JPH073659Y2 - Circuit board device - Google Patents
Circuit board deviceInfo
- Publication number
- JPH073659Y2 JPH073659Y2 JP1989049899U JP4989989U JPH073659Y2 JP H073659 Y2 JPH073659 Y2 JP H073659Y2 JP 1989049899 U JP1989049899 U JP 1989049899U JP 4989989 U JP4989989 U JP 4989989U JP H073659 Y2 JPH073659 Y2 JP H073659Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board device
- resin
- terminal pins
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は回路基板装置に係り、特にセラミック製の回路
基板に端子ピンを設けてなる回路基板装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board device, and more particularly to a circuit board device in which terminal pins are provided on a ceramic circuit board.
従来の技術 一般に回路基板装置は、装置の小型化及び電子部品の高
密度配設を図るため、回路基板の両面に夫々電子部品を
配設した構成とされている。また、回路基板装置には外
部装置或は基板と接続するための端子ピンが設けられて
おり、この端子ピンは回路基板に垂立した状態で取付け
られる。更に回路基板の材質としては、絶縁性及び温
度，湿度特性の良好なセラミックが用いられたものがあ
る。2. Description of the Related Art In general, a circuit board device has a structure in which electronic parts are arranged on both sides of the circuit board in order to reduce the size of the device and to arrange electronic parts at a high density. Further, the circuit board device is provided with a terminal pin for connecting to an external device or a board, and the terminal pin is attached to the circuit board in an upright state. Further, as a material of the circuit board, there is a material that uses a ceramic having good insulation and temperature and humidity characteristics.
第８図は従来の回路基板装置36を示している。図中、37
は、セラミック製の回路基板、38は端子ピン、39は電子
部品を夫々示している。同図に示されるように、従来の
回路基板装置36では、端子ピン38が回路基板37の両側部
にのみ配設された構造となっていた。FIG. 8 shows a conventional circuit board device 36. 37 in the figure
Is a ceramic circuit board, 38 is a terminal pin, and 39 is an electronic component. As shown in the figure, in the conventional circuit board device 36, the terminal pins 38 are arranged only on both sides of the circuit board 37.
考案が解決しようとする課題 しかるに上記従来の回路基板装置36では、端子ピン38が
回路基板37の両側部にのみ配設され、かつ回路基板37の
材質は硬度が高いセラミック基板であったため、例えば
台40上に載置された状態にある回路基板装置36に対し第
８図（Ｂ）中矢印Ｆで示すような外力が印加された場
合、回路基板37の短辺側は端子ピン38により保持されて
いないため、中央から回路基板37が割れてしまう事故が
発生するという課題があった。However, in the above-described conventional circuit board device 36, the terminal pins 38 are disposed only on both sides of the circuit board 37, and the material of the circuit board 37 is a ceramic board having high hardness. When an external force as indicated by an arrow F in FIG. 8 (B) is applied to the circuit board device 36 placed on the table 40, the short side of the circuit board 37 is held by the terminal pin 38. Since it has not been done, there was a problem that the circuit board 37 would break from the center.
本考案は上記の点に鑑みてなされたものであり、回路基
板の機械的強度の向上を図り得る回路基板装置を提供す
ることを目的とする。The present invention has been made in view of the above points, and an object thereof is to provide a circuit board device capable of improving the mechanical strength of the circuit board.
課題を解決するための手段 上記課題を解決するために、本考案では、 セラミック製の回路基板と、該回路基板の全外周辺に沿
って垂立するよう配設された複数の端子ピンと、該回路
基板の下部に配置されて、かつ該端子ピンを一体成型し
てなるモールド体と、該回路基板に設けられた切欠部
と、該回路基板を樹脂封止するケースを設けた構成とし
たことを特徴とするものである。Means for Solving the Problems In order to solve the above problems, according to the present invention, a circuit board made of ceramic, a plurality of terminal pins arranged so as to stand vertically along the entire outer periphery of the circuit board, A structure provided with a molded body that is disposed under the circuit board and integrally molded with the terminal pins, a notch provided in the circuit board, and a case that seals the circuit board with resin. It is characterized by.
