JPH0745963Y2 - Ｃｏｂ封止材料の流れ防止枠 - Google Patents

Ｃｏｂ封止材料の流れ防止枠

Info

Publication number
JPH0745963Y2
JPH0745963Y2 JP1989071140U JP7114089U JPH0745963Y2 JP H0745963 Y2 JPH0745963 Y2 JP H0745963Y2 JP 1989071140 U JP1989071140 U JP 1989071140U JP 7114089 U JP7114089 U JP 7114089U JP H0745963 Y2 JPH0745963 Y2 JP H0745963Y2
Authority
JP
Japan
Prior art keywords
frame
epoxy resin
sealing material
cob
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989071140U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0310545U (enExample
Inventor
精一 福永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Tire Corp
Original Assignee
Toyo Tire and Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire and Rubber Co Ltd filed Critical Toyo Tire and Rubber Co Ltd
Priority to JP1989071140U priority Critical patent/JPH0745963Y2/ja
Priority to US07/539,816 priority patent/US5126188A/en
Publication of JPH0310545U publication Critical patent/JPH0310545U/ja
Application granted granted Critical
Publication of JPH0745963Y2 publication Critical patent/JPH0745963Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989071140U 1989-06-16 1989-06-16 Ｃｏｂ封止材料の流れ防止枠 Expired - Lifetime JPH0745963Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1989071140U JPH0745963Y2 (ja) 1989-06-16 1989-06-16 Ｃｏｂ封止材料の流れ防止枠
US07/539,816 US5126188A (en) 1989-06-16 1990-06-18 Shaped material for use in sealing electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989071140U JPH0745963Y2 (ja) 1989-06-16 1989-06-16 Ｃｏｂ封止材料の流れ防止枠

Publications (2)

Publication Number Publication Date
JPH0310545U JPH0310545U (enExample) 1991-01-31
JPH0745963Y2 true JPH0745963Y2 (ja) 1995-10-18

Family

ID=31607908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989071140U Expired - Lifetime JPH0745963Y2 (ja) 1989-06-16 1989-06-16 Ｃｏｂ封止材料の流れ防止枠

Country Status (1)

Country Link
JP (1) JPH0745963Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7575653B2 (en) * 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61285730A (ja) * 1985-06-13 1986-12-16 Oki Electric Ind Co Ltd 半導体装置の製造方法及びこれに用いる樹脂封止部材
JPS6239033A (ja) * 1985-08-14 1987-02-20 Matsushita Electric Works Ltd 半導体チツプキヤリアの製造方法
JPS6322735U (enExample) * 1986-07-29 1988-02-15

Also Published As

Publication number Publication date
JPH0310545U (enExample) 1991-01-31

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Legal Events

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EXPY Cancellation because of completion of term