JPH074899Y2 - モールドプレス装置 - Google Patents
モールドプレス装置Info
- Publication number
- JPH074899Y2 JPH074899Y2 JP11280489U JP11280489U JPH074899Y2 JP H074899 Y2 JPH074899 Y2 JP H074899Y2 JP 11280489 U JP11280489 U JP 11280489U JP 11280489 U JP11280489 U JP 11280489U JP H074899 Y2 JPH074899 Y2 JP H074899Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- mold clamping
- pressure
- oil leak
- actuator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11280489U JPH074899Y2 (ja) | 1989-09-28 | 1989-09-28 | モールドプレス装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11280489U JPH074899Y2 (ja) | 1989-09-28 | 1989-09-28 | モールドプレス装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0352118U JPH0352118U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-05-21 |
| JPH074899Y2 true JPH074899Y2 (ja) | 1995-02-08 |
Family
ID=31661241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11280489U Expired - Lifetime JPH074899Y2 (ja) | 1989-09-28 | 1989-09-28 | モールドプレス装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH074899Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7008575B2 (en) | 1999-12-16 | 2006-03-07 | Dai-Ichi Seiko Co., Ltd. | Resin sealing mold and resin sealing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI781075B (zh) * | 2017-11-29 | 2022-10-11 | 以色列商艾斯卡公司 | 切削嵌件 |
| CN116276696A (zh) * | 2021-12-21 | 2023-06-23 | 苏州汉扬精密电子有限公司 | 一种压合检测治具 |
-
1989
- 1989-09-28 JP JP11280489U patent/JPH074899Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7008575B2 (en) | 1999-12-16 | 2006-03-07 | Dai-Ichi Seiko Co., Ltd. | Resin sealing mold and resin sealing method |
| US7413425B2 (en) | 1999-12-16 | 2008-08-19 | Dai-Ichi Seiko Co., Ltd. | Resin sealing mold and resin sealing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0352118U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-05-21 |