JP5707532B1 - Molded substrate - Google Patents

Abstract

The present invention provides a substrate to be molded capable of discharging remaining gas in a resin molding space and releasing bubbles in a resin molding material during resin molding. 121 indicates a position on a substrate 12 of a molded product on which a resin is molded. Further, a protrusion 315 is formed on the substrate 12. At the beginning of the resin molding, a certain gap is maintained between the substrate 12 and the resin molding plate 31 by the protrusions 315. After the molten resin is injected into the molding cavity 311, the substrate 12 and the resin are completely removed. When the pressure above a certain level is applied so that the molded plates 31 are combined, the protrusion shape is broken. [Selection] FIG.

Description

  The present invention relates to a molded substrate on which molded products such as electronic components and semiconductor elements on which resin is molded are arranged.

  A so-called clear mold package in which an optical element such as a CCD or a light emitting element is sealed with a transparent resin has been put into practical use. Here, in order to release the mold and the molded product, a mold release agent is blended into the mold resin material. However, this method impairs the transparency of the package. In particular, for mold resin materials, when considering the material composition and blending to improve moisture resistance and improve adhesion to metals such as lead frames and chips, the mold release properties at the time of molding will become worse. There is a tendency.

  In nanoimprinting, the unevenness formed on the surface of the mold is pressed against a resin material, and the unevenness is transferred to the resin material, whereby a molded product having a fine shape is formed. Next, the mold and the molded product are released. If the adhesion between the mold and the molded product is large, there will be a problem that the molded product will adhere firmly to the mold, and when the molded product is removed from the mold, part of the molded product may be broken and damaged. In some cases, the yield of the molded product decreases. Moreover, the unevenness | corrugation of a metal mold | die may be damaged, and durability of a metal mold | die will fall.

  In order to increase the yield of the molded product without increasing the transparency of the package and to improve the durability of the mold, for example, as shown in Patent Document 1, a mold release agent is applied to the surface of the mold. Has been done.

  Moreover, as shown in Patent Document 2, when a resin molding die called an insert cavity block is used, a release agent substance is applied to the surface of the resin molding die that contacts the resin.

JP 2002-283354 A Special table 2013-525145 gazette

  On the other hand, at the time of resin molding, the inside of the resin molding space where the resin material is arranged is evacuated, but at this time, it cannot be completely evacuated. For this reason, bubbles may sometimes enter the resin molding material.

  The present invention was devised to solve the above-described problems, and provides a molded substrate capable of discharging the remaining gas in the resin molding space and releasing bubbles in the resin molding material during resin molding. The purpose is to do.

To achieve the above object, a first aspect of the present invention, the molded article of the resin by combining a resin mold having a concave portion as the mold cavity the resin is injected it is formed is arranged A substrate and a plurality of protrusions provided on the substrate on the surface side where the article to be molded is disposed, and the protrusions are in contact with the resin molding die. A molding substrate, wherein a gap is formed between the molding die and the molding cavity and the substrate.

  The invention according to claim 2 is characterized in that the protrusion has a characteristic that the protrusion shape collapses when a predetermined pressure or more is applied between the resin molding die and the substrate. It is a to-be-molded substrate as described in above.

  According to the present invention, at the time of resin molding, the remaining gas in the resin molding space can be discharged and air bubbles in the resin molding material can be released, so that the occurrence of molding defects can be prevented.

It is a figure which shows the whole structure of a resin molding apparatus. It is a figure which shows arrangement | positioning of the pressure sensor attached to the upper metal mold | die of the resin molding apparatus. It is a figure which shows the positional relationship with the arrangement | positioning of the heater unit attached to the upper platen of the resin molding apparatus, the arrangement of the heater unit and position detector attached to the movable platen, and the drive screw. It is a figure which shows the flowchart which shows the process of correct | amending the parallelism of an upper metal mold | die and a lower metal mold | die, and performing resin molding. It is a figure which shows the flowchart which shows the process of correct | amending the parallelism of an upper metal mold | die and a lower metal mold | die, and performing resin molding. It is a figure which shows the detailed structure of a metal mold | die part. It is a figure which shows the state by which the film was adsorbed | sucked to the lower mold in the metal mold | die part. It is a figure which shows the state by which the resin molding material was thrown in in the metal mold | die part. It is a figure which shows the state which decompresses the resin molding material injection space by evacuation in a metal mold | die part. It is a figure which shows the state which clamps a metal mold | die and is filled with the resin molding material in the shaping | molding cavity of a shaping | molding board. It is a figure which shows the state which raised the resin pressurization plunger in order to pressurize with respect to the resin molding material. It is a figure which shows the structure of the whole shaping | molding board. It is the figure which expanded a part of shaping | molding board of FIG. It is a figure which shows the cross section containing the shaping | molding cavity and runner of a shaping | molding board, and a resin molding material inflow hole. It is a figure which shows the cross section of the shaping | molding board which has a structure different from FIG. It is a figure which shows arrangement | positioning of the protrusion formed in the board | substrate with which the to-be-molded product was mounted. It is sectional drawing which shows the layer structure of a resin film.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The drawings relating to the structure are schematic and different from the actual ones. Moreover, the part from which the relationship and ratio of a mutual dimension differ also in between drawings is contained.

  First, the whole structure and each component of the resin molding apparatus using the resin molding plate of this invention are demonstrated using FIGS. 1-3 and FIGS. 6-17.

  FIG. 1 shows the overall configuration of the resin molding apparatus. A base 4 formed in a U-shape, a lower platen 3, a movable platen 2, and an upper platen 1 installed on the base 4 are provided. The upper platen 1 and the lower platen 3 are fixed platens. Tie bars 5 are erected at the four corners of the lower platen 3, the upper platen 1 is fixed to the upper end of the tie bar 5, and the movable platen 2 can freely move up and down with the tie bar 5 as a guide between the upper platen 1 and the lower platen 3. It is formed so that it can slide on.

  Although not shown, the upper platen 1 is provided with a mechanism for clamping the upper mold 30 and the resin molding plate 31, and the upper mold 30 and the resin molding plate 31 can be fixed to the upper platen 1. . A lower mold 32 is fixed to the movable platen at a position facing the upper mold 30. Thus, the upper mold 30 is a fixed mold and the lower mold 32 is a movable mold.

  FIG. 2 is a view showing the arrangement of pressure sensors attached to the upper mold 30 of the resin molding apparatus of FIG. 3 is a diagram showing the arrangement of the heater unit attached to the upper platen 1 of the resin molding apparatus of FIG. 1, the arrangement of the heater unit and position detector attached to the movable platen 2, and the positional relationship with the drive screw. . FIG. 6 is a diagram showing a detailed configuration of the mold part in FIG. 1. Hereinafter, description will be given with reference to these figures.

  The drive screws 6a, 6b, 6c, and 6d are erected on the base 4 so as to be rotatable around the axis parallel to the axial direction of the tie bar. The drive screws 6a to 6d are screwed into nut portions attached to the four corners of the lower surface of the movable platen. The drive screws 6a to 6d are connected to four drive motors, respectively. The drive screw 6a is connected to the drive motor 60a, the drive screw 6b is connected to the drive motor 60b, the drive screw 6c is connected to the drive motor 60c (not shown), and the drive screw 6d is connected to the drive motor 60d (not shown). For example, a servo motor or the like is used as the drive motor, and force is transmitted between the drive motor and the drive screw via a coupling or the like.

  When the torque is controlled, the drive motors 60a to 60d constituting the drive means can increase torque, increase the clamping force, and incorporate an acceleration / deceleration function to perform smooth vertical movement. The drive screws 6a to 6d are pushed up or pulled down by forward / reverse rotation of the drive motor to move the movable platen 2 up and down. When the drive motors 60a to 60d perform the synchronous operation, the movable platen can be moved up and down while maintaining the front / rear and left / right postures in a constant state.

  The drive motor 70 moves the drive screw 62 up and down, but is not screwed to the movable platen 2 but penetrates the movable platen 2 and is screwed to a resin pressurizing plunger 33 described later via a nut portion. ing. Accordingly, the drive motor 70 and the drive screw 62 are irrelevant to the movement of the movable platen 2 and push up or lower the resin pressure plunger 33.

  A pressure sensor is incorporated in either the upper mold 30 or the lower mold 32. As the pressure sensor, a sensor such as a load cell using a strain gauge, a piezoelectric sensor, or the like can be used. Among these, a quartz crystal piezoelectric sensor or the like that operates accurately at a high temperature is desirable. FIG. 2 shows an example in which pressure sensors are arranged in the upper mold 30, and nine pressure sensors 30 a to 30 i are arranged at almost equal intervals so that the pressure of each part can be measured within the range of the upper mold. It is provided in a matrix. These pressure sensors 30a to 30i have a configuration in which the lower surface of each pressure sensor slightly protrudes from the lower surface of the upper mold 30 in order to measure the pressure at the time of clamping, It has a structure that touches and supports this.

  Further, instead of the pressure sensor, a non-contact displacement sensor may be incorporated in either the upper mold 30 or the lower mold 32. The non-contact displacement sensor can measure the displacement of the object, the distance (gap), the thickness, etc. of the object without contacting the object, and is an eddy current type, ultrasonic type, optical type, static type There is a capacitance type. Since the temperature of the mold must be increased for resin curing, an eddy current type that is heat resistant even at high temperatures is desirable. When the non-contact displacement sensor is used, for example, as shown in FIG. 6, the non-contact displacement sensor is provided at L positions at the four corners of the slide ring 14 of the lower mold 32. As described above, regardless of whether it is a pressure sensor or a non-contact displacement sensor, a plurality of sensors are two-dimensionally arranged, and the number thereof is not limited.

