JPH083013Y2 - 固体撮像装置 - Google Patents
固体撮像装置Info
- Publication number
- JPH083013Y2 JPH083013Y2 JP1987191865U JP19186587U JPH083013Y2 JP H083013 Y2 JPH083013 Y2 JP H083013Y2 JP 1987191865 U JP1987191865 U JP 1987191865U JP 19186587 U JP19186587 U JP 19186587U JP H083013 Y2 JPH083013 Y2 JP H083013Y2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- package
- wiring
- insulating layer
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 24
- 239000011342 resin composition Substances 0.000 claims description 12
- 238000003856 thermoforming Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987191865U JPH083013Y2 (ja) | 1987-12-17 | 1987-12-17 | 固体撮像装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987191865U JPH083013Y2 (ja) | 1987-12-17 | 1987-12-17 | 固体撮像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0195747U JPH0195747U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-26 |
| JPH083013Y2 true JPH083013Y2 (ja) | 1996-01-29 |
Family
ID=31482756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987191865U Expired - Lifetime JPH083013Y2 (ja) | 1987-12-17 | 1987-12-17 | 固体撮像装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083013Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60136254A (ja) * | 1983-12-23 | 1985-07-19 | Toshiba Corp | 固体撮像装置およびその製造方法 |
| JPS62219948A (ja) * | 1986-03-20 | 1987-09-28 | Shinko Electric Ind Co Ltd | 半導体用パツケ−ジ |
-
1987
- 1987-12-17 JP JP1987191865U patent/JPH083013Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0195747U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-26 |