JPH01316995A - Electronic component packaging method - Google Patents

Abstract

PURPOSE:To enable a wiring pattern and a conductor to be fixed to each other by a method wherein an electronic component is made to be in such a state that it is kept bearing on a wiring pattern as being housed in a housing hole formed on a substrate, and the conductor, which makes the terminal of the component connected with the wiring pattern that is provided to a substrate, is provided to the terminal concerned. CONSTITUTION:At the packaging of a flat type crystal vibrator 15 on a substrate 3, a rectangular conductor 13 is previously provided to a terminal 17 of the flat type crystal oscillator 15 in such a state that it bears on a wiring pattern 9 of the substrate 3 under a condition that the vibrator 15 is housed in a housing hole 5 of the substrate 3, and a bearing section between the conductor 13 and the wiring pattern 9 is fixed with a solder 11 at packaging. The conductor 13 is, for instance, composed of a copper foil and formed into a rectangular shape so as to bear on the wiring pattern of the substrate 3 in a state that the oscillator 15 is housed in the housing hole 5 of the substrate 3, which is previously fixed to the terminal 17 of the flat type crystal vibrator 15 before packaging.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to a method for mounting an electronic component, such as a flat crystal impeller, in which terminals are formed only on the surface of the main body.

(Prior Art) In recent years, so-called IC cards, for example, have been attracting attention as portable media containing electronic components such as a CPU and memory.

Although IC cards are slightly smaller in appearance and size than the currently popular magnetic cards, they will likely replace magnetic cards in the near future due to their huge amount of information storage and high processing power. It is expected to become popular.

By the way, when mounting electronic components to be incorporated into an IC card, various methods have been adopted to achieve the required thickness reduction. One method is to form a storage hole slightly larger than the size of the electronic component at the mounting position of the board on which the electronic component is mounted, and to store and mount the C electronic component in this storage hole. According to this method, compared to the case where electronic components are mounted on a board, it is possible to achieve a reduction in thickness by approximately the thickness of the board.

(Problems to be Solved by the Invention) However, this mounting method had the following improvements. That is, when mounting an electronic component such as a flat crystal resonator in which terminals are formed only on the surface of the main body using the mounting method described above, the mounting method shown in FIGS.
As shown in B), after the electronic component 1 is positioned in the storage hole 5 formed in the substrate 3 by some means, the terminal 7 and the wiring pattern 9 provided in the substrate 3 are fixed with solder 11. However, the solder 11 is connected to the terminal 7 and the wiring pattern 9.
Since it is necessary to supply the solder so that it forms a bridge between the solder and the solder, if the amount of solder supplied is insufficient, the adhesion between the two becomes uncertain, and conversely, if there is too much solder, it may cause a thermal effect on the main body of the electronic component. I might give it away.

In addition, when supplying solder, it is necessary to position the electronic component 1 within the storage hole 5, which requires time and effort.

The present invention has been made in view of the above, and its purpose is to enable reliable mounting without affecting the electronic component body when mounting an electronic component in which terminals are formed only on the surface of the body. The object of the present invention is to provide a method for mounting electronic components.

(Structure of the Invention) <Means for Solving the Problems> In order to achieve the above object, after storing an electronic component in which a terminal is formed only on the surface of the main body into a storage hole provided in a board, the terminal is inserted into the board. In a mounting method for electronic components in which the electronic component is mounted by connecting and fixing the terminal to a wiring pattern provided on the terminal, the present invention provides a method for mounting an electronic component by connecting and fixing the terminal to the wiring pattern while the electronic component is housed, and in which the terminal is in contact with the wiring pattern and the terminal is connected to the wiring pattern. The gist of the present invention is to provide a conductor such as this on the terminal, and to fix the wiring pattern and the conductor to each other after storing the electronic component.

(Function) In the electronic component mounting method according to the present invention, the terminal is in contact with the wiring pattern while the electronic component formed only on the surface of the main body is housed in the storage hole formed in the board. In addition, a conductor is provided on the terminal to connect the terminal to a wiring pattern provided on the board, and the wiring pattern and the S electric body are fixed to each other after the electronic component is housed. Thereby, it is not necessary to directly fix the terminal and the wiring pattern, and it is only necessary to fix the conductor and the wiring pattern that are in contact with each other when stored.

(Example) Hereinafter, the present invention will be explained in detail using the drawings.

1 to 3 show an embodiment in which the present invention is applied to the mounting of a flat crystal resonator. A plan view in the mounted state, FIG. 1 (B) is a sectional view taken along the line a-a of FIG.
The figure is a perspective view of the flat crystal resonator 15 with the conductor 13 fixed to the terminal 7, FIG. 3 (A> is a partial plan view of the flat crystal resonator 3, and FIG. Figure 3 (A> b-b
It is a li sectional view. In addition, in FIGS. 1 to 3,
Components that are the same as those in FIG. 5 are given the same reference numerals and their explanations will be omitted.

