JPH085580Y2 - 樹脂多層プリント配線板 - Google Patents
樹脂多層プリント配線板Info
- Publication number
- JPH085580Y2 JPH085580Y2 JP1990011552U JP1155290U JPH085580Y2 JP H085580 Y2 JPH085580 Y2 JP H085580Y2 JP 1990011552 U JP1990011552 U JP 1990011552U JP 1155290 U JP1155290 U JP 1155290U JP H085580 Y2 JPH085580 Y2 JP H085580Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- pad electrode
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011552U JPH085580Y2 (ja) | 1990-02-09 | 1990-02-09 | 樹脂多層プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011552U JPH085580Y2 (ja) | 1990-02-09 | 1990-02-09 | 樹脂多層プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03102768U JPH03102768U (enExample) | 1991-10-25 |
| JPH085580Y2 true JPH085580Y2 (ja) | 1996-02-14 |
Family
ID=31515075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990011552U Expired - Lifetime JPH085580Y2 (ja) | 1990-02-09 | 1990-02-09 | 樹脂多層プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085580Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120999A (ja) * | 2004-10-25 | 2006-05-11 | Kyocera Corp | 多層配線基板 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57175385U (enExample) * | 1981-04-28 | 1982-11-05 | ||
| JPS58219798A (ja) * | 1982-06-14 | 1983-12-21 | 日本電気株式会社 | 多層配線基板 |
| JPS60140897A (ja) * | 1983-12-28 | 1985-07-25 | 日本電気株式会社 | 樹脂絶縁多層基板 |
| JPS616834A (ja) * | 1984-06-21 | 1986-01-13 | Fujitsu Ltd | 半導体装置の製造方法 |
-
1990
- 1990-02-09 JP JP1990011552U patent/JPH085580Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03102768U (enExample) | 1991-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4048438A (en) | Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips | |
| US5945741A (en) | Semiconductor chip housing having a reinforcing plate | |
| US6093970A (en) | Semiconductor device and method for manufacturing the same | |
| JPH098205A (ja) | 樹脂封止型半導体装置 | |
| TW200302530A (en) | Semiconductor device and manufacturing method therefor II | |
| US6184479B1 (en) | Multilayer printed circuit board having a concave metal portion | |
| TWI288590B (en) | Method of forming solder mask and circuit board with solder mask | |
| JPH085580Y2 (ja) | 樹脂多層プリント配線板 | |
| JP4146798B2 (ja) | 突き出しリードを介したtabフレキシブル回路の屈曲 | |
| JP2001015629A (ja) | 半導体装置及びその製造方法 | |
| JPH11111761A (ja) | 半導体チップ部品の実装体 | |
| JP2565387B2 (ja) | Icカード用プリント配線板とその製造方法 | |
| JP2937111B2 (ja) | 半導体装置とその製造方法 | |
| JPH0378793B2 (enExample) | ||
| JPS6359535B2 (enExample) | ||
| JP2715920B2 (ja) | 多層配線基板およびその製造方法 | |
| JPS61284991A (ja) | アルミニウム/銅複合箔張基板の回路形成法 | |
| JPH08204098A (ja) | 半導体装置用リードフレーム | |
| JP2953939B2 (ja) | 半導体装置用テープキャリア型パッケージ | |
| JP2752852B2 (ja) | Tab用テープキャリアの製造方法 | |
| JP2894267B2 (ja) | リードフレームとその製造方法と半導体装置 | |
| JP2532400Y2 (ja) | ハイブリットic | |
| JPH0491447A (ja) | 半導体素子の実装方法 | |
| JPH10138443A (ja) | スクリーン及びその製造方法 | |
| JP2000216183A (ja) | 接着剤層付きの突起状電極付き配線材料の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |