JPH0210748A - Electronic part mounting method - Google Patents
Electronic part mounting methodInfo
- Publication number
- JPH0210748A JPH0210748A JP15946988A JP15946988A JPH0210748A JP H0210748 A JPH0210748 A JP H0210748A JP 15946988 A JP15946988 A JP 15946988A JP 15946988 A JP15946988 A JP 15946988A JP H0210748 A JPH0210748 A JP H0210748A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- board
- electronic part
- adhesive tape
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000007789 sealing Methods 0.000 claims abstract description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 abstract description 11
- 239000000565 sealant Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、例えばＩＣカード等の携帯可能媒体内への電
子部品の実装に好適な電子部品の実装方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for mounting electronic components suitable for mounting electronic components into a portable medium such as an IC card.
（従来の技術）
近年、ＣＰＵやメモリ等の電子部品を内蔵した携帯可能
媒体として、例えば所謂ＩＣカードが注目されている。(Prior Art) In recent years, so-called IC cards, for example, have been attracting attention as portable media containing electronic components such as a CPU and memory.
ＩＣカードは、現在普及している磁気カードに比べてそ
の外形・大きさは略同−であるが、情報記憶量の膨大さ
、処理能力の高さ等から、近い将来には磁気カードに代
わり普及すると予想されている。Although IC cards are approximately the same in appearance and size as the currently popular magnetic cards, they will likely replace magnetic cards in the near future due to their huge amount of information storage and high processing power. It is expected to become popular.
ところで、ＩＣカードにおける内蔵しようとする電子部
品の実装にあっては、所要の薄型化を達成するべく種々
の方法が採られている。その一つに、第３図に示す如く
、電子部品１を実装する基板３に対しその実装位置に電
子部品１の大きさより若干大きな収納孔５を形成してお
き、電子部品１をこの収納孔内５に収納しワイヤボンデ
ィング後にダム９で囲まれる領域を封止剤７で封止する
ことで実装する方法がある。この方法によれば、基板上
に電子部品を実装する場合に比べて略基板の厚さ分だけ
薄型化を達成できるのである。By the way, when mounting electronic components to be incorporated into an IC card, various methods have been adopted to achieve the required thickness reduction. One method is to form a storage hole 5 slightly larger than the size of the electronic component 1 in the mounting position of the board 3 on which the electronic component 1 is mounted, as shown in FIG. There is a method of mounting the dam 9 by sealing the area surrounded by the dam 9 with a sealant 7 after wire bonding. According to this method, compared to the case where electronic components are mounted on a board, it is possible to achieve a reduction in thickness by approximately the thickness of the board.
（発明が解決しようとする課題）
しかしながら、この実装方法にあっては、次のような改
善点を有していた。すなわち、電子部品１の実装に当っ
ては、電子部品１と基板３の収柄孔５との相対位置を正
確に位置決めし、且つ少なくとも実装中はこれを保持し
ておくため、電子部品１および基板３を仮固定するため
の台座基板１１を必要とするが、この台座基板１１は本
来的に実装時のみに必要なもので、実装後は特に必要な
ものではなく、その存在が前述した如きＩＣカードの薄
型化を一層進める上での障害となっているのである。(Problems to be Solved by the Invention) However, this mounting method had the following improvements. That is, when mounting the electronic component 1, the relative position of the electronic component 1 and the handle hole 5 of the board 3 is accurately determined and held at least during the mounting. A pedestal board 11 is required for temporarily fixing the board 3, but this pedestal board 11 is essentially required only during mounting, and is not particularly necessary after mounting. This is an obstacle to further making IC cards thinner.
本発明は上記に雪みてなされたもので、その目的として
は、電子部品の一層の薄型実装に寄与し得る電子部品の
実装方法を提供することにある。The present invention has been made in view of the above, and an object thereof is to provide a method for mounting electronic components that can contribute to even thinner mounting of electronic components.
（課題を解決するための手段）
上記目的を達成するため、本発明は、実装用の基板に形
成された収納孔に対し実装しようとする電子部品を当該
収納孔の底面を塞ぐように設けられた着脱可能な台座手
段で所要の相対位置に仮固定して位置決めした上で導通
接続すると共に封止することで基板に固定した後に台座
手段を除去することを要旨とする。(Means for Solving the Problems) In order to achieve the above object, the present invention provides an electronic component to be mounted in a storage hole formed in a mounting board so as to block the bottom surface of the storage hole. The gist of the present invention is to remove the pedestal means after temporarily fixing it to a desired relative position using a removable pedestal means, positioning it, connecting it electrically and sealing it to the substrate.
（作用）
本発明に係る電子部品の実装方法にあっては、基板の収
納孔に対する電子部品の相対位置決めを当該収納孔の底
面を塞ぐように設けられた着脱可能な台座手段で行ない
、電子部品を導通接続すると共に封止することで基板に
固定した後にこの台座手段を除去している。(Function) In the electronic component mounting method according to the present invention, the relative positioning of the electronic component with respect to the storage hole of the board is performed using a removable pedestal means provided so as to close the bottom surface of the storage hole, and the electronic component This pedestal means is removed after being fixed to the substrate by electrically connecting and sealing.
（実施例） 以下、図面を用いて本発明の詳細な説明する。(Example) Hereinafter, the present invention will be explained in detail using the drawings.
第１図（Ａ）乃至第１図（Ｃ）は本発明の一実施例を示
すものである。その特徴としては、台座手段を構成する
耐熱性の粘着テープ１３上に基板３を粘着固定した上で
電子部品１を収納孔５内において所定の相対位置となる
ように粘着テープ１３上に粘着固定することで位置決め
し、（第１図（Ａ）参照）、ワイヤ１５によるワイヤボ
ンディングおよび封止剤７による封止を行なうことで電
子部品１を基板３に固定した後に（第１図（Ａ）。FIG. 1(A) to FIG. 1(C) show an embodiment of the present invention. The feature is that the substrate 3 is adhesively fixed on a heat-resistant adhesive tape 13 constituting the pedestal means, and then the electronic component 1 is adhesively fixed on the adhesive tape 13 at a predetermined relative position in the storage hole 5. After fixing the electronic component 1 to the substrate 3 by wire bonding with the wire 15 and sealing with the sealant 7 (see FIG. 1(A)), .
（Ｂ）参照）、粘着テープ１３をはがずようにしたこと
にある（第１図（Ｃ）参照）、なお、第３図と同一物に
は同一符号を付して詳細な説明は省略する。(B)), and the adhesive tape 13 is removable (see Figure 1 (C)). Components that are the same as those in Figure 3 are given the same reference numerals, and detailed explanations are omitted. do.
粘着テープ１３としては、封止剤７の溶融温度に耐えて
変形、破断等の生じない材質製のものが選ばれる。The adhesive tape 13 is selected from a material that can withstand the melting temperature of the sealant 7 and does not deform or break.
したがって本実施例によれば、実装終了後は粘着テープ
がなくなるので、従来の実装方法に比べて適切な実装を
確保しつつ薄型化を妨げるようなことがない。Therefore, according to this embodiment, since the adhesive tape is no longer used after the mounting is completed, proper mounting can be ensured and there is no problem with thinning, compared to conventional mounting methods.
なお、本実施例では台座手段として粘着テープを用いた
が、これに限定されるものではなく、要は実装終了後に
容易に着脱自在のものであればよい。Although adhesive tape is used as the pedestal means in this embodiment, it is not limited to this, and any material may be used as long as it can be easily attached and detached after the mounting is completed.
また、粘着テープとして絶縁性を有するものを用いるこ
とによっては、第２図に示す如く、実装終了後にこれを
はがさないことでそのままで絶縁シートとして利用する
ことができ、別個に絶縁シートを設ける作業工程を省略
することができる。In addition, by using an insulating adhesive tape, as shown in Figure 2, it can be used as an insulating sheet without peeling it off after mounting, or it can be used as an insulating sheet separately. It is possible to omit the work step of providing it.
なお、第２図の実施例においては、封止剤７の高さを調
整し基板３と面一になるように基板３の底面だけでなく
表面にも粘着テープ１３を配備している。ここで、第２
図において、１７は外装シートである。In the embodiment shown in FIG. 2, the adhesive tape 13 is provided not only on the bottom surface of the substrate 3 but also on the surface thereof so that the height of the sealant 7 is adjusted so that it is flush with the substrate 3. Here, the second
In the figure, 17 is an exterior sheet.
以上説明したように本発明によれば、基板の収納孔に対
する電子部品の相対位置決めを当該収納孔の底面を塞ぐ
ように設けられた着脱可能な台座手段で行ない、電子部
品を導通接続すると共に封止することで基板に固定した
後にこの台座手段を除去するようにしたので、電子部品
の一層の薄型実装に寄与できる。As explained above, according to the present invention, the electronic component is positioned relative to the storage hole of the board by the removable pedestal means provided to cover the bottom surface of the storage hole, and the electronic component is electrically connected and sealed. Since this pedestal means is removed after being fixed to the board by stopping, it is possible to contribute to even thinner mounting of electronic components.
第１図（Ａ＞乃至第１図（Ｃ）は本発明の一実施例を示
す図、第２図は本発明の変形例を示す図、第３図は従来
例を示す図である。
１・・・電子部品
３・・・基板
５・・・収納孔
７・・・封止剤
９・・・ダム
ト・・台座基板
３・・・粘着テープ
５・・・ワイヤ
７・・・外装シート
閏（Ａ）
図（Ｂ）
図（Ｃ）1 (A> to 1C) are diagrams showing an embodiment of the present invention, FIG. 2 is a diagram showing a modification of the present invention, and FIG. 3 is a diagram showing a conventional example. 1 ...Electronic component 3...Substrate 5...Accommodation hole 7...Sealant 9...Damt...Pedestal board 3...Adhesive tape 5...Wire 7...Exterior sheet cover (A) Figure (B) Figure (C)
Claims (1)
る電子部品を当該収納孔の底面を塞ぐように設けられた
着脱可能な台座手段で所要の相対位置に仮固定して位置
決めした上で導通接続すると共に封止することで基板に
固定した後に台座手段を除去することを特徴とする電子
部品の実装方法。After positioning the electronic component to be mounted in the storage hole formed in the mounting board by temporarily fixing it at a required relative position using a removable pedestal means provided to cover the bottom of the storage hole, A method for mounting an electronic component, which comprises removing a pedestal means after fixing the component to a substrate by making a conductive connection and sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15946988A JPH0210748A (en) | 1988-06-29 | 1988-06-29 | Electronic part mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15946988A JPH0210748A (en) | 1988-06-29 | 1988-06-29 | Electronic part mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0210748A true JPH0210748A (en) | 1990-01-16 |
Family
ID=15694452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15946988A Pending JPH0210748A (en) | 1988-06-29 | 1988-06-29 | Electronic part mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0210748A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000062338A1 (en) * | 1999-04-12 | 2000-10-19 | Nitto Denko Corporation | Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames or the like |
-
1988
- 1988-06-29 JP JP15946988A patent/JPH0210748A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000062338A1 (en) * | 1999-04-12 | 2000-10-19 | Nitto Denko Corporation | Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames or the like |
| KR100665441B1 (en) * | 1999-04-12 | 2007-01-04 | 닛토덴코 가부시키가이샤 | Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames or the like |
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