Its characteristics include the substrate 3 of the flat crystal 1lii mover 15.
When mounting the rectangular conductor 13 on the flat crystal resonator 15, the rectangular conductor 13 is in contact with the wiring pattern 9 of the board 3 when the flat crystal resonator 15 is stored in the storage hole 5 of the board 3.
(see FIG. 2), and when mounted, the abutting portions of the conductor 13 and the wiring pattern 9 are fixed with solder 11 (see FIG. 1).

The flat crystal camera 15 is equipped with a tuning fork 19 inside, as shown in FIG.
This is done through terminals 17 formed on the lower surface of the . In FIG. 3, reference numeral 113 designates a fixing paste for fixing one end of the tuning fork 19 to the main body, 25 a through hole, and 27 a top lid.

The conductor 13 is made of m-foil, for example, and comes into contact with the wiring pattern 9 of the substrate 3 when the flat crystal resonator 15 is accommodated in the accommodation hole 5 of the substrate 3 (see FIG. 1). It is formed into a rectangular shape, and is fixed to the terminal 17 of the flat crystal sensor 15 as shown in FIG. 2 before mounting. Note that the adhesion of the conductor 13 to the terminal 17 is such that, for example, the adhesion of the conductor 13 to the wiring pattern 9 is approximately 170'C.
If it is decided to use low-temperature solder of about 230° C., solder at about 230° C. is used.

Therefore, according to this embodiment, due to the presence of the conductor 13, when the flat crystal oscillator 15 is stored in the storage hole 5 of the substrate 3, the conductor 13 comes into contact with the wiring pattern 9. The flat type crystal oscillator 15 is supported without falling within the storage hole 5, and there is no need to support and position it by some means until it is fixed with solder as in the conventional case, and the work effort is reduced. Furthermore, during mounting, it is only necessary to solder the contact portion between the conductor 13 and the wiring pattern 9, which eliminates the uncertainty of soldering and reduces heat to the flat crystal resonator 15. There is no impact.

In this embodiment, the mounting target is described as a flat crystal resonator, but the present invention is not limited to this, and any electronic component may be used as long as the terminals are formed only on the surface of the main body.

Further, as another electronic component mentioned above, for example, a magnetic field generating device such as a coil formed on ceramic using thin film manufacturing technology can be considered, but in this case, the portable medium 31 is configured as shown in FIG. It is preferable to form a notch hole 37 in the back metal plate 33 at the mounting portion of the magnetic field generating device 35.

As a result, compared to the case without the notch hole 37, the back metal plate 33 is made of a material having low magnetic permeability, such as titanium, in order to reduce the absorption of the generated magnetic field by the back metal plate 33 and ensure leakage magnetic flux Zffi to the outside. There is no need to use such expensive materials, and inexpensive non-magnetic stainless steel plates can be used.

In addition, with the provision of the notch hole 37 in the back metal plate 33,
For example, the notch hole 37 is filled with a silicone resin 38, and a decorative board 39 is made by printing on a polyester film.
It is important to protect the magnetic field generating device 35 by pasting it. In addition, in FIG. 4, 41 is a front metal plate made of a 5t JS304 series 0.1 x mi stainless steel plate together with the back metal plate 33, 43 is a guard frame, and the first
Components that are the same as those in FIGS. 3 to 3 are denoted by the same reference numerals, and explanations thereof will be omitted.

[Effects of the Invention] As explained above, according to the present invention, the terminal is in contact with the wiring pattern while the electronic component formed only on the surface of the main body is housed in the storage hole formed in the substrate, and A conductor is provided on the terminal to connect the terminal to a wiring pattern provided on the board, and the wiring pattern and the conductor are fixed to each other after the electronic component is housed. As a result, there is no need to directly fix the terminal and the wiring pattern, and it is only necessary to fix the conductor and the wiring pattern in the relevant state when stored. When mounting components, reliable mounting can be performed without affecting the main body of the electronic component.

[Brief explanation of the drawing]

1 to 3 are views showing one embodiment of the present invention, FIG. 4 is a view showing a modification of the present invention, and FIG. 5 is a view showing a conventional example. 1... Electronic component 3... Board 5... Storage hole 7... Terminal 9... Wiring pattern 11.
... Solder 13 ... Conductor 15 ... Flat crystal oscillator 17 ... Terminal 19 ... Tuning fork 31 ...
... Portable medium 33 ... Back metal plate 35 ...
Magnetic field generator 37...Notch hole 41...Surface metal plate 43...Guard frame Yono 2 to Row No. 52 MP It 93b Figure 1 (A) Figure 1 (B) Day 1 Figure 3 (A) N3 (B)

Claims (1)

[Claims] In a mounting method for electronic components, in which an electronic component whose terminals are formed only on the surface of the main body is housed in a storage hole provided on a board, and then the terminals are connected and fixed to a wiring pattern provided on the board. A conductor is provided on the terminal so as to be in contact with the wiring pattern when the electronic component is stored and to connect the terminal to the wiring pattern, and after the electronic component is stored, the wiring pattern and the conductor are connected. A method for mounting electronic components, characterized by fixing them to each other.