [Means for Solving the Problem] The present invention includes: a first mold, and a compression molding die formed by a second mold that is disposed to face the first mold and has a plurality of cavities formed between the first mold and the first mold; The second mold includes a plurality of pressing blocks that are configured to be movable forward and backward with respect to the first mold while forming a part of the plurality of mold cavities; and the plurality of pressing blocks are simultaneously opposed to the first a mold member that is free to move forward and backward; a pair of pillar portions that are erected on the base member; and a beam portion that is supported by the pair of pillar portions and that carries the pusher block, and is spaced apart An elastic supporting mechanism that is independent and displaceably coupled to each of the pressing blocks and the base member, and the section of the beam portion with respect to the loading area of the pressing block The area is such that the cross-sectional area side of the specific position between the placement area of the pressing block and the support area of the support portion is formed to be small, thereby solving the above problems. Thereby, the sealing pressure difference between the cavities is absorbed by the deflection of the beam portion, that is, the compression force of the pressing block is uneven, and the sealing can be formed by a substantially uniform sealing pressure. In addition, since the basic structure is a "beam structure", the material of the beam, the cross-sectional area 'support method, the shape, and the shape change shape (especially with the push--7-200906589 load block area along the support portion) The change shape of the support region is changed, or the distance from the placement area of the push block to the support area of the support portion is appropriately set, and the push block can be accurately controlled with a high degree of design freedom. The flexural characteristics of the region (in other words, the imparting characteristics of the compressive force of the molding material in each cavity). In the present invention, in particular, in this point, a section of a specific position between the placement region of the pressing block and the support region of the pillar portion is formed with respect to the sectional area of the pressing portion of the beam portion in the beam portion. On the side of the area, since the formation is extremely small, the portion other than the vicinity of the center of the beam portion is actively deflected, whereby the stress generated in the placement region can be dispersed. As a result, not only the design of the beam structure can be easily formed, but also the contact between the pressing block and the beam portion can be favorably maintained, and the pressing block can be smoothly displaced (with the inclination being suppressed). Further, the nucleus of the base member of the present invention is a member which forms a separate member with the so-called base member main body but includes a member (e.g., a plate member) that moves integrally with the base body. Various variations of the invention are contemplated. For example, when the beam portion is formed in a shape in which the cross-sectional area is further reduced from the mounting region of the pressing block toward the supporting region of the pillar portion, the stress can be smoothly distributed outside the center portion of the beam portion. . Further, the object of the present invention can also be achieved when a through hole is provided between the above-mentioned placement area and the support area of the beam portion. At this time, when the through hole is formed in a shape in which the width of the penetration surface increases from the placement region of the pressing block toward the support region of the pillar portion, the concentration of stress can be smoothly moved and dispersed to the support region. side. • 8 - 200906589 In addition, when a spring for holding a molded product of the compression molding die is placed in the through hole, a compact compression molding die that can effectively utilize the space can be obtained. According to the present invention, a first compression mold having a first mold and a second mold capable of forming a plurality of cavities between the first mold and the first mold is provided, and the second mold is provided. a mold having a plurality of pressing blocks arranged to move forward and backward relative to the first mold while forming a part of the plurality of mold cavities; wherein the plurality of pressing blocks are simultaneously movable relative to the first mold a base member that moves forward and backward; a pair of pillar portions that are erected on the base member; and a beam portion on which the pressing block is placed while being supported