  Outputs of the pressure sensors 30 a to 30 i are digitized by the A / D converter 83 and input to the drive control unit 82. The same applies to the signal flow when the non-contact displacement sensor is used. The drive control unit 82 corresponds to a so-called servo amplifier, and drives the drive motors 60 a to 60 d in accordance with a command from the command unit 81. The command unit 81 is a controller that issues an operation command to the drive motor, and corresponds to a so-called sequencer.

  The heater unit 6 is attached to the upper surface of the upper mold 30, and the heater unit 7 is attached to the lower surface of the lower mold 32. The heater unit is a set of at least one temperature sensor and one heater, and the heater units 6 and 7 are composed of a sheet-shaped heater or a plurality of pipe-shaped heaters and a temperature sensor. .

  A heater unit is also installed in the upper platen 1 and the movable platen 2. As shown in FIG. 3, the heater units 10 a, 10 b, 10 c, and 10 d installed on the upper platen 1 are intermediate positions of each side of the square in the plan view of the upper platen 1, and are closer to the upper surface side of the upper platen. Is attached. The heater units 20 a, 20 b, 20 c, and 20 d installed on the movable platen 2 are attached to the lower side of the movable platen at intermediate positions of the sides of the quadrangle in the plan view of the movable platen 2. A total of eight heater units attached to the upper platen 1 and the movable platen 2 are each composed of, for example, four heaters and one temperature sensor.

  These heater units 6, 7, 10 a to 10 d, 20 a to 20 d are connected to a temperature control unit 84, and each heater unit can be controlled independently by the temperature control unit 84. The role of the heater unit is to make the upper mold 30 have a uniform temperature distribution, and the lower mold 32 also have a uniform temperature distribution to prevent resin molding defects. In addition, distortion and warpage due to the temperature distribution of the upper mold 30 and the lower mold 32 are prevented. Further, the heater units installed in the upper platen 1 and the movable platen 2 also have a uniform temperature distribution in the upper platen 1 and a uniform temperature distribution in the movable platen 2 so that the temperature distribution difference in the upper platen 1 and the movable platen 2 is prevented from being warped or warped due to a difference in temperature distribution.

  In addition, there are the following purposes. As shown in FIG. 6, a heat insulating material 8 is arranged between the heater unit 6 for adjusting the temperature of the upper mold 30 and the upper platen 1, and the heat of the heater unit 6 is applied to the upper platen 1. I try not to conduct as much as possible. However, the heat of the heater unit 6 is still conducted to the upper platen 1 and affects the upper platen 1. The relationship between the movable platen 2 and the heater unit 7 is also the same, and a heat insulating material 9 is disposed between the heater unit 7 and the movable platen 2 so that the heat of the heater unit 7 is not conducted to the movable platen 2 as much as possible. However, the heat of the heater unit 7 is still conducted to the movable platen 2 and affects the movable platen 2.

  Therefore, even if the temperature distributions of the upper platen 1 and the movable platen 2 are made uniform by the heater units 10a to 10d and 20a to 20d, the temperature distribution greatly varies due to the influence of the heater units 6 and 7. Warpage and distortion occur in the platen 1 and the movable platen 2. Therefore, as will be described later, even if the upper mold 30 and the lower mold 32 are paralleled in advance, if the mold temperature at the time of resin curing is different from that at the time of parallelism adjustment, The temperature distribution of the movable platen and the upper platen during resin molding is not uniform, distortion and warpage occur, and the parallelism correction data measured first is not valid.

  In order to solve the above problem, the temperature distribution of the upper platen 1 affected by the upper mold 30 with respect to the temperature reached when the upper mold 30 is raised to a predetermined temperature for resin curing. Measure the highest temperature in advance. Similarly, the highest temperature in the temperature distribution of the movable platen 2 affected by the lower mold 32 is measured in advance.

  For example, the highest temperature of the upper platen 1 when the ultimate temperature of the upper mold 30 and the lower mold 32 is TM ° C. is T1 ° C., and the highest temperature of the temperature distribution of the movable platen 2 is T1 ° C. Suppose there was. At this time, TM> T1.

  Next, in a state before the parallelism adjustment, the entire temperature of the upper platen 1 is set to T1 ° C. using the heater units 10a to 10d, and the entire temperature of the movable platen 2 is set to T1 ° C. using the heater units 20a to 20d. The temperature control unit 84 adjusts the temperature so that And this temperature is maintained. When resin molding is performed in this state, even if there is an influence of the mold temperature, the upper platen 1 and the movable platen 2 do not reach a temperature exceeding T1 ° C., and the upper platen 1 and the movable platen Since each temperature distribution of 2 is uniform, the upper platen 1 and the movable platen 2 are prevented from being warped or distorted.

