JPH0737840Y2 - ミシン目加工用ペーパーカッター - Google Patents
ミシン目加工用ペーパーカッターInfo
- Publication number
- JPH0737840Y2 JPH0737840Y2 JP1989079279U JP7927989U JPH0737840Y2 JP H0737840 Y2 JPH0737840 Y2 JP H0737840Y2 JP 1989079279 U JP1989079279 U JP 1989079279U JP 7927989 U JP7927989 U JP 7927989U JP H0737840 Y2 JPH0737840 Y2 JP H0737840Y2
- Authority
- JP
- Japan
- Prior art keywords
- blade
- fixed blade
- round
- cutting
- paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989079279U JPH0737840Y2 (ja) | 1989-07-05 | 1989-07-05 | ミシン目加工用ペーパーカッター |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989079279U JPH0737840Y2 (ja) | 1989-07-05 | 1989-07-05 | ミシン目加工用ペーパーカッター |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0319697U JPH0319697U (da) | 1991-02-26 |
JPH0737840Y2 true JPH0737840Y2 (ja) | 1995-08-30 |
Family
ID=31623295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989079279U Expired - Lifetime JPH0737840Y2 (ja) | 1989-07-05 | 1989-07-05 | ミシン目加工用ペーパーカッター |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0737840Y2 (da) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6270170A (ja) * | 1985-09-19 | 1987-03-31 | Fuji Photo Film Co Ltd | 印画紙取扱い装置 |
-
1989
- 1989-07-05 JP JP1989079279U patent/JPH0737840Y2/ja not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
US8933369B2 (en) | 2000-09-13 | 2015-01-13 | Hamamatsu Photonics K.K. | Method of cutting a substrate and method of manufacturing a semiconductor device |
US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |
Also Published As
Publication number | Publication date |
---|---|
JPH0319697U (da) | 1991-02-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |