JPH08226942A - Method for judging contact failure of test probe pin and in-circuit tester - Google Patents
Method for judging contact failure of test probe pin and in-circuit testerInfo
- Publication number
- JPH08226942A JPH08226942A JP7033421A JP3342195A JPH08226942A JP H08226942 A JPH08226942 A JP H08226942A JP 7033421 A JP7033421 A JP 7033421A JP 3342195 A JP3342195 A JP 3342195A JP H08226942 A JPH08226942 A JP H08226942A
- Authority
- JP
- Japan
- Prior art keywords
- probe pin
- test probe
- test
- resistance value
- contact failure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ＩＣを搭載したカー
ド（ＩＣカード）等の被試験対象の入出力端子に対する
試験用プローブピンの接触不良判断方法およびその方法
を適用してなるインサーキットテスタに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for determining a contact failure of a test probe pin with respect to an input / output terminal of an object to be tested such as a card having an IC (IC card) and an in-circuit tester to which the method is applied. It is about.
【０００２】[0002]
【従来の技術】従来、インサーキット方式の試験システ
ムでは、ＩＣカード等の被試験対象の入出力端子に対す
る試験用プローブピンの接触不良の判断は、被試験対象
に給電して、ターゲットポイントの電圧の有無で行った
り、電磁誘導を利用したりすることによって行ってい
た。2. Description of the Related Art Conventionally, in an in-circuit type test system, the determination of the contact failure of a test probe pin with respect to an input / output terminal of an object to be tested such as an IC card is performed by supplying power to the object to be tested and measuring the voltage at a target point. It was done with or without, or by using electromagnetic induction.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
試験用プローブピンの接触不良の判断方法では、試験用
プローブピンの接触不良を確実に検出することができる
とは言い難く、試験結果が不良になった場合に、被試験
対象の不良によるものか、試験用プローブピンの接触不
良によるものかの判別が困難で、試験結果に不確実性を
含むものであった。However, it cannot be said that the conventional method for determining the contact failure of the test probe pin can reliably detect the contact failure of the test probe pin, and the test result is not good. In this case, it was difficult to determine whether the test result was due to a failure of the test object or the contact failure of the test probe pin, and the test results included uncertainty.
【０００４】本発明はこのような課題を解決するために
なされたもので、その目的とするところは、試験用プロ
ーブピンの接触不良を事前にかつ確実に察知し、試験結
果の不確実性を除去することのできる試験用プローブピ
ンの接触不良判断方法およびインサーキットテスタを提
供することにある。The present invention has been made in order to solve such a problem, and its purpose is to detect the contact failure of the test probe pin in advance and surely, and to check the uncertainty of the test result. An object of the present invention is to provide a method for determining a contact failure of a test probe pin that can be removed, and an in-circuit tester.
【０００５】[0005]
【課題を解決するための手段】このような目的を達成す
るために、第１発明（請求項１に係る発明）は、インサ
ーキットテスタの試験用プローブピンを被試験対象（例
えば、ＩＣカード）の入出力端子に接触させ、試験用プ
ローブピンと被試験対象の所定の端子（電源端子又はＧ
ＮＤ端子）との間にその方向を異ならせて第１の測定用
電流および第２の測定用電流を流し、この第１の測定用
電流および第２の測定用電流によって試験用プローブピ
ンと被試験対象の所定の端子との間の抵抗値Ａ１および
Ｂ１を測定し、この測定した抵抗値Ａ１とＢ１との比較
結果に基づいて試験用プローブピンの被試験対象の入出
力端子に対する接触不良を判断するようにしたものであ
る。In order to achieve such an object, the first invention (the invention according to claim 1) uses a test probe pin of an in-circuit tester as an object to be tested (for example, an IC card). Contact the input / output terminal of the test probe pin and the predetermined terminal (power supply terminal or G
The first measurement current and the second measurement current are caused to flow in different directions from the ND terminal), and the test probe pin and the DUT are tested by the first measurement current and the second measurement current. Resistance values A1 and B1 with a predetermined target terminal are measured, and a contact failure of the test probe pin with respect to the input / output terminal of the test object is determined based on the comparison result of the measured resistance values A1 and B1. It is something that is done.