作用 上記構成とされた回路基板装置では、回路基板の全周に
わたり配設された端子ピンが、モールド体に一体成型さ
れているので外力が加わった場合に発生する可能性のあ
る端子ピンの曲がりが生じにくくなる。また、回路基板
の下にモールド体を設けることで回路基板の強度は一層
高くなる。更に回路基板をケース内で樹脂封入する際、
切欠部を設けたことによって回路基板の裏面にも樹脂が
行き渡り、回路基板は両面が樹脂封止された構造とな
る。よって回路基板装置が台等の上に載置され、端子ピ
ンにより回路基板が台と離間した位置で支持された状態
において回路基板の中央に外力が印加されても、回路基
板は、下部に設けられたモールド体に支持され、かつモ
ールド体に一体成型された端子ピンが全外周に配設され
ているため、また切欠部を設けたことにより回路基板の
裏面にも樹脂が行き渡り、回路基板が両面とも樹脂封止
されているため、機械的強度は強く回路基板が割れるよ
うなことはない。In the circuit board device configured as described above, since the terminal pins arranged over the entire circumference of the circuit board are integrally molded in the mold body, the terminal pin bending that may occur when an external force is applied. Is less likely to occur. Further, the strength of the circuit board is further increased by providing the molded body under the circuit board. Furthermore, when sealing the circuit board with resin in the case,
By providing the notch, the resin also spreads to the back surface of the circuit board, and the circuit board has a structure in which both surfaces are resin-sealed. Therefore, even if an external force is applied to the center of the circuit board in a state where the circuit board device is placed on the table or the like and the circuit board is supported by the terminal pins at a position separated from the table, the circuit board is provided at the bottom. Since the terminal pins, which are supported by the molded body and molded integrally with the molded body, are arranged on the entire outer circumference, the resin also spreads to the back surface of the circuit board by providing the notch, and Since both sides are resin-sealed, the mechanical strength is strong and the circuit board does not crack.
実施例 次に本考案の実施例について図面と共に説明する。第１
図乃至第４図は本考案の一実施例である回路基板装置１
を示している。同図に示す回路基板装置１はパーソナル
コンピュータのシステムを構成するフロッピーディスク
制御回路が組込まれたものである。Embodiment Next, an embodiment of the present invention will be described with reference to the drawings. First
4 to 4 are circuit board devices 1 according to an embodiment of the present invention.
Is shown. The circuit board device 1 shown in the figure incorporates a floppy disk control circuit constituting a system of a personal computer.
まず第５図を用いて本考案になる回路基板装置１が適用
される一般のパーソナルコンピュータのシステム構成に
ついて説明する。同図中、２はパーソナルコンピュータ
本体で、コンピュータをモジュール化したコンピュータ
モジュール3,外部機器に対する入出力制御を行なうイン
タフェースモジュール4,拡張メモリ5,DC/DCコンバー
タ，リセット回路７等にて構成されている。コンピュー
タモジュール３には外部端子が設けられており、ACアダ
プタ８からDC/DCコンバータ６を介して電源電圧が与え
られ、又、キーボード及び外部機器９からの各種情報を
供給されて各種演算処理を行なう。First, the system configuration of a general personal computer to which the circuit board device 1 according to the present invention is applied will be described with reference to FIG. In the figure, 2 is a personal computer main body, which is composed of a computer module 3 that is a modularized computer, an interface module 4 that controls input and output to external devices, an expansion memory 5, a DC / DC converter, a reset circuit 7, and the like. There is. The computer module 3 is provided with an external terminal, is supplied with a power supply voltage from the AC adapter 8 through the DC / DC converter 6, and is supplied with various kinds of information from the keyboard and the external device 9 to perform various kinds of arithmetic processing. To do.
