JPH08505435A - プラズマ補助反応性電子ビーム蒸発法 - Google Patents
プラズマ補助反応性電子ビーム蒸発法Info
- Publication number
- JPH08505435A JPH08505435A JP6510521A JP51052194A JPH08505435A JP H08505435 A JPH08505435 A JP H08505435A JP 6510521 A JP6510521 A JP 6510521A JP 51052194 A JP51052194 A JP 51052194A JP H08505435 A JPH08505435 A JP H08505435A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- measured
- film
- reactive gas
- evaporation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4236264.4 | 1992-10-27 | ||
| DE4236264A DE4236264C1 (enExample) | 1992-10-27 | 1992-10-27 | |
| PCT/DE1993/000748 WO1994010356A1 (de) | 1992-10-27 | 1993-08-18 | Verfahren zum plasmagestützten reaktiven elektronenstrahlbedampfen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08505435A true JPH08505435A (ja) | 1996-06-11 |
Family
ID=6471479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6510521A Pending JPH08505435A (ja) | 1992-10-27 | 1993-08-18 | プラズマ補助反応性電子ビーム蒸発法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5614248A (enExample) |
| EP (1) | EP0666934B1 (enExample) |
| JP (1) | JPH08505435A (enExample) |
| DE (2) | DE4236264C1 (enExample) |
| WO (1) | WO1994010356A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4343040C1 (de) * | 1993-12-16 | 1995-01-26 | Fraunhofer Ges Forschung | Barrierefolie |
| DE59608441D1 (de) * | 1996-01-10 | 2002-01-24 | Alcan Tech & Man Ag | Verfahren und Vorrichtung zum Beschichten einer Substratfläche |
| US6140773A (en) * | 1996-09-10 | 2000-10-31 | The Regents Of The University Of California | Automated control of linear constricted plasma source array |
| CA2241678C (en) * | 1997-06-26 | 2007-08-28 | General Electric Company | Silicon dioxide deposition by plasma activated evaporation process |
| JPH1129863A (ja) * | 1997-07-10 | 1999-02-02 | Canon Inc | 堆積膜製造方法 |
| US6420032B1 (en) | 1999-03-17 | 2002-07-16 | General Electric Company | Adhesion layer for metal oxide UV filters |
| US6426125B1 (en) | 1999-03-17 | 2002-07-30 | General Electric Company | Multilayer article and method of making by ARC plasma deposition |
| US6261694B1 (en) | 1999-03-17 | 2001-07-17 | General Electric Company | Infrared reflecting coatings |
| US6517687B1 (en) | 1999-03-17 | 2003-02-11 | General Electric Company | Ultraviolet filters with enhanced weatherability and method of making |
| US6365016B1 (en) | 1999-03-17 | 2002-04-02 | General Electric Company | Method and apparatus for arc plasma deposition with evaporation of reagents |
| US6875318B1 (en) | 2000-04-11 | 2005-04-05 | Metalbond Technologies, Llc | Method for leveling and coating a substrate and an article formed thereby |
| DE10019258C1 (de) * | 2000-04-13 | 2001-11-22 | Fraunhofer Ges Forschung | Verfahren zur Vakuumbeschichtung bandförmiger transparenter Substrate |
| US6444945B1 (en) | 2001-03-28 | 2002-09-03 | Cp Films, Inc. | Bipolar plasma source, plasma sheet source, and effusion cell utilizing a bipolar plasma source |
| JP2005535108A (ja) | 2002-05-23 | 2005-11-17 | ショット アーゲー | 高周波用途に適した導体構成を有する構成要素を製造する方法 |
| US7327089B2 (en) * | 2002-09-19 | 2008-02-05 | Applied Process Technologies, Inc. | Beam plasma source |
| US7411352B2 (en) * | 2002-09-19 | 2008-08-12 | Applied Process Technologies, Inc. | Dual plasma beam sources and method |
| DE10347521A1 (de) | 2002-12-04 | 2004-06-24 | Leybold Optics Gmbh | Verfahren zur Herstellung Multilayerschicht und Vorrichtung zur Durchführung des Verfahrens |
| US7038389B2 (en) * | 2003-05-02 | 2006-05-02 | Applied Process Technologies, Inc. | Magnetron plasma source |
| KR101602517B1 (ko) * | 2008-08-04 | 2016-03-10 | 에이지씨 플랫 글래스 노스 아메리카, 인코퍼레이티드 | Pecvd를 이용한 박막 코팅을 증착하기 위한 플라즈마 소스 및 방법 |
| DE102009034532A1 (de) * | 2009-07-23 | 2011-02-03 | Msg Lithoglas Ag | Verfahren zum Herstellen einer strukturierten Beschichtung auf einem Substrat, beschichtetes Substrat sowie Halbzeug mit einem beschichteten Substrat |
| DE102013110722A1 (de) * | 2013-09-27 | 2015-04-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Plasma-ionengestütztes Beschichtungsverfahren und Plasmasonde |
| ES2900321T3 (es) | 2014-12-05 | 2022-03-16 | Agc Flat Glass Na Inc | Fuente de plasma que utiliza un recubrimiento de reducción de macropartículas y procedimiento para usar una fuente de plasma que utiliza un recubrimiento de reducción de macropartículas para la deposición de recubrimientos de película delgada y modificación de superficies |
| MX2017007356A (es) | 2014-12-05 | 2018-04-11 | Agc Flat Glass Europe S A | Fuente de plasma del catodo hueco. |
| US9721764B2 (en) | 2015-11-16 | 2017-08-01 | Agc Flat Glass North America, Inc. | Method of producing plasma by multiple-phase alternating or pulsed electrical current |
| US9721765B2 (en) | 2015-11-16 | 2017-08-01 | Agc Flat Glass North America, Inc. | Plasma device driven by multiple-phase alternating or pulsed electrical current |
| US10242846B2 (en) | 2015-12-18 | 2019-03-26 | Agc Flat Glass North America, Inc. | Hollow cathode ion source |
| US10573499B2 (en) | 2015-12-18 | 2020-02-25 | Agc Flat Glass North America, Inc. | Method of extracting and accelerating ions |
| BE1029160B1 (nl) * | 2021-03-04 | 2022-10-03 | Soleras Advanced Coatings Bv | Depositie van niet-stoichiometrische metaalverbindingen |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3549416A (en) * | 1965-06-01 | 1970-12-22 | Gulf Energy & Environ Systems | Process for forming superconductive materials |
| US4024291A (en) * | 1975-06-17 | 1977-05-17 | Leybold-Heraeus Gmbh & Co. Kg | Control of vapor deposition |
| JPS55500588A (enExample) * | 1978-08-18 | 1980-09-04 | ||
| US4526802A (en) * | 1983-03-31 | 1985-07-02 | Clarion Co., Ltd. | Film deposition equipment |
| DE3406645A1 (de) * | 1984-02-24 | 1985-08-29 | Leybold-Heraeus GmbH, 5000 Köln | Spektralfotometeranordnung |
| US4514437A (en) * | 1984-05-02 | 1985-04-30 | Energy Conversion Devices, Inc. | Apparatus for plasma assisted evaporation of thin films and corresponding method of deposition |
| US4676646A (en) * | 1985-10-15 | 1987-06-30 | Energy Conversion Devices, Inc. | Method and apparatus for controlling thickness of a layer of an optical data storage device by measuring an optical property of the layer |
| DE3634598C2 (de) * | 1986-10-10 | 1994-06-16 | Leybold Ag | Verfahren und Vorrichtung zum reaktiven Aufdampfen von Metallverbindungen |
| US4837044A (en) * | 1987-01-23 | 1989-06-06 | Itt Research Institute | Rugate optical filter systems |
| US5055319A (en) * | 1990-04-02 | 1991-10-08 | The Regents Of The University Of California | Controlled high rate deposition of metal oxide films |
| JPH049748A (ja) * | 1990-04-27 | 1992-01-14 | Sharp Corp | ニオブ酸リチウム薄膜の評価方法およびその製造装置 |
| DE4017440C2 (de) * | 1990-05-30 | 1994-02-10 | Fraunhofer Ges Forschung | Verfahren zur Messung der Schichtdicke und des Brechungsindex einer dünnen Schicht auf einem Substrat und Vorrichtung zur Durchführung des Verfahrens |
| US5131752A (en) * | 1990-06-28 | 1992-07-21 | Tamarack Scientific Co., Inc. | Method for film thickness endpoint control |
| WO1994002832A1 (en) * | 1992-07-15 | 1994-02-03 | On-Line Technologies, Inc. | Method and apparatus for monitoring layer processing |
| US5354575A (en) * | 1993-04-16 | 1994-10-11 | University Of Maryland | Ellipsometric approach to anti-reflection coatings of semiconductor laser amplifiers |
| US5464710A (en) * | 1993-12-10 | 1995-11-07 | Deposition Technologies, Inc. | Enhancement of optically variable images |
-
1992
- 1992-10-27 DE DE4236264A patent/DE4236264C1/de not_active Expired - Fee Related
-
1993
- 1993-08-18 JP JP6510521A patent/JPH08505435A/ja active Pending
- 1993-08-18 EP EP93918891A patent/EP0666934B1/de not_active Expired - Lifetime
- 1993-08-18 DE DE59305985T patent/DE59305985D1/de not_active Expired - Fee Related
- 1993-08-18 US US08/424,418 patent/US5614248A/en not_active Expired - Fee Related
- 1993-08-18 WO PCT/DE1993/000748 patent/WO1994010356A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO1994010356A1 (de) | 1994-05-11 |
| EP0666934B1 (de) | 1997-03-26 |
| DE59305985D1 (de) | 1997-04-30 |
| US5614248A (en) | 1997-03-25 |
| DE4236264C1 (enExample) | 1993-09-02 |
| EP0666934A1 (de) | 1995-08-16 |
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