【０００６】第２発明（請求項２に係る発明）は、被試
験対象（例えば、ＩＣカード）の入出力端子に接触させ
た試験用プローブピンと被試験対象の所定の端子（電源
端子又はＧＮＤ端子）との間にその方向を異ならせて第
１の測定用電流および第２の測定用電流を流す測定用電
流供給手段と、第１の測定用電流および第２の測定用電
流によって試験用プローブピンと被試験対象の所定の端
子との間の抵抗値Ａ１およびＢ１を測定する抵抗測定手
段と、この抵抗測定手段により測定された抵抗値Ａ１お
よびＢ１を記憶する記憶手段と、この記憶手段の記憶す
る抵抗値Ａ１とＢ１との比較結果に基づいて試験用プロ
ーブピンの被試験対象の入出力端子に対する接触不良を
判断する接触不良判断手段とを設けたものである。A second invention (the invention according to claim 2) is a probe pin for a test, which is brought into contact with an input / output terminal of an object to be tested (for example, an IC card), and a predetermined terminal (power supply terminal or GND terminal) to be tested. ) And a measuring current supply means for flowing a first measuring current and a second measuring current in different directions from each other, and a test probe using the first measuring current and the second measuring current. Resistance measuring means for measuring resistance values A1 and B1 between the pin and a predetermined terminal to be tested, storage means for storing the resistance values A1 and B1 measured by the resistance measuring means, and storage of the storage means There is provided a contact failure determination means for determining contact failure of the test probe pin with respect to the input / output terminal of the test object based on the comparison result of the resistance values A1 and B1.
【０００７】[0007]
【作用】したがってこの発明によれば、極性の異なる第
１の測定用電流および第２の測定用電流によって、試験
用プローブピンと被試験対象の所定の端子との間の抵抗
値Ａ１およびＢ１が測定され、この測定された抵抗値Ａ
１とＢ１との比較結果に基づいて試験用プローブピンの
接触不良が判断される。According to the present invention, therefore, the resistance values A1 and B1 between the test probe pin and the predetermined terminal to be tested are measured by the first measurement current and the second measurement current having different polarities. This measured resistance value A
The contact failure of the test probe pin is determined based on the comparison result between 1 and B1.
【０００８】[0008]
【実施例】以下、本発明を実施例に基づき詳細に説明す
る。図１は本発明を適用してなるインサーキット方式の
試験システムの機能ブロック図である。同図において、
１は被試験対象としてのＩＣカード、１ａ，１ｂはＩＣ
カード１の入出力端子および電源端子、２はインサーキ
ットテスタである。インサーキットテスタ２は、試験用
プローブピン２−１，抵抗測定回路２−２，記憶部２−
３，測定用電流源２−４，変換部２−５および比較判断
部２−６を備えている。EXAMPLES The present invention will now be described in detail based on examples. FIG. 1 is a functional block diagram of an in-circuit type test system to which the present invention is applied. In the figure,
1 is an IC card to be tested, 1a and 1b are ICs
Input / output terminals and power supply terminals 2 of the card 1 are in-circuit testers. The in-circuit tester 2 includes a test probe pin 2-1, a resistance measuring circuit 2-2, and a storage unit 2-.
3, a measurement current source 2-4, a conversion unit 2-5, and a comparison / determination unit 2-6.
【０００９】この試験システムでは、ＩＣカード１の機
能試験を実施する前に、試験用プローブピン２−１の接
触不良を事前に検出することができる。この試験用プロ
ーブピン２−１の接触不良の検出は次のようして行われ
る。In this test system, the contact failure of the test probe pin 2-1 can be detected in advance before the functional test of the IC card 1 is carried out. The detection of the contact failure of the test probe pin 2-1 is performed as follows.
