JPH07501183A - 単軸導電性接着材を用いるダイス取り付け - Google Patents

単軸導電性接着材を用いるダイス取り付け

Info

Publication number
JPH07501183A
JPH07501183A JP5509545A JP50954592A JPH07501183A JP H07501183 A JPH07501183 A JP H07501183A JP 5509545 A JP5509545 A JP 5509545A JP 50954592 A JP50954592 A JP 50954592A JP H07501183 A JPH07501183 A JP H07501183A
Authority
JP
Japan
Prior art keywords
conductive
adhesive
raised
substrate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5509545A
Other languages
English (en)
Japanese (ja)
Inventor
クレメンツ　ジェイムズ　アール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPH07501183A publication Critical patent/JPH07501183A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W20/40—
    • H10W70/666—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H10W72/073—
    • H10W72/07327—
    • H10W72/07331—
    • H10W72/354—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP5509545A 1991-11-22 1992-11-20 単軸導電性接着材を用いるダイス取り付け Pending JPH07501183A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/796,453 US5258577A (en) 1991-11-22 1991-11-22 Die mounting with uniaxial conductive adhesive
US796.453 1991-11-22
PCT/US1992/010044 WO1993010573A1 (en) 1991-11-22 1992-11-20 Die mounting with uniaxial conductive adhesive

Publications (1)

Publication Number Publication Date
JPH07501183A true JPH07501183A (ja) 1995-02-02

Family

ID=25168223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5509545A Pending JPH07501183A (ja) 1991-11-22 1992-11-20 単軸導電性接着材を用いるダイス取り付け

Country Status (8)

Country Link
US (1) US5258577A (enExample)
EP (1) EP0613590B1 (enExample)
JP (1) JPH07501183A (enExample)
AT (1) ATE144654T1 (enExample)
CA (1) CA2123877A1 (enExample)
DE (1) DE69214833D1 (enExample)
TW (1) TW234233B (enExample)
WO (1) WO1993010573A1 (enExample)

Families Citing this family (42)

