JPH02227908A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH02227908A JPH02227908A JP4953489A JP4953489A JPH02227908A JP H02227908 A JPH02227908 A JP H02227908A JP 4953489 A JP4953489 A JP 4953489A JP 4953489 A JP4953489 A JP 4953489A JP H02227908 A JPH02227908 A JP H02227908A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- ferrite
- silver
- electrode
- ferrite element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 16
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- 239000005388 borosilicate glass Substances 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 206010016275 Fear Diseases 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は、例えば積層チップコイル、巻線タイプのチ
ップコイルなどの面実装可能なチップ部品において、そ
のフェライト素体に直接電極を形成させるために用いる
導電ペーストに関するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention is for forming electrodes directly on a ferrite element body of a surface-mountable chip component such as a laminated chip coil or a wire-wound chip coil. The present invention relates to conductive paste used for.
〈従来の技術〉
従来の導電ペーストは一般的に銀または銀パラジウム（
ＡｇまたはＡｇ−Ｐｄ）の粉末にバインダーおよび硼珪
酸ガラスなどのフリットを添加混合したものである。こ
のような導電ペーストはフェライト素体の表面に塗布し
て乾燥せしめたのち焼付けることにより電極を形成する
。<Prior art> Conventional conductive pastes are generally made of silver or silver palladium (
A binder and a frit such as borosilicate glass are added to and mixed with Ag or Ag-Pd powder. Such a conductive paste is applied to the surface of a ferrite element, dried, and then baked to form an electrode.
この従来の導電ペーストにおけるフリットは導電ペース
トにより形成した電極表面にＮｉ、 Ｓｎメツキを施す
ときに電極層内にメツキ液が浸透しないようにする役目
を果している。The frit in this conventional conductive paste serves to prevent the plating solution from penetrating into the electrode layer when Ni or Sn plating is applied to the surface of the electrode formed by the conductive paste.
〈発明が解決しようとする課題〉
上記のような従来の導電ペーストは焼付けをしてもフェ
ライト素体との化学的反応は起こし難（、焼付けによる
電極の熱収縮やフェライト素体表面の凹凸部の凹部への
くい込みなどにより物理的に接着されているにすぎない
。<Problems to be Solved by the Invention> The conventional conductive paste as described above does not easily cause a chemical reaction with the ferrite element even after baking (it does not cause thermal contraction of the electrode due to baking or unevenness on the surface of the ferrite element). It is merely physically bonded by being inserted into the recess.
従って、形成した電極表面にリード線を半田付けして引
張試験を行なった場合、３ＯＮ ／４ｍｍφ以下の低い
引張強度を示し、接着面からはがれ易いという問題があ
る。Therefore, when a lead wire is soldered to the surface of the formed electrode and a tensile test is performed, the lead wire shows a low tensile strength of 3ON/4 mmφ or less, and there is a problem that it easily peels off from the adhesive surface.
このため面実装時または振動によって接着面から電極が
はがれてチップ部品が剥離してしまうおそれがある。For this reason, there is a risk that the electrodes will peel off from the adhesive surface during surface mounting or due to vibration, causing the chip components to peel off.
この発明は上記のような従来の導電ペーストの問題点に
鑑みても、フェライト素体との接着強度が大で、引張強
度の強い導電ペーストを提供することを課題とする。In view of the problems of conventional conductive pastes as described above, it is an object of the present invention to provide a conductive paste that has high adhesive strength to a ferrite element body and high tensile strength.
〈課題を解決するための手段〉
上記の課題を解決するために、この発明は導電ペースト
を構成する主成分にフェライト素体成分を添加したもの
を提供する。<Means for Solving the Problems> In order to solve the above problems, the present invention provides a conductive paste in which a ferrite element component is added to the main component constituting the paste.
また、上記主成分として、銀または銀パラジウムを用い
たもの、あるいは上記フェライト素体成分がＦｅａＯａ
、 Ｎｉ０１ＣｕＯ、ＺｎＯ、ＭｎＯなどの酸化物粉
末を用いたものがある。In addition, as the main component, silver or silver palladium is used, or the ferrite element component is FeOa.