by the pair of pillar portions, and the pushing block is spaced by the spacer And an elastic support mechanism that is configured to independently displace each of the pressing blocks with respect to the base member, and a mounting area of the pressing block of the beam portion and a supporting area of the pillar portion In addition, it is also possible to obtain an invention for forming a bending rigidity reducing portion that promotes deflection of the beam portion. As a typical configuration of the bending rigidity reduction portion, for example, a configuration in which a concave portion is formed on the surface of the beam portion can be considered. When the concave portion is formed in a shape in which the depth or the width in the planar direction is increased from the supporting region of the pressing block toward the supporting portion of the pillar portion, the stress can be smoothly dispersed outside the center portion. The shape of the concave portion is not particularly limited as long as the bending rigidity is reduced. For example, in addition to the concave portion formed on the bottom surface and the upper surface of the beam, a concave portion in the category of "contraction" which is formed on the outer periphery of the beam for one week may be included. -9- 200906589 At this time, when the plural recesses are formed in plural, and the formation interval is narrowed as the region from which the push block is placed is formed toward the support region of the pillar portion, smooth stress dispersion can be performed in the same manner. . Further, in the present invention, since the deformation (deflection) of the beam is actively utilized for the control of the compressive stress of the molding material in the cavity, for example, a detecting means capable of detecting the displacement of the base member with respect to the pressing block is attached By this, the displacement of the beam, that is, the compressive stress of the molding material, can be quantitatively developed to develop a compression molding die device that can automatically realize the automatic management of the compression step or automatically detect when the problem occurs. According to the above configuration, an abnormality such as an abnormality in the elastic mechanism main body or an increase in the sliding resistance of the compression mold of the frame mold can be detected early and surely in each compression mold. For example, if the amount of displacement detected by the detecting means exceeds a predetermined range, the predetermined notification processing can be performed while stopping the advance and retreat movement, thereby preventing continuous production of defective products. Specifically, the detecting means comprises a deformation measuring instrument attached to the beam portion and a Wheatstone bridge circuit connected to the deformation measuring instrument, that is, a modification of the proposed mold design is not required, and the detecting means can be constructed. . In this case, the deformation measuring instrument is adhered to the beam portion in plurality, and at least one of the components is adhered to the derivable deformation according to the position where the deformation is not caused or the measurement of the other deformation measuring instrument by the displacement. At the time of the degree, the temperature correction of the deformation measuring instrument which is susceptible to temperature can be performed, and the accuracy is expected to be improved. That is, some of the deformation gauges in the plurality of strain gauges (from the results) are only used for the detection of temperature changes, -10 - 200906589 other deformations relative to the deformation of the beam (ie, the amount of displacement) The test results of the meter can be corrected for temperature. Further, when the above-described detecting means is constituted by the positional displacement amount, it is not necessary to perform correction required for the difference in the pasting position as in the deforming measuring instrument, and it is easy to obtain a stable detecting result. Further, in the above-described detecting means, when the displacement amount can be calculated by the pressing force of the compression mold, the pressing force of the mold, that is, the pressure generated by each cavity can be compressed to manage the abnormality detection. [Effect of the Invention] According to the present invention, it is possible to suppress the occurrence of a pressure difference between the cavities, and it is possible to control the deflection of each beam portion with high design freedom, that is, the compression pressure of the molding material in the cavity while obtaining an abnormal situation. It has the effect of disability insurance. [Embodiment] Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a structural view of a resin sealing mold (compression molding die) K1 to which the present invention is applied, (A) is a front view and (B) is a side view. This resin sealing mold K1 is provided with an upper mold (first mold) 丨〇 and a lower mold (second mold) 20. The upper mold 1 吸附 adsorbs the holder substrate (molded article) at a predetermined timing. Here, the substrate is exemplified as an example, but the same applies to, for example, a guide. The substrate 5 is provided with a plurality of semiconductor wafers (mounting materials) not shown in -11 - 200906589. The upper mold 1 is supported and fixed by a mold set 30 positioned on the upper portion of the upper mold 10. Further, the upper mold group 30 is provided with a heater 30, and the temperature control can be maintained at a predetermined temperature (for example, 175 degrees). The lower mold 20 is disposed opposite to the upper mold 10. The lower mold 20 is formed with a plurality of cavities 3 2 between the upper mold 1 and the upper mold 1 , and has one frame block 2 3 and a plurality of pressing blocks 24 . The frame block 23 is supported by the lower mold group (base member) 40 via a coil spring (not shown) to be movable up and down with respect to the lower mold group 4 。. Further, the reference numeral 3 1 in Fig. 1 is a spring (described later) for holding the substrate 5. The lower mold set 40 is supported by a press mechanism or the like (not shown), and constitutes a predetermined timing switch lower mold 20 with respect to the upper mold 1 . That is, a plurality of pressing blocks 24 are respectively fitted in a plurality of through holes 23 provided in the frame block 23, respectively forming a plurality of cavities 32 - part of which can move forward and backward with respect to the upper mold 10 (in This is moving up and down). A plurality of spaces formed by the upper mold 10 and the lower mold 20 (the frame block 23 and the pressing block 24) are formed to constitute the cavity 32. The lower surface of the push block 24 is coupled to the lower mold set 40 via the elastic support mechanism 2 1 . The elastic supporting mechanism 21 is constituted by a pillar portion 2 1 竖 that is erected on the lower mold group 40 and is hooked to connect the pillar portion 2 1 to the truss portion 2 1 Α. That is, both end portions of the beam portion 2 1 A are supported by the column portion 2 by both arms; [b. The pressing block 24 is placed and fixed to the placement area A0 in the center of the beam portion 21A supported by the both arms. A void portion 2 1 C is present directly below the beam portion 2 1 A. -12 - 200906589 Therefore, the beam portion 21 A is allowed to flex, and the function as the elastic body is to form a member (for example, iron or the like) which is processed with high precision. As a result, the pressing block 24 can be moved in the frame block 23 by the beam portion 21A so that the entire bottom surface thereof is horizontally supported. Therefore, when the push block 24 moves in the frame block 23, the moment for tilting the push block 24 (the moment that intersects the frame block 23) is hardly generated, so that it is not necessary to specially provide the push block 24 and An additional guiding mechanism for the smooth relative displacement of the frame block 23. Although the elastic supporting mechanism 2 1 of the present embodiment completely constitutes the beam portion 2 1 A and the pillar portion 2 1 B completely, the pillar portion 2 1 B may be integrally formed, for example, or only the beam portion 2 1 . A independent. As a result of the above configuration, the void portion 2 1 C is formed directly under the beam portion 2 1 A, and the deflection of the beam portion 2 1 A is allowed to be performed according to the existence of the gap portion 2 1 C, and has a function as the elastic mechanism 2 1 . That is, as long as the beam portion 2 1A corresponding to each of the pressing blocks 24 can be flexed independently ' and can be referred to as an "independent elastic supporting mechanism". By this configuration, the one pressing block having the plurality of pressing blocks 24 is not affected by the sealing pressure of the other pressing blocks 24 by the beam portion 2 1 A '. Further, the upper mold group 30 and the lower mold group 40 are respectively provided with heaters 30 Η and 40 Η to perform predetermined mold temperature control. Here, the shape of the beam portion 21 Α will be described in detail with reference to Fig. 2 as follows. (A) of Fig. 2 is an enlarged upper view '(B) of the arrow direction π portion of Fig. 1 is the same - enlarged front view. In this embodiment, the placement area A 0 of the pressing block 24 is set at the midpoint X0 of the beam portion 2 1 A from -13 to 200906589. Further, the pressing block 24 has a predetermined bottom area to be placed and fixed to the beam