JPH08124794A - Chip type ceramic electronic component and its manufacture - Google Patents

Abstract

PURPOSE: To restrain the generation of static electricity and reduce imperfect packaging, by applying charge preventing treatment to a chip type ceramic electronic component. CONSTITUTION: A chip type ceramic electronic component has outer electrodes 7, 8 on at least ceramic element 1. Charge preventing treatment is applied wholly or spot-wise to the component. As the charge preventing treatment, charge preventing films 4, 5 are formed, or the coefficient of friction is reduced by attaching lubricant on the surface. The charge preventing treatment is performed before the chip type ceramic electronic component is loaded in the supply apparatus of a mounting apparatus for mounting the chip type ceramic electronic component on a printed board. The charge preventing treatment is performed when the mounting apparatus is operated after the component is loaded on the supply equipment of the mounting apparatus for mounting the component on the printed board. Thereby the chip type electronic component wherein gathering due to static electricity is not generated when vibration is generated in a bulk supply apparatus of the mounting apparatus can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component such as a chip-type multilayer capacitor mounted on a printed circuit board or the like, which has been subjected to an antistatic treatment, and a manufacturing method thereof.

[0002]

2. Description of the Related Art With the recent miniaturization of electronic equipment, circuit parts in which electronic parts are mounted on a printed circuit board at high density are used. As the electronic parts for mounting at high density, for example, a chip shape is used. The chip-shaped electronic parts such as the monolithic ceramic capacitor and the chip-shaped ceramic thermistor are widely used. An automatic mounter is used to improve the work efficiency of mounting these chip-shaped electronic components on a printed circuit board. This automatic mounter arranges the supplied chip-shaped electronic components at a predetermined position on a printed circuit board. As a supply system for supplying the chip-shaped electronic components to the automatic mounter, the chip-shaped electronic components are supplied. A so-called taping method is also used in which each component is held along the length direction of the tape so that the component can be taken out one by one while moving the tape when necessary. In addition, this method requires taping cost, requires an inventory space, and has a problem of post-processing caused by discarding the tape after use and environmental resource protection, so that chip-shaped electronic components can be directly supplied in sequence. Chip-shaped electronic components are also supplied to the automatic mounter by the multi-bulk supply method or the one-by-one bulk supply method described above, and it has recently been attracting attention because it has the advantage of improving the operation rate of the automatic mounter. ing.

In the one-by-one bulk supply method, for example, a large number of so-called bulk chip-shaped electronic components in which a ceramic body such as an external electrode formed on both ends of the ceramic body is exposed are assembled, and one of them is individually selected. Is supplied to an automatic mounting machine.The method is to use an air convection method that stirs and arranges chip-shaped electronic parts in compressed state with compressed air, stirs in a rotary drum with blades, and aligns with blades. Drum agitation method, and a hopper method in which a vertically moving pipe is installed in a hopper that stores chip-shaped electronic parts, and the chip parts are guided one by one to this.
A scheme has been proposed.

In practice, a printed circuit board has a capacitor,
Not only are the types of inductors, resistors, etc. different, but it is necessary to mount a wide variety of chip-shaped electronic components with different characteristics. Therefore, a bulk case is required for each type of chip-shaped electronic components to be mounted. Prepare the chip-shaped electronic parts, store the chip-shaped electronic parts corresponding to each, take out the chip-second electronic parts to be mounted, move the corresponding bulk case to a predetermined position each time, and use the one-by-one supply method etc. We supply electronic parts to automatic mounting machines.

By the way, for example, a chip-shaped cylindrical ceramic capacitor of a chip-shaped electronic component is
One end of the cylindrical ceramic body 1 of which both ends are open is closed by a filling material to form a closing plate 6, a first electrode 2 is provided on the outer peripheral surface of the ceramic body 1, and one end of the ceramic body is formed. End portion formed continuously on the inner peripheral surface excluding the side and the outer peripheral surface on the other end side of the ceramic body 1, and the end portion on the one end side formed on the inner peripheral surface is covered with the coating material and formed on the outer peripheral surface. A second electrode 3 is provided whose portion is separated from the tip portion of the first electrode, and the insulating film 4 is provided on the tip portion and the gap between the first electrode and the second electrode which face each other. An insulating film 5 is provided on each electrode on the inner peripheral surface. Then, on the closing plate 6 on one end side of the ceramic body 1 and the second electrode on the open end face on the other end side, a closing plate electrode 7 connected to the second electrode and an open side end face electrode 8 are respectively provided. It was formed. Then, the first electrode and the second electrode at both ends are placed on predetermined soldering lands of the printed board,
Soldered by reflow soldering. Other chip-shaped electronic components also have external electrodes on both ends of the ceramic body in a similar manner, and are attached by soldering these to the soldering lands of the printed board.