, Ni01CuO, ZnO, MnO, and other oxide powders are used.
さらに、銀または銀パラジウムの粉末、バインダーおよ
び硼珪酸ガラス粉末からなる導電ペーストに、銀または
銀パラジウム粉末１００重量％に対し、フェライト素体
成分であるＦｅａｒｓ 、Ｎｉ０１ＣｕＯ、ＺｎＯ、Ｍ
ｎＯなどの酸化物粉末の一種または二種以上を２〜２０
重量％添加したものを提供する。Furthermore, the ferrite body components Fears, Ni01CuO, ZnO, M
2 to 20 kinds of one or more kinds of oxide powder such as nO
% by weight added.
この発明は、上記のようなものであるが、さらに詳細に
説明すれば、ＡｇまたはＡｇ−Ｐｄ粉末、バインダーお
よび硼硅酸ガラス粉末にＦｅ２ｒｓ ＊ Ｎｉ０１Ｃｕ
Ｏ、ＺｎＯ、ＭｎＯの酸化物粉末を２〜２０重量％添加
した導電ペーストをＮｉ−Ｚｎ、 Ｎｉ−Ｃｕ−Ｚｎフ
ェライトからなる素体に塗布したのち焼付けを行なう。This invention is as described above, but to explain in more detail, Fe2rs*Ni01Cu is added to Ag or Ag-Pd powder, a binder, and borosilicate glass powder.
A conductive paste containing 2 to 20% by weight of oxide powders of O, ZnO, and MnO is applied to an element body made of Ni--Zn and Ni--Cu--Zn ferrite, and then baked.
これにより、フェライト素体と電極接触面付近に存在す
るこれら酸化物がフェライト素体内に固溶する。つまり
、フェライト素体と電極間で化学的反応が起り、従来の
ものに比較して強固な結合がなされる。As a result, these oxides present in the vicinity of the contact surface between the ferrite element and the electrode form a solid solution in the ferrite element. In other words, a chemical reaction occurs between the ferrite element and the electrode, resulting in a stronger bond than in conventional ones.
これは、引張試験ではフェライト素体と電極の接触面で
なくフェライト素体の中から破壊していることからも推
定できる。This can also be inferred from the fact that in the tensile test, the ferrite element broke not from the contact surface between the ferrite element and the electrode, but from within the ferrite element.
酸化物添加量を２〜２０重量％としており２重量％以下
ではその化学的反応の力が弱く効果が非常に小さい。ま
た、２０重量％以上の場合には本来の導電性が損なわれ
て電気抵抗値が太き（なり、また、半田が電極的に均一
に付かなくなる。The amount of oxide added is 2 to 20% by weight, and if it is less than 2% by weight, the chemical reaction is weak and the effect is very small. Furthermore, if the amount is 20% by weight or more, the original conductivity is impaired, the electrical resistance value increases (and the solder does not adhere uniformly to the electrodes).
〈実施例〉 以下、さらに具体的な実施例について説明する。<Example> More specific examples will be described below.
Ｎｉ−Ｚｎ％Ｎｉ−Ｃｕ−Ｚｎからなるフェライト素体
により５ｍｍ Ｘ ５ｍｍ Ｘ １ｍｍのフェライト基
板をつ（す、その両面にＡｇ粉末またはＡｇ−Ｐｄ粉末
、バインダー ４重置％の硼珪酸ガラス粉末にＦｅａｒ
ｓ、ＮｉＯ、ＣｕＯ、ＺｎＯ、ＭｎＯの酸化物粉末を２
〜２０重量％添加した導電ペーストを４ｍｍφの大きさ
に塗布し、８２０℃で焼付けて電極を形成し、この電極
部にＮｉおよびＳｎメツキを施して試料基板をつ（る。A ferrite substrate of 5 mm x 5 mm x 1 mm is made of a ferrite element body made of Ni-Zn%Ni-Cu-Zn.A ferrite substrate of 5 mm x 5 mm x 1 mm is coated on both sides with Ag powder or Ag-Pd powder and a binder of 4% borosilicate glass powder. Fear
s, NiO, CuO, ZnO, MnO oxide powders
A conductive paste containing ~20% by weight is applied to a size of 4 mm and baked at 820° C. to form an electrode. This electrode portion is plated with Ni and Sn, and a sample substrate is assembled.
