JPH0722765A - Electronic apparatus - Google Patents
Electronic apparatusInfo
- Publication number
- JPH0722765A JPH0722765A JP5160816A JP16081693A JPH0722765A JP H0722765 A JPH0722765 A JP H0722765A JP 5160816 A JP5160816 A JP 5160816A JP 16081693 A JP16081693 A JP 16081693A JP H0722765 A JPH0722765 A JP H0722765A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed
- semiconductor element
- printed circuit
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、放熱部材を有した電子
機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a heat dissipation member.
【０００２】[0002]
【従来の技術】この種の電子機器は、背面に放熱部材が
固定された半導体素子をプリント基板に固定している。
その固定方法は、導体パターン以外のプリント基板表面
に放熱部材を接触させるとともにプリント基板の導体パ
ターンに半導体素子の脚部を半田付けすることによって
行う。2. Description of the Related Art In this type of electronic equipment, a semiconductor element having a heat radiation member fixed to the back surface is fixed to a printed circuit board.
The fixing method is performed by bringing a heat dissipation member into contact with the surface of the printed board other than the conductor pattern and soldering the legs of the semiconductor element to the conductor pattern of the printed board.
【０００３】[0003]
【発明が解決しようとする課題】上述した電子機器によ
れば、半導体素子及び放熱部材は、導体パターン以外の
プリント基板表面に放熱部材を接触させるとともにプリ
ント基板の導体パターンに半導体素子の脚部を半田付け
することによってプリント基板に固定しているので、プ
リント基板表面の放熱部材が接触する場所に絶縁性の問
題から導体パターンを配設することができず、プリント
基板を有効に使用することができないという問題があっ
た。According to the above-described electronic device, the semiconductor element and the heat dissipation member are such that the heat dissipation member is brought into contact with the surface of the printed circuit board other than the conductor pattern and the leg portion of the semiconductor element is attached to the conductor pattern of the printed circuit board. Since it is fixed to the printed circuit board by soldering, it is not possible to place a conductor pattern on the surface of the printed circuit board where the heat dissipation member comes into contact due to insulation problems, and the printed circuit board can be used effectively. There was a problem that I could not.
【０００４】本発明は、かかる事由に鑑みて成したもの
で、その目的とするところは、プリント基板表面に放熱
部材が接触せず、プリント基板を有効に使用することが
できる電子機器を提供することにある。The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic device in which the heat dissipation member does not contact the surface of the printed board and the printed board can be effectively used. Especially.
【０００５】[0005]
【課題を解決するための手段】かかる課題を解決するた
めに、請求項１記載の電子機器は、表面に導体パターン
を有するプリント基板と、このプリント基板の導体パタ
ーン上に脚部が固定され本体がプリント基板表面から所
定の距離に位置する半導体素子と、この半導体素子の背
面に固定され半導体素子の放熱を行う放熱部材と、を備
えた電子機器において、前記放熱部材は、そのプリント
基板に対向する対向面がプリント基板表面から所定の距
離を介在させて固定されてなる構成としてある。In order to solve the above problems, an electronic apparatus according to a first aspect of the present invention is a main body in which a printed circuit board having a conductor pattern on its surface and legs are fixed on the conductor pattern of the printed circuit board. In a electronic device including a semiconductor element located at a predetermined distance from the printed circuit board surface and a heat dissipation member fixed to the back surface of the semiconductor element to dissipate the heat from the semiconductor element, the heat dissipation member faces the printed circuit board. The opposing surface is fixed by a predetermined distance from the surface of the printed circuit board.
【０００６】請求項２記載の電子機器は、請求項１のも
のの放熱部材は、その対向面がプリント基板を貫通する
固定部材にて支持されてなる構成としてある。According to a second aspect of the present invention, the heat dissipating member of the first aspect has a structure in which the opposing surface is supported by a fixing member penetrating the printed circuit board.