  Therefore, the adjustment of the parallelism increases the temperature of the upper mold 30 and the lower mold 32 to the temperature at the time of resin molding, and the temperatures of the upper platen 1 and the movable platen 2 are as described above during the resin molding. If the temperature is adjusted to a temperature that is not affected by the temperature of the mold, the correction data at the time of adjusting the parallelism becomes very effective. Thereby, it is possible to adjust the parallelism between the mold surfaces of the upper mold and the lower mold very accurately, and it is possible to clamp the mold with a uniform pressure and prevent molding defects. As an example, when the ultimate temperature of the entire mold is 135 ° C., the entire temperatures of the upper platen 1 and the movable platen 2 are set to about 80 ° C.

  Four position detectors are attached to the outer surface of the movable platen 2 so that the longitudinal direction is parallel to the axial direction of the tie bar and the tip extends to the upper platen 1 side. For the position detector, for example, a linear scale capable of detecting a linear position may be used. In the drawing, an example using a linear scale is shown. As shown in FIGS. 1 and 3, the position detectors 41, 42, 43, 44 are installed at the four corners of the movable platen 2 outside the tie bar 5. Each linear scale consists of a measuring instrument and a scale.

  In FIG. 1, the scale and the measuring device are illustrated for the position detectors 41 and 42, but in FIG. 3, the description of the measuring device is omitted. In addition, when a linear scale is used for the position detectors 41 to 44, although not shown, for example, a measuring instrument is attached to the tip of a support bar extended from a fixed structure such as the lower platen 3 or the like. And read the scale scale. Although the scale is attached to the movable platen 2, the scale may be attached to the lower platen 3 and the measuring instrument may be attached to the movable platen 2.

  A transmissive photoelectric scale, a reflective photoelectric scale, an electromagnetic induction scale, or the like is used as the linear scale. In addition to the linear scale, as the position detectors 41 to 44, the distance between the movable platen 2 and the upper platen 1 or the lower platen 3 is measured using a laser distance meter, an ultrasonic distance meter, or the like. The position of 2 may be detected. Thus, the position detectors 41 to 44 detect the position of the movable platen 2 when the movable platen 2 moves up and down according to the resin molding operation. The pulse signals detected by the position detectors 41 to 44 are transmitted to the drive control unit 82.

  The detection of the position is calculated based on the number of pulse signals detected by the position detectors 41 to 44 when the initial position of the movable platen 2 is set to 0 and the movable platen 2 is raised.

  According to FIG. 6, the heater unit 6 is disposed on the upper mold 30, and the heat insulating material 8 is disposed between the heater unit 6 and the upper platen 1.

  The lower mold 32 includes the slide ring 14, the pressure block 16, and the movable member 15. The movable member 15 may be any mechanism that can move up and down. When the movable member 15 is passively moved up and down, for example, an elastic member such as a spring is used. When actively moving up and down, a driving mechanism such as an actuator is used. The heater unit 7 is disposed under the pressure block 16 of the lower mold 32, and the heat insulating material 9 is disposed on the lower surface of the heater unit 7. A resin pressure plunger 33 is incorporated in the center of the pressure block 16.

  At the time of resin molding, a substrate 12 on which a resin is formed, a substrate presser 11 for pressing the entire substrate 12, and a resin molded plate 31 including a molding cavity for forming the resin into a predetermined shape are disposed. The The resin molding plate 31 is, for example, a mold dedicated to resin molding in which a product to be molded is molded into a predetermined shape or sealed with a resin, and resin molding is performed according to the type and number of the products to be molded. By replacing the plate 31 with a different type, a desired resin can be molded. Further, the resin film 17 is disposed on the lower mold 32 in the region where the resin material is charged.

  The resin film 17 is different from a simple release film. In general compression molding, an ETFE (polytetrafluoroethylene) film is used and does not stick to a resin material in the resin molding process. As described above, the following problems occur due to the releasability.

  FIG. 9 is a diagram illustrating a process of evacuating from the gap D after the resin molding material 18 is put into the resin material mounting space. When the resin film 17 has releasability, the following state is obtained. Become. For example, the resin film 17 is adsorbed onto the lower mold 32 by being evacuated through a narrow gap between the pressure block 16 of the lower mold 32 and the slide ring 14. This means that it is pressed against the lower mold 32 at atmospheric pressure. When the vacuum suction is performed, the resin film 17 is stretched, and the resin film 17 has elasticity, so that a restoring force for returning to the original state is generated.

  For this reason, as shown in FIG. 9, when the upper surface of the resin film 17 is also evacuated during the molding process, the force pressing the resin film 17 disappears, and the resin film 17 shrinks due to the restoring force, and the lower mold 32 A state of rising from the surface occurs. Even if the degree of vacuum between the resin film 17 and the lower mold 32 is increased, the difference from the degree of vacuum on the resin film 17 is not so large, and the force for pressing the resin film 17 against the lower mold 32 is very high. It will be weak. And since ETFE has releasability as mentioned above, it will come off from the lower metal mold | die 32, and will cause a shaping | molding defect.