この試料基板の電極部に０．８φのリード線を半田付け
する。A 0.8φ lead wire is soldered to the electrode portion of this sample substrate.
このリード線の両端を引張り破断したときの強度値を表
１および表２に示す。Tables 1 and 2 show the strength values when both ends of this lead wire were pulled and broken.
表１
＾ｇ＋４％硼珪酸ガラス＋酸化物
表２
へｇ９ｓ部−Ｐｄ
５部＋４％硼珪酸ガラス＋酸化物
Ａｇ＋ ４％硼珪酸ガラスにＮｉＯを添加したときの電
気抵抗率は
添加量（ｗｔ％） 電気抵抗率（Ω−ＣＩ１１）０
６ Ｘｌ０−’
２ ２．７ Ｘｌ０−’
１０ ５．２ Ｘｌ０−’２０
８．１ Ｘｌ０−’３０ １５．６ ｘ
１０−’〈発明の効果〉
この発明の導電ペーストは以下に列記する効果がある。Table 1 ＾g + 4% borosilicate glass + oxide Table 2 g9s part - Pd 5 parts + 4% borosilicate glass + oxide Ag + When NiO is added to 4% borosilicate glass, the electrical resistivity is the added amount (wt%) ) Electrical resistivity (Ω-CI11) 0
6 Xl0-' 2 2.7 Xl0-' 10 5.2 Xl0-'20
8.1 Xl0-'30 15.6 x
10-'<Effects of the Invention> The conductive paste of the present invention has the effects listed below.
１、フェライト素体を形成する組成酸化物を添加するこ
とによって電極とフェライト素体間で化学的反応が起り
、強固な電極接合が得られる。1. Composition for forming a ferrite element By adding an oxide, a chemical reaction occurs between the electrode and the ferrite element, resulting in a strong electrode bond.
低価格の酸化物を添加するために電極のコスト低減が可
能となる。The cost of the electrode can be reduced by adding a low-cost oxide.
プリント基板への実装時における電極はがれが大巾に少
なくなり信頼性が向上する。Electrode peeling during mounting on a printed circuit board is greatly reduced, improving reliability.
電子機器や電子回路を有する各種機器の搬３． ２゜ ４ 。Transportation of various devices with electronic equipment and electronic circuits 3. 2゜ 4.
速時の振動に対しても電極はかれかな（なり信頼性が大
きくなる。The electrodes are fragile even against vibrations at high speeds (this increases reliability).
Claims (4)
成分を添加したことを特徴とする導電ペースト。(1) A conductive paste characterized by adding a ferrite element component to the main components constituting the conductive paste.
たことを特徴とする請求項（１）記載の導電ペースト。(2) The conductive paste according to claim (1), wherein silver or silver palladium is used as the main component.
Ｏ、ＣｕＯ、ＺｎＯ、ＭｎＯなどの酸化物粉末であるこ
とを特徴とする請求項（１）記載の導電ペースト。(3) The above ferrite body components are Fe_2O_3, Ni
The conductive paste according to claim 1, wherein the conductive paste is an oxide powder of O, CuO, ZnO, MnO, or the like.
硼珪酸ガラス粉末からなる導電ペーストに、銀または銀
パラジウム粉末１００重量％に対し、フェライト素体成
分であるＦｅ＿２Ｏ＿３、ＮｉＯ、ＣｕＯ、ＺｎＯ、Ｍ
ｎＯなどの酸化物粉末の一種または二種以上を２〜２０
重量％添加したことを特徴とする請求項（１）記載の導
電ペースト。(4) The ferrite body components Fe_2O_3, NiO, CuO, ZnO, M are added to a conductive paste consisting of silver or silver-palladium powder, a binder, and borosilicate glass powder, based on 100% by weight of silver or silver-palladium powder.
2 to 20 kinds of one or more kinds of oxide powder such as nO
The conductive paste according to claim 1, wherein the conductive paste is added in an amount of % by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1049534A JPH0777085B2 (en) | 1989-02-28 | 1989-02-28 | Ferrite chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1049534A JPH0777085B2 (en) | 1989-02-28 | 1989-02-28 | Ferrite chip parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02227908A true JPH02227908A (en) | 1990-09-11 |
| JPH0777085B2 JPH0777085B2 (en) | 1995-08-16 |
Family
ID=12833829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1049534A Expired - Lifetime JPH0777085B2 (en) | 1989-02-28 | 1989-02-28 | Ferrite chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0777085B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05290623A (en) * | 1991-12-03 | 1993-11-05 | E I Du Pont De Nemours & Co | Thick film conductive paste for automotive glass |
| WO1998005045A1 (en) * | 1996-07-26 | 1998-02-05 | Tdk Corporation | Conductor paste and multilayer ceramic part using the same |
| US6007758A (en) * | 1998-02-10 | 1999-12-28 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
| JP2009064896A (en) * | 2007-09-05 | 2009-03-26 | Taiyo Yuden Co Ltd | Wire-winded type electronic component |
| JP2013084701A (en) * | 2011-10-07 | 2013-05-09 | Taiyo Yuden Co Ltd | Electronic component and method of manufacturing the same |
| JP2020177908A (en) * | 2019-04-18 | 2020-10-29 | 三ツ星ベルト株式会社 | Conductive composition, metallized substrate and method for producing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54140959A (en) * | 1978-04-25 | 1979-11-01 | Nippon Electric Co | Method of producing laminated ceramic capacitor |
| JPS5757406A (en) * | 1980-09-24 | 1982-04-06 | Matsushita Electric Ind Co Ltd | Conductive fine powder for conductive paste |
| JPS592305A (en) * | 1982-06-28 | 1984-01-07 | Tdk Corp | Electric parts having external terminal |
| JPS62263894A (en) * | 1986-05-09 | 1987-11-16 | Dai Ichi Kogyo Seiyaku Co Ltd | Conductive copper paste |
-
1989
- 1989-02-28 JP JP1049534A patent/JPH0777085B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54140959A (en) * | 1978-04-25 | 1979-11-01 | Nippon Electric Co | Method of producing laminated ceramic capacitor |
| JPS5757406A (en) * | 1980-09-24 | 1982-04-06 | Matsushita Electric Ind Co Ltd | Conductive fine powder for conductive paste |
| JPS592305A (en) * | 1982-06-28 | 1984-01-07 | Tdk Corp | Electric parts having external terminal |
| JPS62263894A (en) * | 1986-05-09 | 1987-11-16 | Dai Ichi Kogyo Seiyaku Co Ltd | Conductive copper paste |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05290623A (en) * | 1991-12-03 | 1993-11-05 | E I Du Pont De Nemours & Co | Thick film conductive paste for automotive glass |
| WO1998005045A1 (en) * | 1996-07-26 | 1998-02-05 | Tdk Corporation | Conductor paste and multilayer ceramic part using the same |
| US6007758A (en) * | 1998-02-10 | 1999-12-28 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
| US6153078A (en) * | 1998-02-10 | 2000-11-28 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
| JP2009064896A (en) * | 2007-09-05 | 2009-03-26 | Taiyo Yuden Co Ltd | Wire-winded type electronic component |
| JP2013084701A (en) * | 2011-10-07 | 2013-05-09 | Taiyo Yuden Co Ltd | Electronic component and method of manufacturing the same |
| JP2020177908A (en) * | 2019-04-18 | 2020-10-29 | 三ツ星ベルト株式会社 | Conductive composition, metallized substrate and method for producing the same |
| JP2020177907A (en) * | 2019-04-18 | 2020-10-29 | 三ツ星ベルト株式会社 | Conductive composition, metallized substrate and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0777085B2 (en) | 1995-08-16 |
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