JPH0747864Y2 - 半導体ウエハの保護部材 - Google Patents

半導体ウエハの保護部材

Info

Publication number
JPH0747864Y2
JPH0747864Y2 JP1988059781U JP5978188U JPH0747864Y2 JP H0747864 Y2 JPH0747864 Y2 JP H0747864Y2 JP 1988059781 U JP1988059781 U JP 1988059781U JP 5978188 U JP5978188 U JP 5978188U JP H0747864 Y2 JPH0747864 Y2 JP H0747864Y2
Authority
JP
Japan
Prior art keywords
protective member
sheet
semiconductor wafer
sensitive adhesive
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988059781U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01163332U (enrdf_load_stackoverflow
Inventor
縁 近田
昌三 芋野
豊 桑原
栄二 重村
征四郎 松崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP1988059781U priority Critical patent/JPH0747864Y2/ja
Publication of JPH01163332U publication Critical patent/JPH01163332U/ja
Application granted granted Critical
Publication of JPH0747864Y2 publication Critical patent/JPH0747864Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP1988059781U 1988-05-02 1988-05-02 半導体ウエハの保護部材 Expired - Lifetime JPH0747864Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988059781U JPH0747864Y2 (ja) 1988-05-02 1988-05-02 半導体ウエハの保護部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988059781U JPH0747864Y2 (ja) 1988-05-02 1988-05-02 半導体ウエハの保護部材

Publications (2)

Publication Number Publication Date
JPH01163332U JPH01163332U (enrdf_load_stackoverflow) 1989-11-14
JPH0747864Y2 true JPH0747864Y2 (ja) 1995-11-01

Family

ID=31285527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988059781U Expired - Lifetime JPH0747864Y2 (ja) 1988-05-02 1988-05-02 半導体ウエハの保護部材

Country Status (1)

Country Link
JP (1) JPH0747864Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6550270B2 (ja) * 2015-05-28 2019-07-24 日東電工株式会社 バックグラインドテープ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60155199U (ja) * 1984-03-24 1985-10-16 アキレス株式会社 帯電防止性ｉｃキヤリアテ−プ
JPH0691057B2 (ja) * 1985-09-07 1994-11-14 日東電工株式会社 半導体ウエハの保護部材

Also Published As

Publication number Publication date
JPH01163332U (enrdf_load_stackoverflow) 1989-11-14

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