インタフェースモジュール４は、磁気ディスク10に対す
る制御を行なう磁気ディスク制御回路11,変・復調器12
に対する入出力制御を行なう直列入出力インタフェース
13,プリンタ14に対する入出力制御を行なうプログラマ
ブル並列入出力インタフェース15,モニタ16に対する入
出力制御を行なうディスプレイインタフェース17、そし
て本考案になる回路基板装置１に組込まれフロッピーデ
ィスク18に対する制御を行なうフロッピーディスク制御
回路19とにより構成されている。The interface module 4 includes a magnetic disk control circuit 11 for controlling the magnetic disk 10 and a modulator / demodulator 12
Serial input / output interface for controlling input / output to / from
13, programmable parallel input / output interface 15 for controlling input / output to / from printer 14, display interface 17 for controlling input / output to monitor 16, and floppy disk for controlling floppy disk 18 incorporated in circuit board device 1 according to the present invention And a control circuit 19.
次に再び第１図乃至第４図に戻り回路基板装置１の具体
的構成について説明する。図中、20はセラミック製の回
路基板であり、その表面20a及び裏面20bには種々の電子
部品が配設されている。Next, referring again to FIGS. 1 to 4, the specific configuration of the circuit board device 1 will be described. In the figure, reference numeral 20 denotes a ceramic circuit board, and various electronic components are arranged on the front surface 20a and the back surface 20b thereof.
まず、第１図を用いて回路基板20の表面20aに配設され
た電子部品について説明する。表面20aには、集積化さ
れたフロッピーディスク制御回路21（FDC）、所定周波
数で発振する水晶振動子22,23、電解コンデンサ24等が
配設されている。これらの電子部品21〜24は容積が大き
く、背の高い（表面20a上に突出する寸法が大きい）部
品である。このように背の高い電子部品21〜24は、集約
的に回路基板20の表面29aに配設されている。First, the electronic components arranged on the surface 20a of the circuit board 20 will be described with reference to FIG. On the surface 20a, an integrated floppy disk control circuit 21 (FDC), crystal oscillators 22 and 23 that oscillate at a predetermined frequency, an electrolytic capacitor 24, etc. are arranged. These electronic components 21 to 24 are components having a large volume and being tall (the size of projecting above the surface 20a is large). Such tall electronic components 21 to 24 are collectively arranged on the surface 29a of the circuit board 20.
次に第３図を用いて回路基板20の裏面20bに配設された
電子部品について説明する。裏面20bにはデコーダ25,チ
ップコンデンサ26a〜26fが配設されている。これらの電
子部品25,26a〜26fは背の低い部品であり、このように
背の低い電子部品25,26a〜26fは集約的に回路基板20の
裏面20bに配設されている。Next, the electronic components arranged on the back surface 20b of the circuit board 20 will be described with reference to FIG. A decoder 25 and chip capacitors 26a to 26f are provided on the back surface 20b. These electronic components 25, 26a to 26f are short components, and thus the short electronic components 25, 26a to 26f are collectively arranged on the back surface 20b of the circuit board 20.
また、裏面20bの周縁近傍には、多数の端子ピン27が回
路基板20の全外周辺に沿うように配設されている。この
端子ピン27はモールド体28〜31に一体成型されているた
め、ピン強度は強く曲がりの発生が防止されている。ま
た端子ピン27はモールド体28〜31にインサート成型され
てモールド体と一体化した後に回路基板20に配設される
ため、多数の端子ピンを一括的に、また個々の端子ピン
27の位置決めを行なう必要なく回路基板20に取付けるこ
とができる。Further, in the vicinity of the peripheral edge of the back surface 20b, a large number of terminal pins 27 are arranged along the entire outer periphery of the circuit board 20. Since the terminal pin 27 is integrally molded with the molded bodies 28 to 31, the pin strength is strong and the occurrence of bending is prevented. Further, since the terminal pins 27 are insert-molded into the molded bodies 28 to 31 and integrated with the molded bodies and then arranged on the circuit board 20, a large number of terminal pins are collectively or individually.
It can be mounted on the circuit board 20 without having to position 27.