portion 2 1 A, so that the beam portion 2 1 A does not flex in the placement area A0. Therefore, the "effective bending-resistant region" in which the beam portion 2 1 A has an actual function as the elastic body is the support portion A 1 of the pillar portion side end portion X 1 of the loading region A0 of the pressing block 24 to the pillar portion 2 1 B. The area indicated by the symbol Ae up to the placement area side end portion X2. The "between the placement area (A0) of the loading and pressing block (24) and the support area (A1) of the pillar portion (2 1A)" in the present specification and the patent application means that the "effective bending area (Ae) )". Further, the symbol L1 of (B) of Fig. 2 corresponds to 1 /2 of the span of the beam portion 2 1 A. As shown in (A) and (B) of Fig. 2, in this embodiment, the beam portion 2 1 A has a substantially entire inclination angle 0 of the upper surface portion 2 1 A 1 of the effective bending-resistant region A e . The height (thickness) Η1 of the beam portion 21A of the support region A1 is lower (height) than the height (thickness) H0 of the placement region A 0 of the beam portion 2 1 。. That is, in the effective bending-resistant area Ae, the sectional area S of the beam portion 2 1 A is formed to form S 0, S 1 as the placement area A0 of the pressing block 24 faces the support area A 1 of the pillar portion 2 1 B. S 2, ... SX...S m are gradually reduced in shape (SO > S 1 > S2 > ... Sx ... > Sm ). Further, the effective bending-resistant region Ae is formed with a through hole 29 in the Z direction in which the pressing block 24 moves forward and backward. The shape of the through hole 29 in the planar direction is a triangle shape, and the width W in the plane direction from the placement area A0 toward the support area A1' is a shape in which W1, W2, Wx, Wm is smoothly increased ( W 1 < W2 <...Wx...< Wm ). By the multiplication effect, the sectional area SX of the specific position -14 - 200906589 X of the effective bending-resistant area A e forms a sectional area S of the placement area A 0 of the pressing block 2 4 which is smaller than the beam portion 2 1 A 0. Further, in this embodiment, the substrate 3 of the molded product of the resin sealing mold K1 is placed between the springs 31 in the through holes 29 by the presence of the through holes 29. Next, with reference to Fig. 3, the displacement detecting system of the push block 24 of the present embodiment will be described below. The displacement detecting deformation measuring instrument 45 is attached to the maximum bending position in the effective bending-resistant area A e of the estimated beam portion 2 1 A. In the present embodiment, the displacement detecting deformation measuring instrument 45 is attached to the upper surface side of the beam portion 2 1 A, and is not limited to this place, as long as it is in the effective bending-resistant area A e of the beam portion 2 1 A, Since the resin in the cavity 3 2 is always deformed when it is compressed, it may be any case. Further, in the present embodiment, in addition to the position detecting deformation measuring instrument 45, the temperature correcting deformation measuring instrument 47 is attached to the column portion 2 1 B which is not deformed during compression, and each displacement measuring deformation measuring instrument 4 is corrected. The error caused by the temperature change of 5 increases the detection degree. Of course, it is also possible to apply the displacement detecting deformation measuring instrument 45 and the temperature repair deformation measuring instrument 47 to different positions, and to perform mutual detection, and to perform high-precision detection. Displacement Detection Deformation Measuring Instrument 45 5. The deformation-correcting measuring instrument for temperature correction changes its own resistance 根据 according to the occurrence of deformation. Therefore, the Wheatstone bridge 60 for taking out the resistance 値 which is changed as a change in voltage is connected. . Further, the Wheatstone bridge circuit 60 is connected to the arithmetic unit 80 and the control unit 9A via an amplifier 70 that amplifies the output signal. The field has a position in the field but the field shift is fine. 47 The electric number -15- 200906589 The calculation unit 80 can convert the output of the Wheatstone bridge circuit 60 into a displacement amount (the deflection amount of the beam portion 21Α) : relative to the amount of displacement of the lower mold set 40). For example, the information is pre-recorded with respect to a predetermined amount of output 値 (output from the Wheatstone bridge circuit 60), and the information is compared with the stored information. Further, as long as the known pressure (the pressure generated by the pressing surface 24 of the compact 24 generated by the cavity 