【００１０】すなわち、ＩＣカード１の機能試験を実施
する前に、ＩＣカード１の入出力端子１ａに接触させた
試験用プローブピン２−１と電源端子１ｂとの間に、測
定用電流源２−４および変換部２−５により、Ａ方向に
測定用微小電流を流す。このＡ方向に流れる測定用微小
電流によって、試験用プローブピン２−１と電源端子１
ｂとの間の抵抗値Ａ１が、抵抗測定回路２−２で測定さ
れる。この測定された抵抗値Ａ１は記憶部４で記憶され
る。That is, before carrying out the functional test of the IC card 1, the measuring current source 2 is provided between the test probe pin 2-1 brought into contact with the input / output terminal 1a of the IC card 1 and the power supply terminal 1b. -4 and the conversion unit 2-5 flow a minute current for measurement in the A direction. The test probe pin 2-1 and the power supply terminal 1 are caused by the measurement minute current flowing in the A direction.
The resistance value A1 between b and b is measured by the resistance measuring circuit 2-2. The measured resistance value A1 is stored in the storage unit 4.
【００１１】次に、測定用電流源２−４および変換部２
−５により、ＩＣカード１の入出力端子１ａに接触させ
た試験用プローブピン２−１と電源端子１ｂとの間に、
Ｂ方向に測定用微小電流を流す。このＢ方向に流れる測
定用微小電流によって、試験用プローブピン２−１と電
源端子１ｂとの間の抵抗値Ｂ１が、抵抗測定回路２−２
で測定される。この測定された抵抗値Ｂ１は記憶部４で
記憶される。Next, the measuring current source 2-4 and the converter 2
-5 between the test probe pin 2-1 brought into contact with the input / output terminal 1a of the IC card 1 and the power supply terminal 1b,
A minute current for measurement is passed in the B direction. Due to the measurement minute current flowing in the B direction, the resistance value B1 between the test probe pin 2-1 and the power supply terminal 1b is changed to the resistance measurement circuit 2-2.
Measured at. The measured resistance value B1 is stored in the storage unit 4.
【００１２】記憶部４に記憶された抵抗値Ａ１とＢ１と
は比較判断部２−６にて比較される。ＩＣ１はトランジ
スタ，ダイオード等の電子部品素子で構成されている。
このため、入出力端子１ａと電源端子１ｂとの間の抵抗
値は、測定用微小電流の極性によって、順方向特性また
は逆方向特性となるために、異なるという特性を有して
いる。The resistance values A1 and B1 stored in the storage unit 4 are compared by the comparison and determination unit 2-6. The IC 1 is composed of electronic component elements such as transistors and diodes.
Therefore, the resistance value between the input / output terminal 1a and the power supply terminal 1b has a characteristic of being different depending on the polarity of the measurement minute current because it has a forward characteristic or a reverse characteristic.
【００１３】従って、上記の測定結果として抵抗値Ａ１
とＢ１とが異なっていれば、試験用プローブピン２−１
はＩＣ１の入出力端子１ａに接触していることになる。
もし、抵抗値Ａ１とＢ１とがどちらも、無限大となり、
等しくなった場合は、試験用プローブピン２−１はＩＣ
１の入出力端子１ａに接触していないことになる。Therefore, as a result of the above measurement, the resistance value A1
And B1 are different, the test probe pin 2-1
Is in contact with the input / output terminal 1a of IC1.
If the resistance values A1 and B1 are both infinite,
If they are equal, the test probe pin 2-1 is the IC
This means that the first input / output terminal 1a is not in contact.