ここで、端子ピン27の配設位置と回路基板20の機械的強
度の関係について述べる。前記したように回路基板装置
１では端子ピン27が回路基板20の全外周辺に沿って配設
されており、従って回路基板20の長辺側の側辺ばかりで
はなく短辺側の側辺にも端子ピン27が配設されている。
この構造とすることにより、各端子ピン27に支持された
回路基板20に外力Ｆ（第２図及び第４図参照）が印加さ
れたとしても、回路基板20の全外周辺が端子ピン27に支
持されているため機械的な強度は向上しており、回路基
板20が折れてしまったり割れてしまうようなことはな
い。Here, the relationship between the arrangement position of the terminal pin 27 and the mechanical strength of the circuit board 20 will be described. As described above, in the circuit board device 1, the terminal pins 27 are arranged along the entire outer periphery of the circuit board 20, so that not only the long side sides but also the short side sides of the circuit board 20 are arranged. Is also provided with terminal pins 27.
With this structure, even if an external force F (see FIGS. 2 and 4) is applied to the circuit board 20 supported by each terminal pin 27, the entire outer periphery of the circuit board 20 is applied to the terminal pin 27. Since it is supported, the mechanical strength is improved, and the circuit board 20 is not broken or cracked.
また、端子ピン27が回路基板20に配設された状態で、各
モールド体28〜31は回路基板20の裏面20bと当接してお
り補強材としての機能を奏している。この各モールド体
28〜31によっても回路基板20の機械的強度は向上する。
このように、端子ピン27を全外周辺に沿って配設し、ま
たモールド体28〜31を当接させることにより回路基板20
の機械的強度は向上するため、硬いセラミック製基板で
あっても外力印加によって割れが発生することはなく、
よって回路基板装置１の信頼性を向上することができ
る。Further, in a state where the terminal pins 27 are arranged on the circuit board 20, the molded bodies 28 to 31 are in contact with the back surface 20b of the circuit board 20 and thus function as a reinforcing material. This mold body
28 to 31 also improve the mechanical strength of the circuit board 20.
In this way, the terminal pins 27 are arranged along the entire outer periphery, and the molded bodies 28 to 31 are brought into contact with each other, whereby the circuit board 20.
Since the mechanical strength of is improved, cracking does not occur due to the application of external force even on a hard ceramic substrate,
Therefore, the reliability of the circuit board device 1 can be improved.
尚、回路基板装置１はケース32に装着される。これにつ
いて、第６図及び第７図を用いて説明する。The circuit board device 1 is mounted in the case 32. This will be described with reference to FIGS. 6 and 7.
回路基板装置１は配設される電子部品の保護及び取扱い
性を向上させるためケース32に装着されモジュール化さ
れる。回路基板装置１をケース32に装着するには、先ず
第６図に示すようにケース32内に樹脂33（梨地で示す）
を入れておき、上部より回路基板装置１をケース33内に
挿入する。これにより、回路基板装置１は樹脂33に浸漬
されたような状態となる。この時、回路基板20の所定位
置には切欠部34,35（第１図及び第３図に詳しい）が形
成されているため、回路基板装置１をケース32内に挿入
するのに伴い樹脂33は第７図に矢印で示すように切欠部
33,34を通って回路基板20の裏面20b側に進行していく。
よって回路基板装置１の樹脂封止を円滑に行なうことが
できる。また、樹脂33は可撓性を有するゴム製樹脂が使
用されている。よって樹脂封止の際電子部品等に生じる
熱応力は樹脂33により吸収され、樹脂封止時に発生する
電子部品等の損傷を有効に防止している。The circuit board device 1 is mounted in a case 32 and modularized in order to improve the protection and handling of the electronic components provided. In order to mount the circuit board device 1 in the case 32, first, as shown in FIG. 6, resin 33 (shown in satin) is placed in the case 32.
And the circuit board device 1 is inserted into the case 33 from above. As a result, the circuit board device 1 is in a state of being immersed in the resin 33. At this time, since the notches 34 and 35 (detailed in FIGS. 1 and 3) are formed at predetermined positions of the circuit board 20, the resin 33 is inserted as the circuit board device 1 is inserted into the case 32. Is the notch as shown by the arrow in FIG.
Proceeds to the back surface 20b side of the circuit board 20 through 33 and 34.