[0006]

When such a chip-shaped electronic component is housed in the above-mentioned bulk case and the bulk case is moved to a predetermined position every time the component needs to be taken out, printing is performed. Since the bulk case is moved to a predetermined position for each type of component mounted on the substrate, the number of times increases, and the chip-shaped electronic component is vibrated and agitated in the bulk case each time. When vibrated in this way or in other ways, the chip-shaped electronic components are constantly rubbed against each other or the inner wall of the bulk case. For example, in a chip-shaped cylindrical ceramic capacitor, especially when the insulating film 4 is rubbed, Static electricity is likely to occur, so that the chip-shaped electronic components do not become separated from each other and form a bridge or the like in a lump, for example, in the above one-by-one supply method, the chip-shaped electronic components are not taken out and are not guided Cause This is the same problem because static electricity is easily generated in the ceramic element body and the insulating film both when the ceramic element body is exposed to other chip-shaped electronic parts and when it is covered with the insulating film. Occurs. In particular, recent chip-shaped electronic components have been downsized to 1.0
When a chip-shaped electronic component such as a so-called 1016 type chip component having a size of mm × 1.6 mm comes to be used, its weight is so small that the electrostatic attraction exceeds gravity,
The chip-shaped electronic parts cannot be separated individually, fall together, and cannot be taken out to the take-out part of the above-mentioned one-by-one supply system, impairing the guiding function. Also in the case of the taping method described above, the chip-shaped electronic component is housed in the concave portion of the base tape and then enclosed by the cover tape. Since the chip-shaped electronic components exposed by the suction device are taken out, static electricity is likely to be generated when the cover tape is peeled off because these tapes are made of a plastic material, which may cause a problem that they cannot be taken out by the suction device. . As described above, unless the chip-shaped electronic component is supplied to the automatic mounter, the chip-shaped electronic component is not mounted on the printed board, resulting in mounting failure.

A first object of the present invention is to provide a chip-shaped electronic component in which it is difficult to form a lump by static electricity even when it is vibrated in a bulk supply device of a mounting device, and a manufacturing method thereof. A second object of the present invention is to provide a chip-shaped electronic component in which static electricity is not generated when the chip-shaped electronic component is supplied to a mounting apparatus by a taping method and a manufacturing method thereof. A third object of the present invention is to provide a chip-shaped electronic component that is less likely to cause mounting defects on a printed circuit board and a method for manufacturing the same. A fourth object of the present invention is to provide a chip-shaped electronic component which can improve the work efficiency and yield of mounting on a printed circuit board and can enhance the productivity, and a manufacturing method thereof.

[0008]

In order to solve the above-mentioned problems, the present invention provides (1) a chip-shaped ceramic electronic component having at least an external electrode on a ceramic body,
The present invention provides a chip-shaped ceramic electronic component that has been subjected to an antistatic treatment as a whole or in spots. The present invention also provides (2) the chip-shaped ceramic electronic component according to (1) above, wherein the antistatic treatment is to form an antistatic film.
(3), the antistatic treatment is to reduce the coefficient of friction by attaching a lubricant, and (4) the antistatic treatment is to mount the chip ceramic electronic component on a printed wiring board. The chip-shaped ceramic electronic component according to the above (1) or (2), which is performed before the chip-shaped ceramic electronic component is loaded into the mounting device of the mounting device to be mounted, (5) A method for manufacturing a chip-shaped ceramic electronic component according to the above (1), which is performed when the mounting device for mounting a component on a printed wiring board is loaded with the chip-shaped ceramic electronic component and then the mounting device is operated. Is.

