JPH03102768U - - Google Patents
Info
- Publication number
- JPH03102768U JPH03102768U JP1990011552U JP1155290U JPH03102768U JP H03102768 U JPH03102768 U JP H03102768U JP 1990011552 U JP1990011552 U JP 1990011552U JP 1155290 U JP1155290 U JP 1155290U JP H03102768 U JPH03102768 U JP H03102768U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- pad electrode
- resin multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011552U JPH085580Y2 (ja) | 1990-02-09 | 1990-02-09 | 樹脂多層プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011552U JPH085580Y2 (ja) | 1990-02-09 | 1990-02-09 | 樹脂多層プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03102768U true JPH03102768U (enExample) | 1991-10-25 |
| JPH085580Y2 JPH085580Y2 (ja) | 1996-02-14 |
Family
ID=31515075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990011552U Expired - Lifetime JPH085580Y2 (ja) | 1990-02-09 | 1990-02-09 | 樹脂多層プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085580Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120999A (ja) * | 2004-10-25 | 2006-05-11 | Kyocera Corp | 多層配線基板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57175385U (enExample) * | 1981-04-28 | 1982-11-05 | ||
| JPS58219798A (ja) * | 1982-06-14 | 1983-12-21 | 日本電気株式会社 | 多層配線基板 |
| JPS60140897A (ja) * | 1983-12-28 | 1985-07-25 | 日本電気株式会社 | 樹脂絶縁多層基板 |
| JPS616834A (ja) * | 1984-06-21 | 1986-01-13 | Fujitsu Ltd | 半導体装置の製造方法 |
-
1990
- 1990-02-09 JP JP1990011552U patent/JPH085580Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57175385U (enExample) * | 1981-04-28 | 1982-11-05 | ||
| JPS58219798A (ja) * | 1982-06-14 | 1983-12-21 | 日本電気株式会社 | 多層配線基板 |
| JPS60140897A (ja) * | 1983-12-28 | 1985-07-25 | 日本電気株式会社 | 樹脂絶縁多層基板 |
| JPS616834A (ja) * | 1984-06-21 | 1986-01-13 | Fujitsu Ltd | 半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120999A (ja) * | 2004-10-25 | 2006-05-11 | Kyocera Corp | 多層配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085580Y2 (ja) | 1996-02-14 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |