JPH01163332U - - Google Patents
Info
- Publication number
- JPH01163332U JPH01163332U JP5978188U JP5978188U JPH01163332U JP H01163332 U JPH01163332 U JP H01163332U JP 5978188 U JP5978188 U JP 5978188U JP 5978188 U JP5978188 U JP 5978188U JP H01163332 U JPH01163332 U JP H01163332U
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- adhesive layer
- semiconductor wafer
- pressure
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059781U JPH0747864Y2 (ja) | 1988-05-02 | 1988-05-02 | 半導体ウエハの保護部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059781U JPH0747864Y2 (ja) | 1988-05-02 | 1988-05-02 | 半導体ウエハの保護部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01163332U true JPH01163332U (enrdf_load_stackoverflow) | 1989-11-14 |
| JPH0747864Y2 JPH0747864Y2 (ja) | 1995-11-01 |
Family
ID=31285527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988059781U Expired - Lifetime JPH0747864Y2 (ja) | 1988-05-02 | 1988-05-02 | 半導体ウエハの保護部材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747864Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016225388A (ja) * | 2015-05-28 | 2016-12-28 | 日東電工株式会社 | バックグラインドテープ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60155199U (ja) * | 1984-03-24 | 1985-10-16 | アキレス株式会社 | 帯電防止性ｉｃキヤリアテ−プ |
| JPS6258638A (ja) * | 1985-09-07 | 1987-03-14 | Nitto Electric Ind Co Ltd | 半導体ウエハの保護部材 |
-
1988
- 1988-05-02 JP JP1988059781U patent/JPH0747864Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60155199U (ja) * | 1984-03-24 | 1985-10-16 | アキレス株式会社 | 帯電防止性ｉｃキヤリアテ−プ |
| JPS6258638A (ja) * | 1985-09-07 | 1987-03-14 | Nitto Electric Ind Co Ltd | 半導体ウエハの保護部材 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016225388A (ja) * | 2015-05-28 | 2016-12-28 | 日東電工株式会社 | バックグラインドテープ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0747864Y2 (ja) | 1995-11-01 |