In the present invention, as the chip-shaped ceramic electronic component, a chip-shaped cylindrical capacitor, a chip-shaped resistor, a chip-shaped ferrite bead inductor, an NTC or PTC type chip-shaped thermistor, a chip-shaped varistor, and a chip-shaped laminated electron Examples of the chip-shaped multilayer electronic component include a chip-shaped multilayer ceramic capacitor, a chip-shaped multilayer ceramic inductor, a chip-shaped multilayer ceramic transformer, and a chip-shaped multilayer ceramic LC component. In the present invention, the ceramic body is mainly composed of a fired body of a ceramic material. When the electronic component using this is a thermistor, it is a resistor, and when it is a ferrite bead, a conductor coated with a magnetic body. , A laminated body in which ceramic layers are laminated with internal electrodes sandwiched, a laminated ceramic inductor, and a laminated ceramic transformer in which ceramic layers are laminated with internal conductors are laminated. The ceramic body conforms to these.

In the present invention, "having at least external electrodes on the ceramic body" means not only the case where external electrodes are provided on both ends of the ceramic body, but also an insulating film is formed on the ceramic body between the external electrodes. This is also the case when they have. The external electrode has a conductive material paste film containing a conductor such as silver, a nickel or copper plating layer formed thereon, and a tin-containing plating layer further formed thereon,
Although many electrodes have a structure in which the tin-containing plating layer is exposed, the present invention is not limited to this.

In the present invention, the "antistatic treatment" means
When an antistatic film is formed on the ceramic body or an insulating film formed on it, or when a lubricant is applied to chip-shaped electronic parts to reduce the friction coefficient and prevent static electricity from being generated by friction. Of at least one of The insulating film and the antistatic film may be the same. Also,
The phrase "whole or spot-like antistatic treatment has been performed" means that the entire surface of the chip-shaped electronic component may be subjected to antistatic treatment, but spot-like antistatic treatment may be performed. Can suppress the generation of static electricity only in the portion where the antistatic film is formed, and the friction coefficient can be reduced by scattering the lubricant. When the antistatic film and the lubricant are used in combination, for example, the lubricant may be applied on the antistatic film entirely or in spots. The antistatic film is a film capable of suppressing or preventing the generation of static electricity, and examples of the material of such an antistatic film include alkyl quaternary ammonium compounds such as compounds represented by the following general formula.

[0012]

Embedded image

(In the formula, R ¹ , R ² , R ³ and R ⁴ are the same or different alkyl groups, and X ⁻ is an anion such as a halogen ion.)

Further, examples of the lubricant include higher fatty acids and their derivatives, examples of the higher fatty acids include stearic acid and linear saturated fatty acids having a carbon number in the vicinity thereof, and other long-chain carboxylic acids. It is preferably used. Examples of higher fatty acid derivatives include higher fatty acid esters and amides. The antistatic film material and the lubricant are used as they are, or dissolved in a solvent or dispersed in a solvent, but the solution or dispersion may further contain a resin and other additives. In this case, a heat-resistant resin such as an epoxy resin is preferable as the resin.

The antistatic film is formed by dipping a solution of the material into a ceramic body or an insulating film of a chip-shaped electronic component,
It may be applied by spraying or the like to form a uniform film on the surface, but a sol of a concentrated solution or dispersion of the material may be applied by another method as well to form a film in spots. The same applies when a lubricant treatment is performed. In this case, a monomolecular film may be formed. In addition, these materials, solutions or dispersions thereof are added from or into the chip-shaped electronic component supply device, and the supply device is operated to vibrate or stir the chip-shaped electronic component. The surface may be subjected to antistatic treatment.

As a supply device for supplying the chip-shaped electronic parts to the automatic mounter, a multi-bulk supply system, a one-by-one bulk supply system or other chip-shaped electronic parts are gathered in a loose state, and vibrations thereof are rubbed against each other. It can be used for either a feeding device that feeds one by one or a small number one after another. At that time, the chip-shaped electronic components are housed in the bulk case for each type, the bulk case is moved to a predetermined position every time it is necessary to take out the chip-shaped electronic component, and in the case of the supply device that supplies by these supply methods, Since the electronic component is vibrated each time the bulk case moves, the antistatic treatment according to the present invention is particularly effective.

[0017]

The static electricity is generated when the chip-shaped electronic component with the antistatic film formed on the ceramic body or the insulating film is rubbed, or when the tape is peeled off to expose the component. Hard to occur. Further, it is considered that the lubricant can suppress or prevent the generation of static electricity due to friction by reducing the friction coefficient of the coated surface, but the details of the mechanism are not clear and are limited to these ideas. Not a thing.

