JPS6424836U - - Google Patents

Info

Publication number
JPS6424836U
JPS6424836U JP12054087U JP12054087U JPS6424836U JP S6424836 U JPS6424836 U JP S6424836U JP 12054087 U JP12054087 U JP 12054087U JP 12054087 U JP12054087 U JP 12054087U JP S6424836 U JPS6424836 U JP S6424836U
Authority
JP
Japan
Prior art keywords
block
insertion hole
spacer block
spacer
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12054087U
Other languages
Japanese (ja)
Other versions
JPH08757Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987120540U priority Critical patent/JPH08757Y2/en
Publication of JPS6424836U publication Critical patent/JPS6424836U/ja
Application granted granted Critical
Publication of JPH08757Y2 publication Critical patent/JPH08757Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体装置の樹脂封止装
置における下側の型板を示す断面図、第２図は他
の実施例を示す断面図、第３図は従来の半導体装
置の樹脂封止装置における下側の型板を示す断面
図である。 ３……ベース、４……サポートピン、６……チ
エイスブロツク、２１……ヒータブロツク、２２
……挿通孔、２３……スペーサブロツク、２６…
…段付ボルト、ｇ……間隔。 FIG. 1 is a sectional view showing a lower template in a resin sealing device for a semiconductor device according to the present invention, FIG. 2 is a sectional view showing another embodiment, and FIG. 3 is a conventional resin sealing device for a semiconductor device. FIG. 3 is a sectional view showing a lower template in the locking device. 3... Base, 4... Support pin, 6... Chase block, 21... Heater block, 22
...Insertion hole, 23...Spacer block, 26...
...stepped bolt, g... spacing.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ベース上に多数のサポートピンを介して設けら
れ加圧方向に開口する挿通孔を有するチエイスブ
ロツク保持用のヒータブロツクと、このヒータブ
ロツクと前記ベースとの間に設けられ前記サポー
トピンの外側に位置するスペーサブロツクと、こ
のスペーサブロツクに螺着され前記挿通孔を挿通
する位置決め用のボルトとを備え、前記ヒータブ
ロツクと前記スペーサブロツクとの間に間隔を設
けたことを特徴とする半導体装置の樹脂封止装置
。 A heater block for holding a chase block, which is provided on a base via a number of support pins and has an insertion hole that opens in the pressurizing direction; A semiconductor device comprising a spacer block and a positioning bolt that is screwed onto the spacer block and inserted through the insertion hole, and a space is provided between the heater block and the spacer block. Resin sealing equipment.
JP1987120540U 1987-08-05 1987-08-05 Resin encapsulation equipment for semiconductor devices Expired - Lifetime JPH08757Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987120540U JPH08757Y2 (en) 1987-08-05 1987-08-05 Resin encapsulation equipment for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987120540U JPH08757Y2 (en) 1987-08-05 1987-08-05 Resin encapsulation equipment for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS6424836U true JPS6424836U (en) 1989-02-10
JPH08757Y2 JPH08757Y2 (en) 1996-01-10

Family

ID=31366740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987120540U Expired - Lifetime JPH08757Y2 (en) 1987-08-05 1987-08-05 Resin encapsulation equipment for semiconductor devices

Country Status (1)

Country Link
JP (1) JPH08757Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307738A (en) * 2007-06-13 2008-12-25 Sumitomo Heavy Ind Ltd Compression molding mold and compression molding mold apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226827A (en) * 1985-07-27 1987-02-04 Mitsubishi Electric Corp Resin sealing device for semiconductor element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226827A (en) * 1985-07-27 1987-02-04 Mitsubishi Electric Corp Resin sealing device for semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307738A (en) * 2007-06-13 2008-12-25 Sumitomo Heavy Ind Ltd Compression molding mold and compression molding mold apparatus

Also Published As

Publication number Publication date
JPH08757Y2 (en) 1996-01-10

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