32) is generated, the pressure base which can be tolerated of the molded article can be managed. In the present embodiment, the two-dimensional moment of the cross-sectional shape of the beam g of the elastic supporting mechanism 21 and the material elastic modulus of the elastic supporting mechanism 21 and the length of the beam portion 21 are relative to the pressure (the sealing reaction force of the application 24) 1 〇 MP a, design beam portion 2 1 A-shaped f deflection amount of beam portion 2 1 A. The control unit 90 can set and store the displacement amount and the predetermined range in advance, and when the calculation result of the calculation unit 80 exceeds the equal volume I, predetermined processing can be performed (for example, the lower mold 20 is stopped, the warning light is turned on, or the warning is illuminated). The sound is emitted, etc.). Next, the action of the resin sealing device K 1 will be described. The substrate (molded article) 5 to which the upper mold 1 is sealed with a resin is adsorbed and held at i according to a supply mechanism (not shown). On the other hand, on the lower mold 20 side, a resin which is a sealing material (compressed material) is supplied by a supply (not shown). Here, the supply may be a molten resin which has been melted at the time of supply (liquid or may be unmelted, for example, a known displacement of a sheet-like, powdery, granular, electrical signal block 24 as a known operational displacement. J pressure = push each of the characteristics of the β 21A by the push block ^ 0.2mm The allowable range of the pressure of the retreat is about to be advanced: the resin supplied by the mold 10 mechanism is also resin), the plate shape, etc. -16-200906589 Resin. If the supply time is not melted, it can be melted by a heater. Subsequently, the pressurizing mechanism (not shown) operates to abut the frame block 23 against the upper mold 10. After the frame block 23 abuts against the upper mold 10, the pressing block 24 is advanced toward the upper mold 10 side in the through hole 23 A of the frame block 23 by the operation of a pressing mechanism (not shown). . With this action, the input resin continuously compresses the semiconductor wafer to form a seal. The pressurizing mechanism is stopped at the time of reaching the set load of the pressurizing mechanism (e.g., by the load sensor disposed between the pressurizing mechanism and the lower die set 4). On the other hand, in the resin sealing device K1, resin sealing (compression molding) is simultaneously performed in a plurality of cavities 32 by a plurality of pressing blocks 24 in a single pressurizing operation. Therefore, the sealing pressure difference can be generated on the pressing surface 24A of each pressing block 24 in accordance with the amount of resin supplied to each of the cavities 32 and the volume of the molded article itself supplied to each of the cavities 32. That is, for example, when the amount of resin to be injected into one cavity is larger than that of the other cavities, even if compression molding is performed according to the same upper thrust, the other cavities 3 2 are compared with one cavity 3 2 . The pressure builds up relatively low. As a result, the expected pressure cannot be achieved, resulting in molding failure of residual holes or the like. However, in the resin sealing device K1 of the present embodiment, each of the pressing blocks 24 is supported by the central portion of each of the beam portions 2 1 A of the elastic supporting mechanism 2 1 'so that once the sealing reaction force is applied to the pressing When the pressing surface 24A of the block 24 is on, the operating portion 21 A can relax the generation of the pressure difference in each of the cavities 3 2 by the deflection. For example, in the present embodiment, by the above-mentioned setting -17-200906589 relating to the conversion parameter, it is assumed that the specific gravity of the resin to be input is 2, the accuracy of the amount of the resin to be injected into each cavity 3 2 is ±50 mg, and the size of the cavity 32 is When it is 40 mm x 60 mm, the thickness error of the sealing portion according to the above-described resin amount error is formed to the extent of ±0.0 1 mm. Even when the thickness of the sealing portion of 0.01 mm is changed, the sealing pressure applied to the pressing surface 24A of the pressing block 24 is applied to the original sealing pressure, and is increased by only about 0.5 MPa. This degree of change in sealing pressure does not result in poor molding. Of course, the above-mentioned number is an example thereof, and is not limited to the above-mentioned number, and can be appropriately changed by the type and material of the molded article at the time of sealing, in particular, the type of the resin of the sealing material. However, in particular, when the