【００１４】比較判断部２−６は、記憶部４に記憶され
た抵抗値Ａ１とＢ１とを比較し、Ａ１とＢ１とが等しく
なければ、試験用プローブピン２−１と入出力端子１ａ
とが接触していると判断し、Ａ１とＢ１とが無限大で等
しければ、試験用プローブピン２−１と入出力端子１ａ
とが接触していないと判断する。The comparison / determination unit 2-6 compares the resistance values A1 and B1 stored in the storage unit 4, and if A1 and B1 are not equal, the test probe pin 2-1 and the input / output terminal 1a.
If A1 and B1 are infinite and equal to each other, it is determined that the test probe pin 2-1 and the input / output terminal 1a are in contact with each other.
Judge that and are not in contact.
【００１５】以上のような方式により、試験用プローブ
ピン２−１の接触接触不良を事前にかつ確実に察知し、
試験結果の不確実性を除去することができる。なお、本
実施例では、被試験対象をＩＣカードとしたが、ＩＣカ
ードに限られるものでないことは言うまでもない。ま
た、本実施例では、試験用プローブピン２−１とＩＣカ
ード１の電源端子１ｂとの間の抵抗値を測定するように
したが、電源端子１ｂ間と同様にしてＧＮＤ端子（図示
せず）間の抵抗値を測定するようにしてもよい。By the above-mentioned method, the contact failure of the test probe pin 2-1 can be detected in advance and surely.
Uncertainty in test results can be eliminated. In this embodiment, the test object is an IC card, but it goes without saying that the test object is not limited to the IC card. Further, in this embodiment, the resistance value between the test probe pin 2-1 and the power supply terminal 1b of the IC card 1 is measured, but the GND terminal (not shown) is used in the same manner as between the power supply terminals 1b. It is also possible to measure the resistance value between the two.
【００１６】[0016]
【発明の効果】以上説明したことから明らかなように本
発明によれば、極性の異なる第１の測定用電流および第
２の測定用電流によって、試験用プローブピンと被試験
対象の所定の端子との間の抵抗値Ａ１およびＢ１が測定
され、この測定された抵抗値Ａ１とＢ１との比較結果に
基づいて試験用プローブピンの接触不良が判断されるも
のとなり、試験用プローブピンの接触不良を事前にかつ
確実に察知し、試験結果の不確実性を除去することがで
きるようになる。As is apparent from the above description, according to the present invention, the test probe pin and the predetermined terminal to be tested are connected to each other by the first measuring current and the second measuring current having different polarities. The resistance values A1 and B1 between the two are measured, and the contact failure of the test probe pin is judged based on the comparison result of the measured resistance values A1 and B1. It will be possible to detect in advance and reliably and eliminate the uncertainty of the test result.
【図１】 本発明を適用してなるインサーキット方式の
試験システムの機能ブロック図である。FIG. 1 is a functional block diagram of an in-circuit type test system to which the present invention is applied.
１…ＩＣカード、１ａ…入出力端子、１ｂ…電源端子、
２…インサーキットテスタ、２−１…試験用プローブピ
ン、２−２…抵抗測定回路、２−３…記憶部、２−４…
測定用電流源、２−５…変換部、２−６…比較判断部。1 ... IC card, 1a ... Input / output terminal, 1b ... Power supply terminal,
2 ... In-circuit tester, 2-1 ... Test probe pin, 2-2 ... Resistance measurement circuit 2-3 ... Storage unit, 2-4 ...
Current source for measurement, 2-5 ... Conversion unit, 2-6 ... Comparison determination unit.
