JPH0786916A - 半導体集積回路 - Google Patents
半導体集積回路Info
- Publication number
- JPH0786916A JPH0786916A JP5231234A JP23123493A JPH0786916A JP H0786916 A JPH0786916 A JP H0786916A JP 5231234 A JP5231234 A JP 5231234A JP 23123493 A JP23123493 A JP 23123493A JP H0786916 A JPH0786916 A JP H0786916A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- semiconductor integrated
- integrated circuit
- level
- logic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 10
- 238000010586 diagram Methods 0.000 description 54
- 238000000034 method Methods 0.000 description 29
- 230000000694 effects Effects 0.000 description 16
- 230000007423 decrease Effects 0.000 description 13
- 101100242307 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SWH1 gene Proteins 0.000 description 10
- 230000008901 benefit Effects 0.000 description 8
- 101150070189 CIN3 gene Proteins 0.000 description 7
- 101100508840 Daucus carota INV3 gene Proteins 0.000 description 7
- 238000001514 detection method Methods 0.000 description 7
- 101100286980 Daucus carota INV2 gene Proteins 0.000 description 6
- 108010020053 Staphylococcus warneri lipase 2 Proteins 0.000 description 6
- 101100397045 Xenopus laevis invs-b gene Proteins 0.000 description 6
- 101150110971 CIN7 gene Proteins 0.000 description 5
- 101150110298 INV1 gene Proteins 0.000 description 5
- 101100397044 Xenopus laevis invs-a gene Proteins 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 230000000295 complement effect Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 101100094106 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) RSC8 gene Proteins 0.000 description 2
- 239000008186 active pharmaceutical agent Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 101150086406 INV gene Proteins 0.000 description 1
- 102100037224 Noncompact myelin-associated protein Human genes 0.000 description 1
- 101710184695 Noncompact myelin-associated protein Proteins 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 101150045415 invs gene Proteins 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
- H01L27/0218—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of field effect structures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0008—Arrangements for reducing power consumption
- H03K19/0016—Arrangements for reducing power consumption by using a control or a clock signal, e.g. in order to apply power supply
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/353—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of field-effect transistors with internal or external positive feedback
- H03K3/356—Bistable circuits
- H03K3/356104—Bistable circuits using complementary field-effect transistors
- H03K3/356113—Bistable circuits using complementary field-effect transistors using additional transistors in the input circuit
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Logic Circuits (AREA)
- Dram (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5231234A JPH0786916A (ja) | 1993-09-17 | 1993-09-17 | 半導体集積回路 |
US08/294,055 US5614847A (en) | 1992-04-14 | 1994-08-24 | Semiconductor integrated circuit device having power reduction mechanism |
KR1019940023402A KR100305993B1 (ko) | 1993-09-17 | 1994-09-15 | 전력저감기구를갖는반도체집적회로장치 |
US08/714,994 US5880604A (en) | 1992-04-14 | 1996-09-17 | Semiconductor integrated circuit device having power reduction mechanism |
US09/199,199 US6107836A (en) | 1992-04-14 | 1998-11-25 | Semiconductor integrated circuit device having power reduction mechanism |
KR1019990039230A KR100355436B1 (ko) | 1993-09-17 | 1999-09-14 | 전력저감기구를 갖는 반도체 집적회로장치 |
KR1019990039229A KR100305992B1 (ko) | 1993-09-17 | 1999-09-14 | 전력저감기구를 갖는 반도체 집적회로장치 |
US09/613,594 US6404239B1 (en) | 1992-04-14 | 2000-07-10 | Semiconductor integrated circuit device having power reduction mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5231234A JPH0786916A (ja) | 1993-09-17 | 1993-09-17 | 半導体集積回路 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29059299A Division JP3255159B2 (ja) | 1999-10-13 | 1999-10-13 | 半導体集積回路 |
JP29059199A Division JP3255158B2 (ja) | 1999-10-13 | 1999-10-13 | 半導体集積回路 |
JP2003021299A Division JP3567160B2 (ja) | 2003-01-30 | 2003-01-30 | 半導体集積回路 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0786916A true JPH0786916A (ja) | 1995-03-31 |
Family
ID=16920428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5231234A Pending JPH0786916A (ja) | 1992-04-14 | 1993-09-17 | 半導体集積回路 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0786916A (ko) |
KR (3) | KR100305993B1 (ko) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5724297A (en) * | 1995-12-21 | 1998-03-03 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
US5805603A (en) * | 1996-07-05 | 1998-09-08 | Mitsubishi Denki Kabushiki Kaisha | Synchronous semiconductor memory device realizing high speed and accurate operation |
EP0951072A1 (en) * | 1996-04-08 | 1999-10-20 | Hitachi, Ltd. | Semiconductor integrated circuit device |
US5996070A (en) * | 1996-07-30 | 1999-11-30 | Mitsubishi Denki Kabushiki Kaisha | Microprocessor capable of executing condition execution instructions using encoded condition execution field in the instructions |
US6411149B1 (en) | 1996-07-30 | 2002-06-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit device operable with low power consumption at low power supply voltage |
US6426908B1 (en) | 1999-08-05 | 2002-07-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device with reduced current consumption in data hold mode |
KR100405925B1 (ko) * | 2000-04-13 | 2003-11-15 | 미쓰비시덴키 가부시키가이샤 | 저전원 전압화 가능한 반도체 기억 장치 |
US6657911B2 (en) | 2001-10-23 | 2003-12-02 | Hitachi, Ltd. | Semiconductor device with low power consumption memory circuit |
US6756814B2 (en) | 2002-01-31 | 2004-06-29 | Renesas Technology Corp. | Logic circuit and semiconductor device |
US6795328B2 (en) | 2002-05-29 | 2004-09-21 | Fujitsu Limited | Semiconductor memory device |
US6822476B2 (en) | 2002-01-23 | 2004-11-23 | Renesas Technology Corporation | Logic circuit whose power switch is quickly turned on and off |
JP2005102086A (ja) * | 2003-09-26 | 2005-04-14 | Renesas Technology Corp | 半導体装置およびレベル変換回路 |
JP2007036899A (ja) * | 2005-07-28 | 2007-02-08 | Sony Corp | 制御信号発生回路およびそれを用いた信号処理回路 |
JP2007095787A (ja) * | 2005-09-27 | 2007-04-12 | Nec Electronics Corp | 半導体集積回路 |
US7276956B2 (en) | 2004-06-23 | 2007-10-02 | Nec Electronics Corporation | Integrated circuit apparatus controlling source voltage of MOSFET based on temperature |
JP2008091030A (ja) * | 1995-12-21 | 2008-04-17 | Elpida Memory Inc | 半導体集積回路装置 |
JP2017028649A (ja) * | 2015-07-28 | 2017-02-02 | 株式会社東芝 | 半導体集積回路 |
JP2018101436A (ja) * | 2012-01-23 | 2018-06-28 | 株式会社半導体エネルギー研究所 | 電子機器 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100410813B1 (ko) * | 1996-06-27 | 2004-03-30 | 주식회사 하이닉스반도체 | 반도체소자의고속저전력구동회로를구현하기위한인버터 |
JP3878431B2 (ja) * | 2000-06-16 | 2007-02-07 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
KR20230001116U (ko) | 2021-11-24 | 2023-06-01 | 주식회사 한국가스기술공사 | 해수 식 용사 코팅 방식 전위 측정용 기준전극봉 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0646705B2 (ja) * | 1984-02-10 | 1994-06-15 | 株式会社日立製作所 | 低電力cmos集積回路 |
-
1993
- 1993-09-17 JP JP5231234A patent/JPH0786916A/ja active Pending
-
1994
- 1994-09-15 KR KR1019940023402A patent/KR100305993B1/ko not_active IP Right Cessation
-
1999
- 1999-09-14 KR KR1019990039229A patent/KR100305992B1/ko not_active IP Right Cessation
- 1999-09-14 KR KR1019990039230A patent/KR100355436B1/ko not_active IP Right Cessation
Cited By (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6498762B2 (en) | 1995-12-21 | 2002-12-24 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
US5926430A (en) * | 1995-12-21 | 1999-07-20 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
JP2008091030A (ja) * | 1995-12-21 | 2008-04-17 | Elpida Memory Inc | 半導体集積回路装置 |
US6240035B1 (en) | 1995-12-21 | 2001-05-29 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
US6275440B2 (en) | 1995-12-21 | 2001-08-14 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
US6396761B2 (en) | 1995-12-21 | 2002-05-28 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
US5724297A (en) * | 1995-12-21 | 1998-03-03 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
US6424586B1 (en) | 1995-12-21 | 2002-07-23 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating same |
