JPH0755559Y2 - 感光性樹脂用保護フィルム剥離装置 - Google Patents
感光性樹脂用保護フィルム剥離装置Info
- Publication number
- JPH0755559Y2 JPH0755559Y2 JP1988121218U JP12121888U JPH0755559Y2 JP H0755559 Y2 JPH0755559 Y2 JP H0755559Y2 JP 1988121218 U JP1988121218 U JP 1988121218U JP 12121888 U JP12121888 U JP 12121888U JP H0755559 Y2 JPH0755559 Y2 JP H0755559Y2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- clad laminate
- copper
- photosensitive resin
- transport path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001681 protective effect Effects 0.000 title claims description 45
- 229920005989 resin Polymers 0.000 title claims description 21
- 239000011347 resin Substances 0.000 title claims description 21
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000032258 transport Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121218U JPH0755559Y2 (ja) | 1988-09-16 | 1988-09-16 | 感光性樹脂用保護フィルム剥離装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121218U JPH0755559Y2 (ja) | 1988-09-16 | 1988-09-16 | 感光性樹脂用保護フィルム剥離装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0245551U JPH0245551U (enrdf_load_stackoverflow) | 1990-03-28 |
| JPH0755559Y2 true JPH0755559Y2 (ja) | 1995-12-20 |
Family
ID=31368026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121218U Expired - Lifetime JPH0755559Y2 (ja) | 1988-09-16 | 1988-09-16 | 感光性樹脂用保護フィルム剥離装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755559Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101477509B1 (ko) * | 2013-06-18 | 2014-12-31 | 주식회사 씨엘디 | 필름 박리 장치 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108891121B (zh) * | 2018-08-13 | 2024-05-31 | 深圳市伟鸿科科技有限公司 | 剥料机构及fpc预处理装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59154446A (ja) * | 1983-02-22 | 1984-09-03 | Hitachi Chem Co Ltd | 印刷配線板用基板に貼合されたカバ−フイルム付感光性樹脂フイルムのカバ−フイルム剥離方法 |
| JPS59154447A (ja) * | 1983-02-22 | 1984-09-03 | Hitachi Chem Co Ltd | 印刷配線板用基板に貼合されたカバ−フイルム付感光性樹脂フイルムのカバ−フイルム剥離方法 |
-
1988
- 1988-09-16 JP JP1988121218U patent/JPH0755559Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101477509B1 (ko) * | 2013-06-18 | 2014-12-31 | 주식회사 씨엘디 | 필름 박리 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0245551U (enrdf_load_stackoverflow) | 1990-03-28 |
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