JPH074899Y2 - モールドプレス装置 - Google Patents

モールドプレス装置

Info

Publication number
JPH074899Y2
JPH074899Y2 JP11280489U JP11280489U JPH074899Y2 JP H074899 Y2 JPH074899 Y2 JP H074899Y2 JP 11280489 U JP11280489 U JP 11280489U JP 11280489 U JP11280489 U JP 11280489U JP H074899 Y2 JPH074899 Y2 JP H074899Y2
Authority
JP
Japan
Prior art keywords
mold
mold clamping
pressure
oil leak
actuator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11280489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0352118U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
敏弘 島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP11280489U priority Critical patent/JPH074899Y2/ja
Publication of JPH0352118U publication Critical patent/JPH0352118U/ja
Application granted granted Critical
Publication of JPH074899Y2 publication Critical patent/JPH074899Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP11280489U 1989-09-28 1989-09-28 モールドプレス装置 Expired - Lifetime JPH074899Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11280489U JPH074899Y2 (ja) 1989-09-28 1989-09-28 モールドプレス装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11280489U JPH074899Y2 (ja) 1989-09-28 1989-09-28 モールドプレス装置

Publications (2)

Publication Number Publication Date
JPH0352118U JPH0352118U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-05-21
JPH074899Y2 true JPH074899Y2 (ja) 1995-02-08

Family

ID=31661241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11280489U Expired - Lifetime JPH074899Y2 (ja) 1989-09-28 1989-09-28 モールドプレス装置

Country Status (1)

Country Link
JP (1) JPH074899Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7008575B2 (en) 1999-12-16 2006-03-07 Dai-Ichi Seiko Co., Ltd. Resin sealing mold and resin sealing method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI768142B (zh) * 2017-11-29 2022-06-21 以色列商艾斯卡公司 具有向內偏置嵌件接納槽的開槽刀具本體、及具有該本體的旋轉槽切削刀具
CN116276696A (zh) * 2021-12-21 2023-06-23 苏州汉扬精密电子有限公司 一种压合检测治具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7008575B2 (en) 1999-12-16 2006-03-07 Dai-Ichi Seiko Co., Ltd. Resin sealing mold and resin sealing method
US7413425B2 (en) 1999-12-16 2008-08-19 Dai-Ichi Seiko Co., Ltd. Resin sealing mold and resin sealing method

Also Published As

Publication number Publication date
JPH0352118U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-05-21

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