  Therefore, the resin film 17 uses a resin such as plastic as a base material, gives the adhesiveness to the surface where the base material is in contact with the lower mold 32, and the surface where the base material faces the resin molding plate 31 is releasable. It is formed to have. This can be formed as follows, for example. A two-layer structure in which ETFE, which is a resin having releasability and not adhesive, is used as a base material, and an adhesive layer is coated on the surface of the ETFE in contact with the lower mold 32 can be obtained. The adhesive layer may be formed, for example, by coating a silicon-based or acrylic-based slightly adhesive adhesive or the like.

  Further, as shown in FIG. 17, the resin film 17 can also have a three-layer structure. 17b is a portion corresponding to the base material, and a resin such as plastic is used. Among the resin materials, PET (polyethylene terephthalate) is used for various applications in general industries, electrical and electronic, packaging, graphic, display industries, etc., and is inexpensive and easy to supply and demand because there are many suppliers. . For this reason, for example, PET or PEN (polyethylene naphthalate) may be used for the base material 17b.

  A release layer 17a is formed on the base material 17b. The release layer 17a is formed on the resin molding material 18 side or the resin molding plate 31 side. The release layer 17a is a layer having releasability, and is intended to make it difficult to stick to a resin molding material or a mold. The release layer 17a may be formed by coating a release agent, or a resin having a release property, for example, ETFE may be bonded onto the substrate 17b.

  Here, for example, PET or PEN that can be used for the base material 17b has adhesiveness, so it may have a two-layer structure of the release layer 17a and the base material 17b, but further imparts adhesive strength. Therefore, the adhesive layer 17c may be formed on the lower surface of the base material 17b. The adhesive layer 17c is formed on the lower mold 32 side.

  As described above, by forming the resin film 17, the resin film 17 can proceed with the resin molding process without peeling from the lower mold 32 in the vacuuming process as shown in FIG. The resin molding material 18 and a part of the resin molding plate 31 can be prevented from sticking to the resin film 17.

  A resin-molded plate 31 is used to mold or mold a resin having a predetermined shape on a molded article placed on the substrate 12. An example of the resin molding plate 31 is shown in FIG. FIG. 13 is an enlarged view of a part of the resin molded plate of FIG. In FIG. 13, FIG. 14 shows an AA cross section of a region where the resin of the resin molding plate 31 is injected. As shown in FIG. 14, the resin inflow hole 310 and the resin molding cavity 311 are connected by a runner 312.

  The resin molding material is supplied from the lower side of FIG. 14 to the resin inflow hole 310 and filled into the molding cavity 311 from the resin inflow hole 310 via the runner 312. Accordingly, the plurality of resin inflow holes 310 have a structure that connects the plurality of molding cavities 311 corresponding to the resin inflow holes 310 to one resin supply space 20. Here, the resin formed on the substrate 12 side is the resin in the region of the molding cavity 311 and the runner 312 shown by the broken lines, and the resin present in the resin inflow hole 310 is finally removed.

  In order to lower the surface adhesion characteristics of the resin molding plate 31 with respect to the resin molding material 18 relative to the resin film 17, a plating film 313 having releasability is formed on the surface of the resin molding plate 31. The plating film 313 is formed on the inner surface of the molding cavity 311, the inner surface of the runner 312, and the inner surface of the resin inflow hole 310, and further continuously formed on the entire surface up to the front surface and the back surface of the base material 319 of the resin molding plate 31. As the material of the resin molding plate 31, Fe (iron) is usually used, and Ni (nickel) containing PTFE (polytetrafluoroethylene) is formed on the surface thereof as a plating film 313 having releasability by electrolytic plating. This is formed by dispersing and eutecting PTFE particles on electrolytic nickel plating.

  Further, when a semiconductor resin is used as the resin molding material 18, there is a possibility that the plating film may be scraped off, so that the plating film 313 having releasability is a film made of a nickel-tungsten (Ni—W) alloy. May be formed. This is formed by an electrolytic plating process. As described above, by forming a plating film having releasability, it becomes possible to maintain good releasability over many resin moldings. In addition, because of the plating film, the film thickness can be reduced to the nanometer order.

  Next, FIG. 15 shows a cross section of a resin molded plate having a structure different from that shown in FIG. In the molding plate shown in FIG. 15, one resin inflow hole (gate) 320 and a plurality of molding cavities 321 are connected by one runner 322. The resin molding material is injected into the resin inflow hole 320 from the direction indicated by the arrow E, and filled into the plurality of molding cavities 321 via the runners 322. Here, the resin formed on the substrate 12 side is the resin in the region of the molding cavity 321 and the runner 323 indicated by broken lines, and the resin present in the resin inflow hole 320 is finally removed.