[0018]

Embodiments of the present invention will now be described with reference to the drawings. Example 1 As shown in FIG. 1, for example, a so-called 2125 type chip-shaped cylindrical ceramic capacitor having a size and shape of 2.1 mm × 2.5 mm is prepared. At this time, the insulating films 4, 5
Was formed of a two-component curable epoxy resin coating material containing a main agent and a curing agent, to which an antistatic agent was added. That is, the main agent (composition mainly composed of epoxy resin and solvent)
And a curing agent (a composition containing a xylene resin, an acid anhydride, an imidazole, and a solvent as a main component) in a solid content ratio of 10
100 parts by weight of the coating material obtained by mixing at a ratio of 0: 9 was added to Statistice (Antistatic agent manufactured by Takihara Sangyo Co., Ltd. (59% by weight of quaternary ammonium compound, 40% of isopropanol).
%, Ethanol 1% by weight)) was added to 0.5 parts by weight of an antistatic agent-containing coating at predetermined positions in the drawing, and 100%
Baking for 1 minute at ℃. The first electrode 2 and the second electrode 3
Is an electrode material paste consisting of zinc powder, binder, etc., dried at 150 ° C. for 10 minutes, and then 700 ° C.
Baking is performed for 10 minutes, and then electroless plating of copper is applied thereon to form the closing plate 6. As the internal filling paint, a coating composed of the above-mentioned main component and a curing agent (solid content ratio 100: 9) is used. The plate electrode 7 and the open-side end surface electrode 8 were formed by applying an electrode material paste composed of Ni powder, resin, solvent, etc., curing (180 ° C., 5 minutes), and further performing Ni plating and solder plating. 21 thus obtained
25-type chip-shaped cylindrical ceramic capacitor 10
0 pieces are put in a bulk case having a volume of 100 mm × 35 mm × 12 mm, vibrated at an amplitude of 1.5 mm and a frequency of 55 Hz for 5 minutes, and the static electricity amount (C) is measured using a Faraday gauge.

Example 2 In Example 1, 100 pieces of 2125 type chip-shaped cylindrical ceramic capacitors which were similarly subjected to antistatic treatment except that 0.5 part of stearic acid was used instead of the antistatic agent were prepared. Then, Table 1 shows the results of the same examination as in Example 1.

Comparative Example 1 A 2125 type chip-shaped cylindrical ceramic capacitor was prepared in the same manner as in Example 1 except that the antistatic agent was not used, and the results of the same examination as in Example 1 are shown in Table 1. Show.

[0021]

[Table 1]

[0022]

According to the present invention, since the chip-shaped ceramic electronic parts are subjected to the antistatic treatment, they are rubbed against each other by being vibrated or the like in a bulk feeder for supplying the chip-shaped ceramic electronic parts to an automatic mounting machine. Even if this happens, it is possible to suppress or prevent the generation of static electricity. As a result, the chip-shaped ceramic electronic component is smoothly supplied from the supply device. Further, in the case of the taping method, it is possible to suppress or prevent static electricity from being generated in the chip-shaped ceramic electronic component when the cover tape is peeled off, whereby the chip-shaped ceramic electronic component can be taken out smoothly. . In this way, when the chip-shaped ceramic electronic components are smoothly supplied to the automatic mounter, it is possible to reduce mounting defects, improve product yield, and improve work efficiency and productivity.

[Brief description of drawings]

FIG. 1 is a sectional view of a chip-shaped ceramic electronic component according to an embodiment of the present invention.

[Explanation of symbols]

 1 Ceramic body 4, 5 Insulating film (insulating film for antistatic treatment) 7, 8 Closing plate electrode as an external electrode, open side end face electrode

Claims (5)

[Claims] 1. A chip-shaped ceramic electronic component having an external electrode on at least a ceramic body, wherein the chip-shaped ceramic electronic component is subjected to an antistatic treatment wholly or in spots. 2. The chip-shaped ceramic electronic component according to claim 1, wherein the antistatic treatment is to form an antistatic film. 3. The chip-shaped ceramic electronic component according to claim 1, wherein the antistatic treatment is to apply a lubricant to reduce the friction coefficient. 4. The chip according to claim 1, wherein the antistatic treatment is performed before the chip-shaped ceramic electronic component is loaded into a supply device of a mounting device for mounting the chip-shaped ceramic electronic component on a printed wiring board. Shaped ceramic electronic components. 5. The antistatic treatment is performed when the mounting device is operated after the mounting device for mounting the chip-shaped ceramic electronic component on the printed wiring board is loaded with the chip-shaped ceramic electronic component. Method for manufacturing chip-shaped ceramic electronic component of.