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US6133534A (en) * 1991-11-29 2000-10-17 Hitachi Chemical Company, Ltd. Wiring board for electrical tests with bumps having polymeric coating
US6568073B1 (en) 1991-11-29 2003-05-27 Hitachi Chemical Company, Ltd. Process for the fabrication of wiring board for electrical tests
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
DE69404939T2 (de) * 1993-10-15 1998-01-15 Nof Corp Etikette
US5820716A (en) * 1993-11-05 1998-10-13 Micron Technology, Inc. Method for surface mounting electrical components to a substrate
EP0710058A3 (en) * 1994-10-14 1997-07-09 Samsung Display Devices Co Ltd Short circuit prevention between electrically conductive parts
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
WO1997008749A1 (en) * 1995-08-29 1997-03-06 Minnesota Mining And Manufacturing Company Deformable substrate assembly for adhesively bonded electronic device
US6580369B1 (en) 1995-10-11 2003-06-17 Motorola, Inc. Electronic tag assembly and method therefor
US5842273A (en) * 1996-01-26 1998-12-01 Hewlett-Packard Company Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
US6132798A (en) * 1998-08-13 2000-10-17 Micron Technology, Inc. Method for applying atomized adhesive to a leadframe for chip bonding
US5810926A (en) * 1996-03-11 1998-09-22 Micron Technology, Inc. Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
US6030857A (en) * 1996-03-11 2000-02-29 Micron Technology, Inc. Method for application of spray adhesive to a leadframe for chip bonding
US5741430A (en) * 1996-04-25 1998-04-21 Lucent Technologies Inc. Conductive adhesive bonding means
US5925930A (en) 1996-05-21 1999-07-20 Micron Technology, Inc. IC contacts with palladium layer and flexible conductive epoxy bumps
US6558979B2 (en) * 1996-05-21 2003-05-06 Micron Technology, Inc. Use of palladium in IC manufacturing with conductive polymer bump
KR100484962B1 (ko) * 1996-07-12 2005-04-25 후지쯔 가부시끼가이샤 반도체 장치의 제조 방법 및 반도체 장치
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
US5786548A (en) * 1996-08-15 1998-07-28 Hughes Electronics Corporation Hermetic package for an electrical device
US6221753B1 (en) * 1997-01-24 2001-04-24 Micron Technology, Inc. Flip chip technique for chip assembly
US6831361B2 (en) 1997-01-24 2004-12-14 Micron Technology, Inc. Flip chip technique for chip assembly
WO1999000842A1 (fr) * 1997-06-26 1999-01-07 Hitachi Chemical Company, Ltd. Substrat pour montage de plaquettes a semi-conducteur
US6297559B1 (en) * 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
US6120885A (en) 1997-07-10 2000-09-19 International Business Machines Corporation Structure, materials, and methods for socketable ball grid
US6337522B1 (en) 1997-07-10 2002-01-08 International Business Machines Corporation Structure employing electrically conductive adhesives
US6011307A (en) * 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
JPH11168263A (ja) * 1997-09-30 1999-06-22 Canon Inc 光デバイス装置及びその製造方法
US6137063A (en) 1998-02-27 2000-10-24 Micron Technology, Inc. Electrical interconnections
US6535393B2 (en) * 1998-12-04 2003-03-18 Micron Technology, Inc. Electrical device allowing for increased device densities
US6624521B2 (en) 2001-07-20 2003-09-23 Georgia Tech Research Corp. Flip chip design on a coplanar waveguide with a pseudo-coaxial ground bump configuration
KR100772113B1 (ko) * 2006-09-28 2007-11-01 주식회사 하이닉스반도체 입체 인쇄회로 기판
US8814792B2 (en) 2010-07-27 2014-08-26 Carefusion 303, Inc. System and method for storing and forwarding data from a vital-signs monitor
US9615792B2 (en) 2010-07-27 2017-04-11 Carefusion 303, Inc. System and method for conserving battery power in a patient monitoring system
US9017255B2 (en) 2010-07-27 2015-04-28 Carefusion 303, Inc. System and method for saving battery power in a patient monitoring system
US9420952B2 (en) 2010-07-27 2016-08-23 Carefusion 303, Inc. Temperature probe suitable for axillary reading
US9585620B2 (en) 2010-07-27 2017-03-07 Carefusion 303, Inc. Vital-signs patch having a flexible attachment to electrodes
US9357929B2 (en) 2010-07-27 2016-06-07 Carefusion 303, Inc. System and method for monitoring body temperature of a person
US9055925B2 (en) 2010-07-27 2015-06-16 Carefusion 303, Inc. System and method for reducing false alarms associated with vital-signs monitoring
JP6398008B2 (ja) * 2015-07-14 2018-09-26 ゴルテック．インク フリップダイの組立方法、製造方法、装置及び電子機器
US20220133184A1 (en) * 2020-10-30 2022-05-05 Medtronic Minimed, Inc. Low-profile wearable medical device
CN114664191A (zh) * 2022-03-29 2022-06-24 苏州清越光电科技股份有限公司 一种邦定结构及其制造方法、显示屏

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4423435A (en) * 1980-10-27 1983-12-27 Texas Instruments Incorporated Assembly of an electronic device on an insulative substrate
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
US4643499A (en) * 1985-09-04 1987-02-17 At&T Bell Laboratories Component mounting apparatus
US4667401A (en) * 1985-11-26 1987-05-26 Clements James R Method of making an electronic device using an uniaxial conductive adhesive
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
US4927368A (en) * 1986-10-13 1990-05-22 Sharp Kabushiki Kaisha Connector
US4811081A (en) * 1987-03-23 1989-03-07 Motorola, Inc. Semiconductor die bonding with conductive adhesive
JPH025375A (ja) * 1988-06-24 1990-01-10 Toshiba Corp 電子部品の実装方法
JP2501473B2 (ja) * 1989-10-05 1996-05-29 シャープ株式会社 配線基板の製造方法
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material

Also Published As

Publication number Publication date
WO1993010573A1 (en) 1993-05-27
TW234233B (enExample) 1994-11-11
ATE144654T1 (de) 1996-11-15
EP0613590B1 (en) 1996-10-23
EP0613590A4 (fr) 1994-10-12
US5258577A (en) 1993-11-02
DE69214833D1 (de) 1996-11-28
EP0613590A1 (en) 1994-09-07
CA2123877A1 (en) 1993-05-27

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