  With the configuration as shown in FIG. 15, it is possible to manufacture a resin molded plate relatively easily as compared with FIG. 14, and it is possible to process a large amount of resin molding on a molded product at a time.

  A plating film 323 having releasability is formed on the surface of the substrate 329 of the resin molded plate. The plating film 323 is formed on the inner surfaces of the plurality of molding cavities 321, the inner surfaces of the runners 322, and the inner surfaces of the resin inflow holes 320, and is continuously formed on the entire surface up to the front and back surfaces of the base material 329 of the resin molding plate. .

  When forming a plating film only on the inner surface of the molding cavity, the inner surface of the runner, and the inner surface of the resin inflow hole, a mask is provided in an area where the plating film is not required so that the plating process is not performed. After the plating film is formed on the entire surface, an unnecessary region of the plating film may be removed by grinding with a grindstone or a blade.

  Further, in order to provide a slight gap between the substrate 12 and the resin molding plate 31, protrusions may be formed on the resin molding plate 31 or the substrate 12. As will be described later, the gas in the resin supply space 20 is evacuated to a vacuum state so that bubbles do not enter the resin molding material 18 at the time of resin molding. It cannot be in a state. For this reason, although air bubbles slightly enter the resin molding material 18, such air bubbles are to escape.

  Therefore, at the beginning of the resin molding, a certain gap is maintained, but after the molten resin is injected into the molding cavity 311, a certain pressure or more is applied so that the substrate 12 and the resin molding plate 31 are completely combined. For example, a material that can collapse the protrusion shape is preferable. For example, the protrusion is made of Al (aluminum). Although depending on the unevenness of the substrate 12, for example, if the height is set to about 15 μm to 50 μm, the remaining gas such as bubbles can be sufficiently discharged.

  In FIG. 12, the example which provided the protrusion 315 in the resin molding board 31 side is shown. In the figure, the protrusions 315 are formed at the four corners of the resin molding plate 31, respectively. However, when considering the bending of the substrate 12, a plurality of so as to surround each molding cavity 311 as shown in FIG. Protrusions may be provided. Further, a protrusion may be provided on the side of the substrate 12 arranged in close contact with the resin molding plate 31.

  FIG. 16 shows an example in which a protrusion 315 is formed on the substrate 12 side. Reference numeral 121 denotes the position of the molded product on which the resin is molded. A protrusion 315 may be directly formed on the substrate 12 as shown in FIG. 16 or may be formed on the substrate 12 as a resist 120. Note that the protrusions may be formed at the four corners of the substrate 12 in the same manner as the resin molding plate 31 side, and the positions are not limited.

  Next, a resin molding method accompanied by an operation of adjusting the parallelism of the upper mold 30 and the lower mold 32 will be described below with reference to FIGS. 4 and 7 to 11.

  First, as shown in FIG. 7, the substrate holder 11, the substrate 12, and the resin molding plate 31 are set in the upper mold 30 attached to the upper platen 1. These attachments are performed by, for example, a clamp mechanism provided on the upper platen 1 although not shown. A lower mold 32 is disposed on the movable platen 2 so as to face the upper mold 30.

  Here, as shown in S1 of FIG. 4, when the mold is replaced with a different type of mold or resin molded plate, or when the temperature of the mold is changed, the process proceeds to S3 and the temperature is adjusted by the heater unit. Thereafter, the parallelism between the mold surfaces is adjusted. The case where the temperatures of the upper mold 30 and the lower mold 32 are changed is, for example, a case where the curing temperature of the resin is changed. In the case of an apparatus or the like in which a molding cavity is provided in the upper die or the lower die without using the resin molding plate, the parallelism is adjusted without setting the resin molding plate 31 or the like.

  As described above, the temperature adjustment by the heater unit is controlled by the temperature control unit 84 for each heater unit attached to the upper mold 30, the lower mold 32, the upper platen 1, and the movable platen 2, and the temperature is increased to a predetermined temperature. And maintain that temperature. As a result, as described above, the temperature of the upper mold 30 and the lower mold 32 and the temperature of the upper platen 1 and the movable platen 2 are maintained in a fixed relationship, and the whole of each member is kept at a uniform temperature. Maintained.

  Next, without placing the resin film 17 or the like, that is, in a state where resin molding is not performed, the drive motors 60a to 60c are activated by the control of the drive control unit 82 according to an instruction from the command unit 81, and the movable platen 2 is raised and the upper mold 30 and the lower mold 32 are combined and lightly closed.

  The load at this time is measured by the pressure sensors 30 a to 30 i (S 4), and the measured pressure signal is transmitted to the A / D converter 83, converted into a digital signal, and transmitted to the drive control unit 82. The pressure signals from the respective pressure sensors arranged in the upper mold 30 are confirmed, and the drive motor is operated so that those pressures are equalized.

