JPH0731549Y2 - 半導体パッケージ用セラミック基板 - Google Patents

半導体パッケージ用セラミック基板

Info

Publication number
JPH0731549Y2
JPH0731549Y2 JP1988147900U JP14790088U JPH0731549Y2 JP H0731549 Y2 JPH0731549 Y2 JP H0731549Y2 JP 1988147900 U JP1988147900 U JP 1988147900U JP 14790088 U JP14790088 U JP 14790088U JP H0731549 Y2 JPH0731549 Y2 JP H0731549Y2
Authority
JP
Japan
Prior art keywords
ceramic substrate
down surface
cut
chipping
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988147900U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0268447U (cs
Inventor
元秀 荒山
忠寿 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1988147900U priority Critical patent/JPH0731549Y2/ja
Publication of JPH0268447U publication Critical patent/JPH0268447U/ja
Application granted granted Critical
Publication of JPH0731549Y2 publication Critical patent/JPH0731549Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Structure Of Printed Boards (AREA)
JP1988147900U 1988-11-11 1988-11-11 半導体パッケージ用セラミック基板 Expired - Lifetime JPH0731549Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988147900U JPH0731549Y2 (ja) 1988-11-11 1988-11-11 半導体パッケージ用セラミック基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988147900U JPH0731549Y2 (ja) 1988-11-11 1988-11-11 半導体パッケージ用セラミック基板

Publications (2)

Publication Number Publication Date
JPH0268447U JPH0268447U (cs) 1990-05-24
JPH0731549Y2 true JPH0731549Y2 (ja) 1995-07-19

Family

ID=31418735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988147900U Expired - Lifetime JPH0731549Y2 (ja) 1988-11-11 1988-11-11 半導体パッケージ用セラミック基板

Country Status (1)

Country Link
JP (1) JPH0731549Y2 (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2565303Y2 (ja) * 1990-12-28 1998-03-18 京セラ株式会社 半導体パッケージ用セラミック基板
JP5617574B2 (ja) * 2010-12-01 2014-11-05 株式会社村田製作所 セラミック多層基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0451485Y2 (cs) * 1988-05-16 1992-12-03

Also Published As

Publication number Publication date
JPH0268447U (cs) 1990-05-24

Similar Documents

Publication Publication Date Title
EP1430522B1 (en) Method for encapsulating a chip
CN109849278A (zh) 利用模具改善智能功率半导体模块产品翘曲的方法
JPH0731549Y2 (ja) 半導体パッケージ用セラミック基板
US5095360A (en) Ceramic chip-resistant chamfered integrated circuit package
JPS60180126A (ja) 半導体装置の製造方法
JPS61269338A (ja) 樹脂封止半導体装置およびその製造に用いるモ−ルド型
JPH0451485Y2 (cs)
JP2755244B2 (ja) 半導体装置用モールドキャップ
EP0711104A1 (en) Packaged semiconductor, semiconductor device made therewith and method for making same
JPS61237433A (ja) 半導体装置用樹脂タブレツト
JP2560194B2 (ja) パッケージ型半導体装置の製造方法
CN207910743U (zh) 高度对称的石英谐振子
JPH0126056Y2 (cs)
JPS6154259B2 (cs)
JP2872302B2 (ja) 合成樹脂成形品
JP2556487Y2 (ja) 透光体を有する半導体パッケージ
JPH0748409B2 (ja) セラミック基板とその製造方法
JP2837777B2 (ja) 樹脂封止型半導体装置
JPH06126771A (ja) 樹脂成形用金型
JPH0498861A (ja) 樹脂封止型半導体装置
JPH02263459A (ja) 半導体装置
JPH06318768A (ja) セラミック基板及びチップ部品の絶縁基板
JPS6020546A (ja) 半導体装置
JPS5910238A (ja) セラミツクパツケ−ジ
JPH03116763A (ja) モールド封止半導体デバイス用リードフレーム