JPH079381Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH079381Y2 JPH079381Y2 JP10941890U JP10941890U JPH079381Y2 JP H079381 Y2 JPH079381 Y2 JP H079381Y2 JP 10941890 U JP10941890 U JP 10941890U JP 10941890 U JP10941890 U JP 10941890U JP H079381 Y2 JPH079381 Y2 JP H079381Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin case
- adhesive
- groove
- heat dissipation
- horizontal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10941890U JPH079381Y2 (ja) | 1990-10-18 | 1990-10-18 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10941890U JPH079381Y2 (ja) | 1990-10-18 | 1990-10-18 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0465451U JPH0465451U (US07534539-20090519-C00280.png) | 1992-06-08 |
JPH079381Y2 true JPH079381Y2 (ja) | 1995-03-06 |
Family
ID=31856619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10941890U Expired - Fee Related JPH079381Y2 (ja) | 1990-10-18 | 1990-10-18 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH079381Y2 (US07534539-20090519-C00280.png) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310381A (ja) * | 2005-04-26 | 2006-11-09 | Toyota Industries Corp | 電子機器 |
JP5310660B2 (ja) * | 2010-07-01 | 2013-10-09 | 富士電機株式会社 | 半導体装置 |
JP6766744B2 (ja) * | 2017-05-10 | 2020-10-14 | 株式会社豊田自動織機 | 半導体モジュール |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62108545A (ja) * | 1985-11-06 | 1987-05-19 | Shinko Electric Ind Co Ltd | プリント基板型パッケ−ジ |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55126649U (US07534539-20090519-C00280.png) * | 1979-03-01 | 1980-09-08 | ||
JPS58166045U (ja) * | 1982-04-28 | 1983-11-05 | 日本電気株式会社 | 半導体装置 |
-
1990
- 1990-10-18 JP JP10941890U patent/JPH079381Y2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62108545A (ja) * | 1985-11-06 | 1987-05-19 | Shinko Electric Ind Co Ltd | プリント基板型パッケ−ジ |
Also Published As
Publication number | Publication date |
---|---|
JPH0465451U (US07534539-20090519-C00280.png) | 1992-06-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |