JPH07501093A - 硬化性封止用コンパウンド - Google Patents

硬化性封止用コンパウンド

Info

Publication number
JPH07501093A
JPH07501093A JP5508863A JP50886393A JPH07501093A JP H07501093 A JPH07501093 A JP H07501093A JP 5508863 A JP5508863 A JP 5508863A JP 50886393 A JP50886393 A JP 50886393A JP H07501093 A JPH07501093 A JP H07501093A
Authority
JP
Japan
Prior art keywords
sealing compound
epoxy
weight
resins
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5508863A
Other languages
English (en)
Japanese (ja)
Inventor
プファンダー，ヴェルナー
イエンリッヒ，イレーネ
レオ，クリスチアン
Original Assignee
ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング filed Critical ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング
Publication of JPH07501093A publication Critical patent/JPH07501093A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
JP5508863A 1991-11-22 1992-10-23 硬化性封止用コンパウンド Pending JPH07501093A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4138411.3 1991-11-22
DE19914138411 DE4138411C2 (de) 1991-11-22 1991-11-22 Härtende Vergußmassen
PCT/DE1992/000889 WO1993010540A1 (de) 1991-11-22 1992-10-23 Härtende vergussmassen

Publications (1)

Publication Number Publication Date
JPH07501093A true JPH07501093A (ja) 1995-02-02

Family

ID=6445342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5508863A Pending JPH07501093A (ja) 1991-11-22 1992-10-23 硬化性封止用コンパウンド

Country Status (4)

Country Link
EP (1) EP0613581A1 (de)
JP (1) JPH07501093A (de)
DE (1) DE4138411C2 (de)
WO (1) WO1993010540A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020079344A (ja) * 2018-11-12 2020-05-28 株式会社ダイセル 硬化性組成物

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW430685B (en) * 1996-07-30 2001-04-21 Nippon Kayaku Kk Epoxy resin liquid composition for semiconductor encapsulation
DE10057111C1 (de) * 2000-11-16 2002-04-11 Bosch Gmbh Robert Wärmeleitfähige Vergußmasse
DE10131116A1 (de) * 2001-06-28 2003-01-23 Siemens Linear Motor Systems G Vergossenes Motorteil für einen Elektromotor und Verfahren zu seiner Herstellung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137125A (en) * 1979-04-12 1980-10-25 Nippon Soda Co Ltd Production of polybutadiene-modified epoxy resin
DE3229558C2 (de) * 1982-08-07 1984-11-08 Robert Bosch Gmbh, 7000 Stuttgart Imprägniervergußmasse für elektrische Bauteile
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS6064483A (ja) * 1983-09-20 1985-04-13 Toshiba Corp 樹脂封止型発光装置
US4518631A (en) * 1983-11-14 1985-05-21 Dow Corning Corporation Thixotropic curable coating compositions
US4665111A (en) * 1984-10-12 1987-05-12 Siemens Aktiengesellschaft Casting compound for electrical and electronic components and modules
JPS61192720A (ja) * 1985-02-22 1986-08-27 Nippon Oil Co Ltd 積層板用樹脂組成物
DE3634084A1 (de) * 1986-10-07 1988-04-21 Hanse Chemie Gmbh Modifiziertes reaktionsharz, verfahren zu seiner herstellung und seine verwendung
JPS63273624A (ja) * 1987-05-01 1988-11-10 Ube Ind Ltd エポキシ樹脂組成物
JPH01113454A (ja) * 1987-10-26 1989-05-02 Matsushita Electric Works Ltd エポキシ樹脂組成物の製法
EP0370531B1 (de) * 1988-11-25 1997-08-27 Kanegafuchi Chemical Industry Co., Ltd. Härtbare Zweikomponentenzusammensetzung, enthaltend Epoxidharz und ein Silizium umfassendes elastomerisches Polymer
DE3913488C2 (de) * 1989-04-25 1994-02-03 Bosch Gmbh Robert Vergußmasse für elektrische und elektronische Bauteile

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020079344A (ja) * 2018-11-12 2020-05-28 株式会社ダイセル 硬化性組成物

Also Published As

Publication number Publication date
DE4138411A1 (de) 1993-05-27
WO1993010540A1 (de) 1993-05-27
EP0613581A1 (de) 1994-09-07
DE4138411C2 (de) 1995-01-26

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