Claims (2)
ピンを被試験対象の入出力端子に接触させ、 前記試験用プローブピンと前記被試験対象の所定の端子
との間にその方向を異ならせて第１の測定用電流および
第２の測定用電流を流し、 この第１の測定用電流および第２の測定用電流によって
前記試験用プローブピンと前記被試験対象の所定の端子
との間の抵抗値（Ａ１）および抵抗値（Ｂ１）を測定
し、 この測定した抵抗値（Ａ１）と抵抗値（Ｂ１）との比較
結果に基づいて前記試験用プローブピンの前記被試験対
象の入出力端子に対する接触不良を判断するようにした
ことを特徴とする試験用プローブピンの接触不良判断方
法。1. A test probe pin of an in-circuit tester is brought into contact with an input / output terminal of a device under test, and the direction is made different between the test probe pin and a predetermined terminal of the device under test. Of the measurement current and the second measurement current, and the resistance value (A1) between the test probe pin and the predetermined terminal of the test object is generated by the first measurement current and the second measurement current. ) And resistance value (B1) are measured, and contact failure of the test probe pin with respect to the input / output terminal of the test object is determined based on the comparison result of the measured resistance value (A1) and resistance value (B1). A method for determining a contact failure of a probe pin for testing, which is characterized by making a determination.
験用プローブピンと被試験対象の所定の端子との間にそ
の方向を異ならせて第１の測定用電流および第２の測定
用電流を流す測定用電流供給手段と、 前記第１の測定用電流および前記第２の測定用電流によ
って前記試験用プローブピンと前記被試験対象の所定の
端子との間の抵抗値（Ａ１）および抵抗値（Ｂ１）を測
定する抵抗測定手段と、 この抵抗測定手段により測定された抵抗値（Ａ１）およ
び抵抗値（Ｂ１）を記憶する記憶手段と、 この記憶手段の記憶する抵抗値（Ａ１）と抵抗値（Ｂ
１）との比較結果に基づいて前記試験用プローブピンの
前記被試験対象の入出力端子に対する接触不良を判断す
る接触不良判断手段とを備えたことを特徴とするインサ
ーキットテスタ。2. A first measurement current and a second measurement current, the directions of which are different between a test probe pin brought into contact with an input / output terminal of a device under test and a predetermined terminal of the device under test. And a resistance value (A1) and a resistance value between the test probe pin and a predetermined terminal of the device under test by the first measurement current and the second measurement current. Resistance measuring means for measuring (B1), storage means for storing the resistance value (A1) and resistance value (B1) measured by the resistance measuring means, and the resistance value (A1) and resistance stored by the storage means. Value (B
An in-circuit tester, comprising: contact failure determination means for determining contact failure of the test probe pin with respect to the input / output terminal of the object to be tested based on a comparison result with 1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7033421A JP2730504B2 (en) | 1995-02-22 | 1995-02-22 | Test probe pin contact failure judgment method and in-circuit tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7033421A JP2730504B2 (en) | 1995-02-22 | 1995-02-22 | Test probe pin contact failure judgment method and in-circuit tester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08226942A true JPH08226942A (en) | 1996-09-03 |
| JP2730504B2 JP2730504B2 (en) | 1998-03-25 |
Family
ID=12386110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7033421A Expired - Lifetime JP2730504B2 (en) | 1995-02-22 | 1995-02-22 | Test probe pin contact failure judgment method and in-circuit tester |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2730504B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100577135B1 (en) * | 2004-05-21 | 2006-05-10 | 학교법인 울산공업학원 | Apparatus for generating bad contactor at connectors |
| KR100786598B1 (en) * | 2000-07-19 | 2007-12-21 | 가부시키가이샤 히타치세이사쿠쇼 | Semiconductor wafer, semiconductor chip and process for producing the semiconductor divice |
| JP2019138808A (en) * | 2018-02-13 | 2019-08-22 | トヨタ自動車株式会社 | Testing device |
-
1995
- 1995-02-22 JP JP7033421A patent/JP2730504B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100786598B1 (en) * | 2000-07-19 | 2007-12-21 | 가부시키가이샤 히타치세이사쿠쇼 | Semiconductor wafer, semiconductor chip and process for producing the semiconductor divice |
| KR100577135B1 (en) * | 2004-05-21 | 2006-05-10 | 학교법인 울산공업학원 | Apparatus for generating bad contactor at connectors |
| JP2019138808A (en) * | 2018-02-13 | 2019-08-22 | トヨタ自動車株式会社 | Testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2730504B2 (en) | 1998-03-25 |
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