US6473354B2 (en) | 1995-12-21 | 2002-10-29 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of activating the same |
EP0951072A1 (en) * | 1996-04-08 | 1999-10-20 | Hitachi, Ltd. | Semiconductor integrated circuit device |
EP0951072B1 (en) * | 1996-04-08 | 2009-12-09 | Hitachi, Ltd. | Semiconductor integrated circuit device |
US5805603A (en) * | 1996-07-05 | 1998-09-08 | Mitsubishi Denki Kabushiki Kaisha | Synchronous semiconductor memory device realizing high speed and accurate operation |
US6411149B1 (en) | 1996-07-30 | 2002-06-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit device operable with low power consumption at low power supply voltage |
US5996070A (en) * | 1996-07-30 | 1999-11-30 | Mitsubishi Denki Kabushiki Kaisha | Microprocessor capable of executing condition execution instructions using encoded condition execution field in the instructions |
US6487136B2 (en) | 1999-08-05 | 2002-11-26 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device with reduced current consumption in data hold mode |
US6426908B1 (en) | 1999-08-05 | 2002-07-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device with reduced current consumption in data hold mode |
KR100405925B1 (ko) * | 2000-04-13 | 2003-11-15 | 미쓰비시덴키 가부시키가이샤 | 저전원 전압화 가능한 반도체 기억 장치 |
US6914803B2 (en) | 2001-10-23 | 2005-07-05 | Hitachi, Ltd. | Low-power semiconductor memory device |
US9928900B2 (en) | 2001-10-23 | 2018-03-27 | Renesas Electronics Corporation | Low power semiconductor memory device |
US10573376B2 (en) | 2001-10-23 | 2020-02-25 | Renesas Electronics Corporation | Lower-power semiconductor memory device |
US10229732B2 (en) | 2001-10-23 | 2019-03-12 | Renesas Electronics Corporation | Semiconductor device |
US9754659B2 (en) | 2001-10-23 | 2017-09-05 | Renesas Electronics Corporation | Low-power semiconductor device |
US7099183B2 (en) | 2001-10-23 | 2006-08-29 | Hitachi, Ltd. | Semiconductor device |
US9214221B2 (en) | 2001-10-23 | 2015-12-15 | Renesas Electronics Corporation | Semiconductor device with logic circuit, SRAM circuit and standby state |
US8711607B2 (en) | 2001-10-23 | 2014-04-29 | Renesas Electronics Corporation | Semiconductor device |
US7272068B2 (en) | 2001-10-23 | 2007-09-18 | Hitachi, Ltd. | Semiconductor device |
US7961545B2 (en) | 2001-10-23 | 2011-06-14 | Renesas Electronics Corporation | Semiconductor device |
US7646662B2 (en) | 2001-10-23 | 2010-01-12 | Renesas Technology Corp. | Semiconductor device |
US7474584B2 (en) | 2001-10-23 | 2009-01-06 | Renesas Technology Corp. | Semiconductor device |
US6657911B2 (en) | 2001-10-23 | 2003-12-02 | Hitachi, Ltd. | Semiconductor device with low power consumption memory circuit |
US6822476B2 (en) | 2002-01-23 | 2004-11-23 | Renesas Technology Corporation | Logic circuit whose power switch is quickly turned on and off |
US6989686B2 (en) | 2002-01-23 | 2006-01-24 | Renesas Technology Corp. | Logic circuit whose power switch is quickly turned on and off |
US6756814B2 (en) | 2002-01-31 | 2004-06-29 | Renesas Technology Corp. | Logic circuit and semiconductor device |
US6795328B2 (en) | 2002-05-29 | 2004-09-21 | Fujitsu Limited | Semiconductor memory device |
JP2005102086A (ja) * | 2003-09-26 | 2005-04-14 | Renesas Technology Corp | 半導体装置およびレベル変換回路 |
US7276956B2 (en) | 2004-06-23 | 2007-10-02 | Nec Electronics Corporation | Integrated circuit apparatus controlling source voltage of MOSFET based on temperature |
JP2007036899A (ja) * | 2005-07-28 | 2007-02-08 | Sony Corp | 制御信号発生回路およびそれを用いた信号処理回路 |
JP2007095787A (ja) * | 2005-09-27 | 2007-04-12 | Nec Electronics Corp | 半導体集積回路 |
JP2018101436A (ja) * | 2012-01-23 | 2018-06-28 | 株式会社半導体エネルギー研究所 | 電子機器 |
US11209880B2 (en) | 2012-01-23 | 2021-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US11934243B2 (en) | 2012-01-23 | 2024-03-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2017028649A (ja) * | 2015-07-28 | 2017-02-02 | 株式会社東芝 | 半導体集積回路 |
US10411638B2 (en) | 2015-07-28 | 2019-09-10 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
KR100305993B1 (ko) | 2001-12-15 |
KR100305992B1 (ko) | 2001-11-07 |
KR100355436B1 (ko) | 2002-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20040308 |
|
A912 | Removal of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20040402 |