good pressure equalization property is exhibited, it is preferable to set the material and shape of the beam portion to have a flexural characteristic of 1 MPa/mm or more and 1 Ο Ο Μ P a / m m or less. Here, Fig. 4 shows the stress characteristics at each position from the support region A1 of the beam portion 21A to the placement region A0. As can be seen from Fig. 4, the support region A1 is completely free of deflection and the stress is 0. However, in this embodiment, the height of the beam portion 21A near the support region A1 is lowered (H0 - Η1), and The increase in the width W (0 - Wm ) in the planar direction of the through hole 29 is such that the closer to the support region A1, the lower the bending rigidity is formed. Therefore, the stress characteristic is as shown in Fig. 4, and a smooth convex shape is formed on the side of the pillar portion 2 1 B of the effective bending-resistant region Ae, which is present toward the center of the placement region AO from the end portion XI of the placement region A 0 . The characteristic that X0 rises again. Therefore, compared with the case where the same amount of material is used to form the cross-sectional area beam portion, the stress of the placement area A 0 can be reduced, and the flexural curvature of the beam portion 2] A near the placement area A0 can be increased. -18 - 200906589 of the loading area A0 Abuts the pressing portion 2 1 A and the pressing block 24, so that the pressing block 24 can be made in this stable state (no distortion due to tilting, etc.) Displacement in the through hole 23A of the frame block 23. Further, in the present embodiment, the beam portion 2 I A is attached to the positional displacement deformation measuring instrument 45, and the amount of displacement of the pressing block 24 is detected from the degree of deflection (bending) of the beam portion 2 1 A. Therefore, in the event of a pressure difference in which the elastic support mechanism 21 cannot be eliminated, or the elastic support mechanism 21 is abnormal (for example, applying a load exceeding the relief point to the beam portion 2 1 A causes the beam portion 2 1 A itself to bend When the sliding resistance of the pressing block 24 of the frame block 23 is too large to cause an abnormal situation such as the original sealing pressure to occur, the operation of the pressurizing mechanism can be quickly stopped. As a result, it will not continue to produce defective products. Further, in the upper mold 10 and the lower mold 20, the heaters 30H and 40H' are mounted in an environment where temperature changes are possible, and temperature correction is necessary in order to detect a correct displacement 値. In the present embodiment, the temperature correction deformation measuring instrument 47 is adhered to the pillar portion 21B which is not deformed even according to the displacement of the pressing block 24, so that the accuracy of the detection result of the positional displacement deformation measuring instrument 45 can be further improved. . Further, as a secondary effect, abnormality detection of the above-described load sensor separately arranged may be formed. That is, the load sensor abnormality can be detected by preliminarily corresponding to the detection result of the normal time load sensor and the detection result of the detection means. Further, the displacement measuring instrument 47 for omitting the temperature correction can still detect the displacement. The position of the pasting is not necessarily on the pillar portion 2 1 B, but may be adhered to other positions where no deformation occurs (for example, the position on the opposite side of the loading region of the pushing block 24 of the beam portion 2 1 A). Alternatively, the same correction can be performed based on the measurement of the positional displacement deformation measuring instrument 45, and the position of the relative deformation degree is estimated, and the detection accuracy of the amount can be improved. Various changes are considered in view of the specific shape of the beam portion of the present invention. Fig. 5 and Fig. 6 are diagrams showing an example of a plural number of cross-sectional shapes of the beam portion. In the previous embodiment, the height (thickness) H of the beam portion 21A is gradually lowered from the mounting region A0 across the support region A1, and the width W of the through hole 29 in the planar direction is increased, but for example, FIG. 5 ( The height of the stepped reduction beam portion 51A indicated by A) can still obtain the same effect. The number of segments of the step is preferably 2 or more, but only one step can still obtain a suitable effect. Further, as shown in Fig. 5(A), when a plurality of steps 51A1 to 51A3 are provided, the heights H2 to H4 (H2 > H3 > H4) of the gradually smaller steps are formed as the support area A1 of the pillar portion 51B is approached. The stress is dispersed closer to the side of the pillar and can be carried out more efficiently. In the case of the fifth figure C (A), the entire beam portion 51A may be formed of a single member with the entire steps 51A0 to 5 1 A3 as a single body, or other members may be laminated. The material can also be changed when it is composed of other members. Further, in the case where the through hole is formed in the same manner, in the above-described embodiment, a single through hole 29 is formed, and the width w in the planar direction is set to increase as it approaches the support area A1. However, for example, in FIG. 5 ( B) indicates that the concave portion 52A2 may be formed on the upper surface or the lower surface of the beam portion 52A (the upper portion is 52A1 in the illustrated example) without forming the through hole. At this time, the configuration of the recessed portion 52A2 -20-200906589 is larger or the depth D is deeper (D1 < D2 < ~ < Dm) as the support region A1 approaching the support portion 52B. Further, as shown in Fig. 5(C), band-shaped recesses (necks) 53Ai, 53A2, ..., 53Am may be formed around the entire traverse portion 5 3 a. Although the number of formations is in the plural, it can be only one. Further, at this time, the formation interval may be narrowed as it approaches the support area A1 of the pillar portion 53b. Alternatively, the size (depth) of the concave portions 53A1, 53A2, ..., 53Am which are increased as approaching the support region a] may be formed. In addition, the size of the through hole and the recess in the plane direction increases as it approaches the support area, and in addition to the technique of increasing the width of the single through hole or the plane in the plane of the recess, as shown in Fig. 6, for example, In the ridge portion 54A, a large-diameter circular through hole (or circular recess) 5 4 A 1 is formed. At this time, the number (or depth) of formation is similarly formed (or depth) with the support area A1 close to the pillar portion 54B. In the configuration of Fig. 6, the large-diameter through hole 5 4 A 2 in which the spring 31 for holding the molded article is disposed may be disposed in parallel as needed in the prior embodiment. The circular through-hole 5 4 A 1 (or 5 4 A 2 ) is excellent in manufacturing (forming). The point at which the stress dispersion effect can be adjusted by the setting of the diameter, the number of formations, and the formation position is extremely excellent. Further, although the through hole is formed in the vertical direction of the green portion in the above example, the same effect can be obtained by forming the horizontal direction of the beam portion. These configurations can be regarded as being between the placement region of the pressing block of the beam portion and the support region of the pillar portion (effective bending region), and forming a bending rigidity reducing portion that promotes deflection of the beam portion. In addition, the other configurations are the same as those of the previous embodiment - 21 - 200906589, and the repeated description thereof is omitted. [Industrial Applicability] For example, a molded article in which a plurality of semiconductor wafers are mounted on one substrate or a guide is preferable as a compression molding die of a resin sealing device which is one-time compression-molded by one pressurizing mechanism. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a configuration of a resin sealing mold according to an embodiment of the present invention, wherein (A) is a front view and (B) is a side view. Fig. 2 is a partial enlarged view showing a portion in the direction of the arrow in Fig. 1, (A) is a top view, and (B) is a front view. Fig. 3 is a block diagram showing the configuration of the positional displacement detecting means. Fig. 4 is a graph showing the stress change characteristics of the beam portion. Fig. 5 is a front elevational view corresponding to Fig. 2(B) showing an example of another embodiment of the present invention. Fig. 6 is a top view corresponding to Fig. 2(A) showing an example of another embodiment of the present invention. [Description of main component symbols] 5: Substrate 10: Upper mold (1st mold) 2〇: Lower mold (2nd mold) 2 1 : Elastic support base-22 - 200906589 2 1 A : Beam 2 1 B : Pillar portion 2 1 C : void portion 2 3 : frame block 2 3 A : through hole 2 4 : push block 2 4 A : pressing surface 2 9 : through hole 3 0 : upper mold group 3 1 : spring 3 2 : Cavity 40 : Lower mold set (base member) 4 5 : Position displacement deformation measuring instrument 47 : Deformation measuring instrument for temperature correction 6 0 : Wheatstone bridge circuit 80 : Calculation unit 9 0 : Control unit A 0 : Loading area A1: Support area A e : Effective bending area -23 -