WO1993010573A1 - Die mounting with uniaxial conductive adhesive - Google Patents

Die mounting with uniaxial conductive adhesive Download PDF

Info

Publication number
WO1993010573A1
WO1993010573A1 PCT/US1992/010044 US9210044W WO9310573A1 WO 1993010573 A1 WO1993010573 A1 WO 1993010573A1 US 9210044 W US9210044 W US 9210044W WO 9310573 A1 WO9310573 A1 WO 9310573A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
contact pads
adhesive
substrate
raised
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1992/010044
Other languages
English (en)
French (fr)
Inventor
James R. Clements
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP5509545A priority Critical patent/JPH07501183A/ja
Priority to DE69214833T priority patent/DE69214833D1/de
Priority to EP93900582A priority patent/EP0613590B1/en
Publication of WO1993010573A1 publication Critical patent/WO1993010573A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the device includes a substrate generally indicated at 12.
  • the substrate 12 is a supporting material on or in which parts of the circuit are attached or made.
  • the substrate 12 may be passive or active.
  • the substrate 12 includes a mounting surface 14 having a plurality of laterally spaced conductive paths 16 thereon.
  • This type of substrate 12 is generally referred to as a printed circuit board in which normally found interconnecting wires are replaced by conductive strips 16 printed, etched or otherwise mounted onto the insulated substrate 12. In other words, the substrate is non-conductive, providing insulation between the conductive paths 16.
  • the substrate 12 may also be referred to as a printed circuit board or insulating board onto which the conductive path 16 or circuits are printed.
  • circuit member 18 with the passivation layer 20 is commonly known in the art and provides such contact pads 22 recessed therein prior to the common application of applying extending conductive terminals therefrom or "bumps".
  • Protruding means 24 is operatively provided between the contact pads 22 and a terminal or end portion 23 of the conductive paths 16 to decrease the distance or separation between the contact pads 22 and conductive paths 16, as will be subsequently discussed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
PCT/US1992/010044 1991-11-22 1992-11-20 Die mounting with uniaxial conductive adhesive Ceased WO1993010573A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP5509545A JPH07501183A (ja) 1991-11-22 1992-11-20 単軸導電性接着材を用いるダイス取り付け
DE69214833T DE69214833D1 (de) 1991-11-22 1992-11-20 Montieren von elektrischen bauelementen mit uniaxialleitfähigen klebstoff
EP93900582A EP0613590B1 (en) 1991-11-22 1992-11-20 Die mounting with uniaxial conductive adhesive

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US796,453 1991-11-22
US07/796,453 US5258577A (en) 1991-11-22 1991-11-22 Die mounting with uniaxial conductive adhesive

Publications (1)

Publication Number Publication Date
WO1993010573A1 true WO1993010573A1 (en) 1993-05-27

Family

ID=25168223

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1992/010044 Ceased WO1993010573A1 (en) 1991-11-22 1992-11-20 Die mounting with uniaxial conductive adhesive

Country Status (8)

Country Link
US (1) US5258577A (enExample)
EP (1) EP0613590B1 (enExample)
JP (1) JPH07501183A (enExample)
AT (1) ATE144654T1 (enExample)
CA (1) CA2123877A1 (enExample)
DE (1) DE69214833D1 (enExample)
TW (1) TW234233B (enExample)
WO (1) WO1993010573A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220133184A1 (en) * 2020-10-30 2022-05-05 Medtronic Minimed, Inc. Low-profile wearable medical device