Therefore, the circuit board device 1 can be smoothly sealed with resin. The resin 33 is made of a flexible rubber resin. Therefore, the thermal stress generated in the electronic component or the like during the resin sealing is absorbed by the resin 33, effectively preventing the electronic component or the like from being damaged during the resin sealing.
考案の効果 上述の如く、本考案によれば、端子ピンが、回路基板下
のモールド体に一体成型され、かつ回路基板の全外周に
配設されるため、また切欠部を設けたことによって、回
路基板の樹脂封止が回路基板の裏表、両面に行なわれる
ため、回路基板の機械的強度を向上させることができ、
よって外力印加等があっても回路機基板の損傷を有効に
防止することができる等の特長を有する。Advantageous Effects of Invention As described above, according to the present invention, the terminal pin is integrally molded with the molded body under the circuit board and is disposed on the entire outer circumference of the circuit board. Since the circuit board is sealed with resin on the front and back sides, the mechanical strength of the circuit board can be improved.
Therefore, it is possible to effectively prevent damage to the circuit board even when external force is applied.
第１図は本考案の一実施例である回路基板装置の平面
図、第２図は回路基板装置の正面図、第３図は回路基板
装置の底面図、第４図は回路基板装置の右側面図、第５
図は回路基板装置が適用されるパーソナルコンピュータ
のシステム構成を説明するための図、第６図及び第７図
は回路基板装置の樹脂封止を説明するための図、第８図
は従来の回路基板装置の一例を説明するための図であ
る。 １……回路基板装置、20……回路基板、20a……表面、2
0b……裏面、27……端子ピン、28〜31……モールド体、
32……ケース、33……樹脂、34,35……切欠部。1 is a plan view of a circuit board device according to an embodiment of the present invention, FIG. 2 is a front view of the circuit board device, FIG. 3 is a bottom view of the circuit board device, and FIG. 4 is a right side of the circuit board device. Floor plan, fifth
FIG. 6 is a diagram for explaining the system configuration of a personal computer to which the circuit board device is applied, FIGS. 6 and 7 are diagrams for explaining resin sealing of the circuit board device, and FIG. 8 is a conventional circuit. It is a figure for explaining an example of a substrate device. 1 ... Circuit board device, 20 ... Circuit board, 20a ... Front surface, 2
0b …… Back side, 27 …… Terminal pins, 28 to 31 …… Molded body,
32 …… Case, 33 …… Resin, 34,35 …… Notches.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−69700（ＪＰ，Ａ) 実開 平１−97578（ＪＰ，Ｕ) 実開 昭63−59367（ＪＰ，Ｕ) 実開 昭54−146858（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-62-69700 (JP, A) Actually open 1-97578 (JP, U) Actually open 63-59367 (JP, U) Actually open 54- 146858 (JP, U)
Claims (1)
全外周辺に沿って垂立するよう配設された複数の端子ピ
ンと、該回路基板の下部に配置されると共に、該端子ピ
ンを一体成型してなるモールド体と、該回路基板に設け
られた切欠部と、該回路基板を樹脂封止するケースを設
けてなる構成の回路基板装置。1. A circuit board made of ceramic, a plurality of terminal pins arranged upright along the entire outer periphery of the circuit board, and arranged at the bottom of the circuit board, A circuit board device comprising a molded body integrally formed, a notch provided in the circuit board, and a case for resin-sealing the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989049899U JPH073659Y2 (en) | 1989-04-27 | 1989-04-27 | Circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989049899U JPH073659Y2 (en) | 1989-04-27 | 1989-04-27 | Circuit board device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02140866U JPH02140866U (en) | 1990-11-26 |
| JPH073659Y2 true JPH073659Y2 (en) | 1995-01-30 |
Family
ID=31567984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989049899U Expired - Lifetime JPH073659Y2 (en) | 1989-04-27 | 1989-04-27 | Circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073659Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0197578U (en) * | 1987-12-21 | 1989-06-29 |
-
1989
- 1989-04-27 JP JP1989049899U patent/JPH073659Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02140866U (en) | 1990-11-26 |
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