【０００７】請求項３記載の電子機器は、請求項２のも
のの固定部材は、プリント基板に貫通した状態でプリン
ト基板表面に当接する位置決め部が形成されてなる構成
としてある。According to a third aspect of the present invention, the fixing member of the second aspect is configured such that the fixing member is formed with a positioning portion that is in contact with the surface of the printed board while penetrating the printed board.
【０００８】請求項４記載の電子機器は、請求項２又は
請求項３のものの固定部材は、絶縁材料にて形成されて
なる構成としてある。According to a fourth aspect of the present invention, in the electronic device according to the second or third aspect, the fixing member is made of an insulating material.
【０００９】[0009]
【作用】請求項１記載の構成によれば、プリント基板の
放熱部材が対向する面にも導体パターンを配設でき、他
の部材をこの導体パターン上に固定することができる。According to the structure of the first aspect, the conductor pattern can be disposed on the surface of the printed circuit board facing the heat dissipation member, and other members can be fixed on the conductor pattern.
【００１０】請求項２記載の構成によれば、請求項１の
作用に加え、放熱部材の重量が固定部材に加わる。According to the structure of claim 2, in addition to the function of claim 1, the weight of the heat radiating member is added to the fixing member.
【００１１】請求項３記載の構成によれば、請求項２の
作用に加え、半導体素子及び放熱部材をプリント基板に
貫通させると、固定部材の位置決め部がプリント基板表
面に当接し、半導体素子及び放熱部材が更に貫通するの
を防止できる。According to the structure of claim 3, in addition to the function of claim 2, when the semiconductor element and the heat dissipation member are penetrated through the printed board, the positioning portion of the fixing member abuts the surface of the printed board, and the semiconductor element and It is possible to prevent the heat dissipation member from further penetrating.
【００１２】請求項４記載の構成によれば、請求項２又
は請求項３の作用に加え、固定部材の周辺のプリント基
板表面にまで導体パターンを配設することができる。According to the structure of claim 4, in addition to the effect of claim 2 or claim 3, the conductor pattern can be arranged even on the surface of the printed board around the fixing member.
【００１３】[0013]
【実施例】以下、本発明の一実施例を図１乃至図３に基
づいて説明する。この電子機器は、プリント基板1 と、
半導体素子2 と、放熱部材3 と、を有している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. This electronic device has a printed circuit board 1
It has a semiconductor element 2 and a heat dissipation member 3.
【００１４】プリント基板1 は、表面に抵抗及びコンデ
ンサ (図示せず) や半導体素子2 等の電子材料を固定す
る導体パターン4 を有している。この導体パターン4
は、電子材料の脚部が貫通する貫通孔を有し、この貫通
孔に電子材料の脚部を貫通させて表面に半田付けをする
ことによって電子材料を固定する。The printed board 1 has a conductor pattern 4 for fixing electronic materials such as resistors and capacitors (not shown) and semiconductor elements 2 on its surface. This conductor pattern 4
Has a through hole through which the leg portion of the electronic material penetrates, and the leg portion of the electronic material is penetrated through this through hole to solder the surface to fix the electronic material.
【００１５】半導体素子2 は、インバータ装置のパワー
半導体のことであり、プリント基板1 の導体パターン4
上に固定される２本の脚部5,5 と、この脚部5,5 に連設
された略四角形状の本体6 とから構成されている。本体
6 には、放熱部材3 を取着するための固定螺子7 が螺合
する螺子孔6aを有し、この螺子孔6a及び放熱部材3 の螺
子孔 (図示せず) に固定螺子7 を螺合させることによっ
て放熱部材3 を半導体素子2 に固定する。この半導体素
子2 は、前述したようにプリント基板1 の導体パターン
4 上に脚部5 が固定され本体6 がプリント基板1 表面か
ら所定の距離に位置している。The semiconductor element 2 is a power semiconductor of the inverter device, and is a conductor pattern 4 of the printed circuit board 1.
