JPS6133644Y2 - - Google Patents

Info

Publication number

JPS6133644Y2

JPS6133644Y2 JP5733080U JP5733080U JPS6133644Y2 JP S6133644 Y2 JPS6133644 Y2 JP S6133644Y2 JP 5733080 U JP5733080 U JP 5733080U JP 5733080 U JP5733080 U JP 5733080U JP S6133644 Y2 JPS6133644 Y2 JP S6133644Y2

Authority

JP

Japan

Prior art keywords

printed circuit

circuit board

epoxy resin

frame

semiconductor chip

Prior art date

1980-04-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000004065 semiconductor Substances 0.000 claims description 34
• 239000003822 epoxy resin Substances 0.000 claims description 25
• 229920000647 polyepoxide Polymers 0.000 claims description 25
• 229920002050 silicone resin Polymers 0.000 claims description 20
• 229920005989 resin Polymers 0.000 claims description 12
• 239000011347 resin Substances 0.000 claims description 12
• 239000011248 coating agent Substances 0.000 claims description 6
• 238000000576 coating method Methods 0.000 claims description 6
• 229910052751 metal Inorganic materials 0.000 description 3
• 239000002184 metal Substances 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 239000012535 impurity Substances 0.000 description 2
• 239000000758 substrate Substances 0.000 description 2
• JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
• BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
• 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
• OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 230000001680 brushing effect Effects 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 238000009833 condensation Methods 0.000 description 1
• 230000005494 condensation Effects 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 150000002009 diols Chemical class 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
• 230000003301 hydrolyzing effect Effects 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 229910052698 phosphorus Inorganic materials 0.000 description 1
• 239000011574 phosphorus Substances 0.000 description 1
• 230000000379 polymerizing effect Effects 0.000 description 1
• 239000012264 purified product Substances 0.000 description 1
• 229910052710 silicon Inorganic materials 0.000 description 1
• 239000010703 silicon Substances 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1