  For example, when the pressure signals from the nine pressure sensors are A1, A2, A3, A4,..., A9, and the value of the signal is the smallest in A3, A1−A3 = E1, A2 -A3 = E2, A4-A3 = E4, A5-A3 = E5, A6-A3 = E6, A7-A3 = E7, A8-A3 = E8, A9-A3 = E9 and the correction amount is calculated (S5). The four drive motors are driven so that these values E1, E2, E4, E5, E6, E7, E8, E9 are 0 or within a certain allowable value, and the movable platen 2 is controlled by position control. Is moved to the molding material charging position. In the above example, the value of A3 is used as a reference, but the reference value may be another numerical value.

  Position signals are transmitted from the position detectors 41 to 44 in accordance with the vertical movement of the movable platen 2 and the position information of the four corners of the movable platen 2 is recognized. A correction amount is applied to each position information from the position detectors 41 to 44 when there is no difference between them (S6). For example, if the position counter in the drive control unit 82 counts the pulse signals from the position detectors 41 to 44, it corresponds to each position detector when there is no difference from each pressure sensor. The difference between the position counters may be set to zero.

  Thereby, the inclination of the movable platen 2 and the lower mold 32 in the front-rear and left-right directions is adjusted, and the upper mold 30 and the lower mold 32 are in a parallel state. Thereafter, the raising / lowering operation of the movable platen 2 may be performed in synchronization. In the raising / lowering operation of the movable platen 2, the position is detected from the pulse signal from the position detector, so that the parallelism can always be maintained. In this way, each drive motor can be driven at an equal distance and moved while maintaining the posture of the movable platen 2.

  Immediately after adjusting the parallelism between the upper mold 30 and the lower mold 32, the command motor 1 drives the drive motors 60a to 60d via the drive control unit 82 to lower the four corners of the movable platen by the same distance. The movable platen 2 is moved to the resin molding start position. In the case of FIG. 4, the resin molding start position is the molding material input position (S7).

  On the other hand, when the above-described non-contact displacement sensor is used instead of the pressure sensor, a gap between the upper mold 30 and the lower mold 32 when the lower mold 32 is brought close to the upper mold 30. Therefore, it is not necessary to close the upper mold 30 and the lower mold 32 together. Based on the signal detected by the non-contact displacement sensor, the correction amount is calculated in the same manner as in the case of the pressure sensor, the four drive motors are driven, and the correction amount is applied to the position information of the movable platen.

  At this time, depending on the resolution of the non-contact displacement sensor, if the distance between the four corners of the gap between the upper mold 30 and the lower mold 32 can be measured when the lower mold 32 is brought close to the molding material charging position. Since the parallelism should be adjusted at that position, useless movement can be omitted. In this case, after adjusting the parallelism, the resin molding process can be started immediately without moving the movable platen 2.

  Next, in order to start the resin molding, the resin film 17 is laid on the lower mold 32 and evacuated by a vacuum device (not shown), so that the resin film 17 is removed from the lower mold 32 as shown in FIG. Adsorb to the top of. The resin film 17 is vacuum-sucked through a narrow gap between the pressure block 16 of the lower mold 32 and the slide ring 14. The resin film 17 prevents the molten resin from coming into direct contact with the lower mold 32 so that the molten resin does not leak below the lower mold 32.

  By such a process, the resin supply space 20 having a recessed space due to the height difference between the pressure block 16 and the slide ring 14 is formed on the lower mold 32. The resin supply space 20 can prevent external leakage of the molten resin during the pressurizing process.

  Next, as shown in FIG. 8, a certain amount of a resin molding material 18 that is a solid or liquid molding material is injected or poured into the resin supply space 20.

  Next, in response to a position control command from the command unit 81, the drive motor is operated via the drive control unit 82, and the movable platen 2 is raised to the evacuation position as shown in FIG. 9 (S8). The vacuuming position is set so that a slight gap D is formed between the resin molding plate 31 and the film 17 on the slide ring 14. A gas present in the resin supply space 20 is exhausted from the gap D by vacuuming by a vacuum device (not shown).

  When the evacuation operation is completed, based on a command from the command unit 81, the drive control unit 82 drives the drive motors 60a to 60d by torque control to raise the movable platen 2. At this time, since each drive motor 60a-60d is operating by torque control, each drive motor stops when the motor torque and the reaction force from the resin molding plate 31 become equal.

  More specifically, as shown in FIG. 10, when the movable platen 2 is raised by torque control by the drive motors 60 a to 60 d, the pressure block 16 further rises with the compression of the movable member 15, and the resin supply space 20. The inner resin molding material 18 is pressurized. By this pressurization, the resin supply space 20 is gradually reduced. While the resin supply space 20 is reduced, the resin molding material 18 is directly pressurized, and the pressurized resin molding material 18 passes through the runner 312 from the resin inflow hole 310 provided in the resin molding plate 31. Then, it is injected into the molding cavity 311. When the predetermined torque is reached, the drive motor stops.

  As shown in FIG. 10, after the drive motor is stopped and the mold is clamped, the resin molding material 18 is pressurized with the resin pressurizing plunger 33 as shown in FIG. Is received through the lower mold 32 and the heat from the heater unit 6 through the upper mold 30 to be cured.

  Here, the resin pressure plunger 33 performs pressure or pressure reduction on the resin molding material 18 independently. Therefore, if the pressure on the resin molding material 18 is not appropriate, the resin pressurizing plunger 33 can be further moved up and down for fine adjustment.

  The state shown in FIG. 11 is maintained and cured by heating from the upper mold 30 and the lower mold 32 over a certain period of time, whereby the substrate 12 has the shapes of the molding cavity 311 and the runner 312 of the resin molding plate 31. Based on the above, a lens-shaped sealing material is formed. At this time, the excess solid resin to be removed remains as it is between the resin molding plate 31 and the resin film 17 from the resin inflow hole 310.

  When the hard molding of the resin material pushed into the resin molding plate 31 is completed, the drive screws 6a to 6d are reversely rotated by the reverse rotation driving of the drive motors 60a to 60d to lower the movable platen 2. As described above, by lowering the movable platen 2, the lower mold 32 is lowered, and the upper mold 30 and the lower mold 32 are separated. At this time, since the upper mold 30, the substrate holder 11, the substrate 12, and the resin molding plate 30 are fixed to the upper platen 1, the resin film 17 provided on the upper surfaces of the lower mold 32 and the lower mold 32. Separated from.

  When the upper mold 30 and the lower mold 32 are separated from each other, the movable platen 2 is lowered at a low speed so that the resin in the resin inflow hole 310 portion of the resin molding plate 31 can be removed cleanly. At this time, the moving speed of the movable platen 2 is accelerated, for example, to be about 5 mm / second over about 2 seconds from the start of movement.

  When the movable platen 2 is lowered by controlling as described above, the resin cured at the resin inflow hole 310 and the residual solid resin remaining on the resin film 17 remain adhered to the resin film 17 while the resin film 17 is adhered. 17 together with the resin molding plate 31. Therefore, the residual solid resin is cleanly removed from the surface of the resin cured in the molding cavity 311 and the runner 312 of the resin molding plate 31.

  When the movable platen 2 is lowered to the position where the substrate can be taken out, each drive motor is stopped (S11), and the substrate on which the resin is formed, that is, the molded product is taken out to complete the resin molding step.

  On the other hand, in the first S1, if the change to a different type of mold, replacement to a different type of resin molding plate, or change in the temperature of the mold does not apply, the temperature adjustment by the heater unit of S2 is performed. move on. The temperature adjustment by the heater unit in S2 is performed in the same manner as the temperature adjustment by the heater unit in S3. And the resin molding process to S7-S11 is implemented, without adjusting the parallelism between the mold surfaces by S4-S6. Steps S7 to S11 are as described above. By repeating the above operations, resin molding defects can be prevented and production can be performed efficiently.

  In FIG. 4, first, as shown in S <b> 1, the parallelism between the mold surfaces is adjusted only when the mold is replaced with a different type of mold or resin molded plate, or when the temperature of the mold is changed. And then perform the resin molding process, and if it does not fall into one of different types of molds, exchange to different types of resin molded plates, or change in mold temperature, The resin molding step was performed without adjusting the parallelism between the surfaces. However, as shown in FIG. 5, the degree of parallelism between the mold surfaces is always maintained regardless of conditions such as replacement with different types of molds, replacement with different types of resin molding plates, and changes in the temperature of the molds. It is desirable to carry out the resin molding step after making the adjustment. The steps S3 to S11 in FIG. 5 are the same as the steps S3 to S11 described in FIG.

DESCRIPTION OF SYMBOLS 1 Upper platen 2 Movable platen 3 Lower platen 4 Base 5 Tie bar 6 Heater unit 7 Heater unit 10a-10d Heater unit 20a-20d Heater unit 30a-30i Pressure sensor 41 Position detector 42 Position detector 43 Position detector 44 Position detection 60a-60d Drive motor 61a-61d Drive screw 81 Command part 82 Drive control part 83 A / D conversion part 84 Temperature control part

Claims (2)

A substrate which the molded article is placed the resin wherein the resin is molded by combining a resin mold having a concave portion as a mold cavity to be injected,
A plurality of protrusions provided on the substrate on the surface side on which the molded article is disposed;
A substrate to be molded , wherein a gap is formed between the mold for resin molding and the molding cavity and the substrate in a state where the protrusion is in contact with the mold for resin molding. .   2. The molded substrate according to claim 1, wherein the projection has a characteristic that a projection shape is collapsed by applying a predetermined pressure or more between the resin molding die and the substrate. 3.

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