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US6133534A (en) * 1991-11-29 2000-10-17 Hitachi Chemical Company, Ltd. Wiring board for electrical tests with bumps having polymeric coating
US6568073B1 (en) 1991-11-29 2003-05-27 Hitachi Chemical Company, Ltd. Process for the fabrication of wiring board for electrical tests
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
EP0649126B1 (en) * 1993-10-15 1997-08-13 Nof Corporation Label
US5820716A (en) * 1993-11-05 1998-10-13 Micron Technology, Inc. Method for surface mounting electrical components to a substrate
EP0710058A3 (en) * 1994-10-14 1997-07-09 Samsung Display Devices Co Ltd Short circuit prevention between electrically conductive parts
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
DE69622412T2 (de) * 1995-08-29 2003-03-20 Minnesota Mining And Mfg. Co., Saint Paul Verfahren zur herstellung einer elektronischen anordnung mit klebeverbindung mittels eines nachgiebigen substrats
US6580369B1 (en) 1995-10-11 2003-06-17 Motorola, Inc. Electronic tag assembly and method therefor
US5842273A (en) * 1996-01-26 1998-12-01 Hewlett-Packard Company Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
US5810926A (en) * 1996-03-11 1998-09-22 Micron Technology, Inc. Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
US6132798A (en) * 1998-08-13 2000-10-17 Micron Technology, Inc. Method for applying atomized adhesive to a leadframe for chip bonding
US6030857A (en) 1996-03-11 2000-02-29 Micron Technology, Inc. Method for application of spray adhesive to a leadframe for chip bonding
US5741430A (en) * 1996-04-25 1998-04-21 Lucent Technologies Inc. Conductive adhesive bonding means
US5925930A (en) * 1996-05-21 1999-07-20 Micron Technology, Inc. IC contacts with palladium layer and flexible conductive epoxy bumps
US6558979B2 (en) * 1996-05-21 2003-05-06 Micron Technology, Inc. Use of palladium in IC manufacturing with conductive polymer bump
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
EP1189271A3 (en) * 1996-07-12 2003-07-16 Fujitsu Limited Wiring boards and mounting of semiconductor devices thereon
US5786548A (en) * 1996-08-15 1998-07-28 Hughes Electronics Corporation Hermetic package for an electrical device
US6831361B2 (en) 1997-01-24 2004-12-14 Micron Technology, Inc. Flip chip technique for chip assembly
US6221753B1 (en) * 1997-01-24 2001-04-24 Micron Technology, Inc. Flip chip technique for chip assembly
DE69835747T2 (de) * 1997-06-26 2007-09-13 Hitachi Chemical Co., Ltd. Substrat zur montage von halbleiterchips
US6337522B1 (en) 1997-07-10 2002-01-08 International Business Machines Corporation Structure employing electrically conductive adhesives
US6297559B1 (en) * 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
US6120885A (en) 1997-07-10 2000-09-19 International Business Machines Corporation Structure, materials, and methods for socketable ball grid
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US6624521B2 (en) 2001-07-20 2003-09-23 Georgia Tech Research Corp. Flip chip design on a coplanar waveguide with a pseudo-coaxial ground bump configuration
KR100772113B1 (ko) * 2006-09-28 2007-11-01 주식회사 하이닉스반도체 입체 인쇄회로 기판
US9615792B2 (en) 2010-07-27 2017-04-11 Carefusion 303, Inc. System and method for conserving battery power in a patient monitoring system
US9420952B2 (en) 2010-07-27 2016-08-23 Carefusion 303, Inc. Temperature probe suitable for axillary reading
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US9585620B2 (en) 2010-07-27 2017-03-07 Carefusion 303, Inc. Vital-signs patch having a flexible attachment to electrodes
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US4423435A (en) * 1980-10-27 1983-12-27 Texas Instruments Incorporated Assembly of an electronic device on an insulative substrate
US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
US4643499A (en) * 1985-09-04 1987-02-17 At&T Bell Laboratories Component mounting apparatus
US4744850A (en) * 1983-04-21 1988-05-17 Sharp Kabushiki Kaisha Method for bonding an LSI chip on a wiring base
US4811081A (en) * 1987-03-23 1989-03-07 Motorola, Inc. Semiconductor die bonding with conductive adhesive
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
US4927368A (en) * 1986-10-13 1990-05-22 Sharp Kabushiki Kaisha Connector
US4972580A (en) * 1988-06-24 1990-11-27 Kabushiki Kaisha Toshiba Method for connecting electronic components with dummy patterns

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US4667401A (en) * 1985-11-26 1987-05-26 Clements James R Method of making an electronic device using an uniaxial conductive adhesive
JP2501473B2 (ja) * 1989-10-05 1996-05-29 シャープ株式会社 配線基板の製造方法
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US4423435A (en) * 1980-10-27 1983-12-27 Texas Instruments Incorporated Assembly of an electronic device on an insulative substrate
US4744850A (en) * 1983-04-21 1988-05-17 Sharp Kabushiki Kaisha Method for bonding an LSI chip on a wiring base
US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
US4643499A (en) * 1985-09-04 1987-02-17 At&T Bell Laboratories Component mounting apparatus
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
US4927368A (en) * 1986-10-13 1990-05-22 Sharp Kabushiki Kaisha Connector
US4811081A (en) * 1987-03-23 1989-03-07 Motorola, Inc. Semiconductor die bonding with conductive adhesive
US4972580A (en) * 1988-06-24 1990-11-27 Kabushiki Kaisha Toshiba Method for connecting electronic components with dummy patterns

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220133184A1 (en) * 2020-10-30 2022-05-05 Medtronic Minimed, Inc. Low-profile wearable medical device

Also Published As

Publication number Publication date
ATE144654T1 (de) 1996-11-15
EP0613590B1 (en) 1996-10-23
TW234233B (enExample) 1994-11-11
DE69214833D1 (de) 1996-11-28
CA2123877A1 (en) 1993-05-27
EP0613590A1 (en) 1994-09-07
US5258577A (en) 1993-11-02
EP0613590A4 (fr) 1994-10-12
JPH07501183A (ja) 1995-02-02

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