JPH084446Y2 - 半導体素子のテーピング形状 - Google Patents

半導体素子のテーピング形状

Info

Publication number
JPH084446Y2
JPH084446Y2 JP1987060210U JP6021087U JPH084446Y2 JP H084446 Y2 JPH084446 Y2 JP H084446Y2 JP 1987060210 U JP1987060210 U JP 1987060210U JP 6021087 U JP6021087 U JP 6021087U JP H084446 Y2 JPH084446 Y2 JP H084446Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
taping
tape
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987060210U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63166965U (en, 2012
Inventor
光政 岩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1987060210U priority Critical patent/JPH084446Y2/ja
Publication of JPS63166965U publication Critical patent/JPS63166965U/ja
Application granted granted Critical
Publication of JPH084446Y2 publication Critical patent/JPH084446Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
JP1987060210U 1987-04-21 1987-04-21 半導体素子のテーピング形状 Expired - Lifetime JPH084446Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987060210U JPH084446Y2 (ja) 1987-04-21 1987-04-21 半導体素子のテーピング形状

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987060210U JPH084446Y2 (ja) 1987-04-21 1987-04-21 半導体素子のテーピング形状

Publications (2)

Publication Number Publication Date
JPS63166965U JPS63166965U (en, 2012) 1988-10-31
JPH084446Y2 true JPH084446Y2 (ja) 1996-02-07

Family

ID=30892421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987060210U Expired - Lifetime JPH084446Y2 (ja) 1987-04-21 1987-04-21 半導体素子のテーピング形状

Country Status (1)

Country Link
JP (1) JPH084446Y2 (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100317275B1 (ko) * 1999-09-30 2001-12-24 장한봉 향기를 발산하는 비닐의 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5579600U (en, 2012) * 1978-11-28 1980-05-31
JPS61146271U (en, 2012) * 1985-02-28 1986-09-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100317275B1 (ko) * 1999-09-30 2001-12-24 장한봉 향기를 발산하는 비닐의 제조방법

Also Published As

Publication number Publication date
JPS63166965U (en, 2012) 1988-10-31

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