JPH073659Y2 - 回路基板装置 - Google Patents
回路基板装置Info
- Publication number
- JPH073659Y2 JPH073659Y2 JP1989049899U JP4989989U JPH073659Y2 JP H073659 Y2 JPH073659 Y2 JP H073659Y2 JP 1989049899 U JP1989049899 U JP 1989049899U JP 4989989 U JP4989989 U JP 4989989U JP H073659 Y2 JPH073659 Y2 JP H073659Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board device
- resin
- terminal pins
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989049899U JPH073659Y2 (ja) | 1989-04-27 | 1989-04-27 | 回路基板装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989049899U JPH073659Y2 (ja) | 1989-04-27 | 1989-04-27 | 回路基板装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02140866U JPH02140866U (enExample) | 1990-11-26 |
| JPH073659Y2 true JPH073659Y2 (ja) | 1995-01-30 |
Family
ID=31567984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989049899U Expired - Lifetime JPH073659Y2 (ja) | 1989-04-27 | 1989-04-27 | 回路基板装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073659Y2 (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0197578U (enExample) * | 1987-12-21 | 1989-06-29 |
-
1989
- 1989-04-27 JP JP1989049899U patent/JPH073659Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02140866U (enExample) | 1990-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4905124A (en) | IC card | |
| TW529323B (en) | Method for producing electronic device and electronic device and resin filling method | |
| JPH01315166A (ja) | プラスチック封入材を用いた集積回路パッケージ | |
| JPH073659Y2 (ja) | 回路基板装置 | |
| GB2149980A (en) | Packaging integrated circuits for connection to hybrid circuits | |
| US5749143A (en) | Process for forming a module | |
| EP0145327B1 (en) | Electrical interface arrangement | |
| JP2001168493A5 (enExample) | ||
| GB2260228A (en) | Electrical interconnector | |
| US12198995B2 (en) | Covers for semiconductor package components | |
| JP2788196B2 (ja) | Icカード用ic基板 | |
| JPS607152A (ja) | 半導体装置 | |
| JP2578399Y2 (ja) | 半導体素子の並列実装構造 | |
| JP2007329316A (ja) | 配線基板及び実装構造体 | |
| JPH0287654A (ja) | 表面実装型半導体装置 | |
| JPS5974639A (ja) | 薄板状集積回路基板の製法 | |
| JPH01152489A (ja) | 液晶表示板 | |
| JP2504586Y2 (ja) | 電子部品用パッケ―ジ | |
| JPH11220240A (ja) | 回路モジュールと該モジュールを備えた電子機器 | |
| JPS63302542A (ja) | 半導体装置 | |
| JPH0563140A (ja) | 混成集積回路の構造 | |
| JPS59208765A (ja) | 半導体装置用パツケ−ジ | |
| JPS59167041A (ja) | 集積回路のパツケ−ジ | |
| JPS63296991A (ja) | メモリカ−トリツジ | |
| JPH0210748A (ja) | 電子部品の実装方法 |