It is composed of two legs 5 and 5 fixed to the top and a main body 6 having a substantially rectangular shape connected to the legs 5 and 5. Body
6 has a screw hole 6a into which a fixing screw 7 for attaching the heat dissipation member 3 is screwed, and the fixing screw 7 is screwed into the screw hole 6a and a screw hole (not shown) of the heat dissipation member 3. By doing so, the heat dissipation member 3 is fixed to the semiconductor element 2. This semiconductor element 2 is a conductor pattern of the printed circuit board 1 as described above.
4 The legs 5 are fixed on the upper part, and the main body 6 is located at a predetermined distance from the surface of the printed board 1.
【００１６】放熱部材3 は、鉄等の熱伝導率の比較的高
い部材にて表面積が大きくなるように凸凹に形成され、
前述した半導体素子2 を固定螺子7 によって半導体素子
2 の背面に接触した状態で固定されている。また、この
放熱部材3 の上下方向には、プリント基板1 に固定する
ための固定部材8 が圧入される圧入孔9 を形成してい
る。この放熱部材3 は、その対向面3aがプリント基板1
表面から所定の距離を介在させて固定されている。The heat dissipating member 3 is made of a material having a relatively high thermal conductivity such as iron, and is formed in an uneven shape so that its surface area is large.
The semiconductor element 2 described above is fixed to the semiconductor element by the fixing screw 7.
It is fixed in contact with the back of 2. In addition, a press-fitting hole 9 into which a fixing member 8 for fixing to the printed board 1 is press-fitted is formed in the vertical direction of the heat dissipation member 3. The heat dissipating member 3 has a printed circuit board 1 with its facing surface 3a.
It is fixed with a predetermined distance from the surface.
【００１７】固定部材8 は、プラスチック等の絶縁材料
にて形成され、放熱部材3 の圧入孔9 に圧入される圧入
部8aと、この圧入部8aに連設されプリント基板1 表面に
当接する位置決め部8bと、この位置決め部8bに連設され
プリント基板1 に貫通する貫通部8cと、から構成されて
いる。The fixing member 8 is made of an insulating material such as plastic and has a press-fitting portion 8a which is press-fitted into the press-fitting hole 9 of the heat-dissipating member 3 and a positioning member which is connected to the press-fitting portion 8a and contacts the surface of the printed board 1. It is composed of a portion 8b and a penetrating portion 8c which is connected to the positioning portion 8b and penetrates the printed circuit board 1.
【００１８】この半導体素子2 及び放熱部材3 をプリン
ト基板に固定するには、先ず、放熱部材3 の圧入孔9 に
固定部材8 の圧入部8aを圧入する。次に、半導体素子2
を放熱部材3 に固定螺子7 により固定する。次に、半導
体素子2 の脚部5 及び固定部材8 の貫通部8cをプリント
基板1 に貫通させ固定部材8 の位置決め部8bをプリント
基板1 表面に当接させて仮り止めを行う。そして、プリ
ント基板1 表面から半導体素子2 の脚部5 を半田付けす
ることによって行う。To fix the semiconductor element 2 and the heat dissipation member 3 to the printed circuit board, first, the press-fitting portion 8a of the fixing member 8 is press-fitted into the press-fitting hole 9 of the heat dissipation member 3. Next, semiconductor element 2
Is fixed to the heat dissipation member 3 with a fixing screw 7. Next, the leg portion 5 of the semiconductor element 2 and the penetrating portion 8c of the fixing member 8 are penetrated through the printed circuit board 1 and the positioning portion 8b of the fixing member 8 is brought into contact with the surface of the printed circuit board 1 to temporarily fix it. Then, the legs 5 of the semiconductor element 2 are soldered from the surface of the printed board 1.
【００１９】なお、放熱部材をプリント基板に固定する
固定部材の長さは、他の電子機器が放熱部材とプリント
基板との間に配設される場合のスペースが得られるよう
に、放熱部材の対向面及びプリント基板間の距離に合わ
せて適宜設計すればよい。また、放熱部材の対向面を支
持する固定部材の個数は３個とは限らず、４個以上にす
れば、更に半導体素子の脚部が折れ難くなる。The length of the fixing member for fixing the heat dissipating member to the printed circuit board is such that a space can be obtained when another electronic device is arranged between the heat dissipating member and the printed circuit board. It may be appropriately designed according to the distance between the facing surface and the printed circuit board. Further, the number of fixing members that support the facing surface of the heat dissipation member is not limited to three, and if the number of fixing members is four or more, the leg portions of the semiconductor element become more difficult to break.
【００２０】[0020]
【発明の効果】請求項１記載の電子機器によれば、プリ
ント基板の放熱部材が対向する面にも導体パターンを配
設でき、他の部材をこの導体パターン上に固定すること
ができるので、プリント基板を有効に使用することがで
きるという効果を奏する。According to the electronic device of the first aspect, the conductor pattern can be arranged on the surface of the printed circuit board facing the heat dissipation member, and other members can be fixed on the conductor pattern. The printed circuit board can be effectively used.
【００２１】請求項２記載の電子機器によれば、放熱部
材の重量が固定部材に加わるので、請求項１記載の効果
に加え、半導体素子の脚部が折れにくいものとなる。According to the electronic device of the second aspect, since the weight of the heat radiating member is added to the fixing member, in addition to the effect of the first aspect, the leg portions of the semiconductor element are less likely to be broken.
【００２２】請求項３記載の電子機器によれば、半導体
素子及び放熱部材をプリント基板に貫通させると、固定
部材の位置決め部がプリント基板表面に当接し、半導体
素子及び放熱部材が更に貫通するのを防止できるので、
請求項２記載の効果に加え、半導体素子及び放熱部材を
プリント基板に固定する作業が自動化し易いものとな
る。According to the electronic device of the third aspect, when the semiconductor element and the heat dissipation member are penetrated through the printed board, the positioning portion of the fixing member abuts the surface of the printed board, and the semiconductor element and the heat dissipation member are further penetrated. Can be prevented,
In addition to the effect of the second aspect, the work of fixing the semiconductor element and the heat dissipation member to the printed board can be easily automated.
【００２３】請求項４記載の電子機器によれば、固定部
材の周辺のプリント基板表面にまで導体パターンを配設
することができるので、請求項２又は請求項３記載の効
果に加え、更にプリント基板を有効に使用できるという
効果を奏する。According to the electronic device of the fourth aspect, since the conductor pattern can be arranged even on the surface of the printed circuit board around the fixing member, in addition to the effect of the second or third aspect, the printing is further performed. The substrate can be effectively used.
【図１】本発明の一実施例を示す側面図である。FIG. 1 is a side view showing an embodiment of the present invention.
【図２】図１のもののプリント基板から外した状態を示
す正面図である。FIG. 2 is a front view showing the state of FIG. 1 removed from the printed circuit board.
【図３】図２のものの分解斜視図である。FIG. 3 is an exploded perspective view of that of FIG.
1 プリント基板 2 半導体素子 3 放熱部材 3a 対向面 4 導体パターン 1 Printed circuit board 2 Semiconductor element 3 Heat dissipation member 3a Opposing surface 4 Conductor pattern
Claims (4)
板と、このプリント基板の導体パターン上に脚部が固定
され本体がプリント基板表面から所定の距離に位置する
半導体素子と、この半導体素子の背面に固定され半導体
素子の放熱を行う放熱部材と、を備えた電子機器におい
て、 前記放熱部材は、そのプリント基板に対向する対向面が
プリント基板表面から所定の距離を介在させて固定され
てなる電子機器。1. A printed circuit board having a conductor pattern on a surface thereof, a semiconductor element having legs fixed to the conductor pattern of the printed circuit board and a main body located at a predetermined distance from the surface of the printed circuit board, and a back surface of the semiconductor element. An electronic device, comprising: a heat dissipation member that is fixed and radiates heat from a semiconductor element, wherein the heat dissipation member has an opposite surface that faces the printed board and is fixed with a predetermined distance from the surface of the printed board. .
基板を貫通する固定部材にて支持されてなる請求項１記
載の電子機器。2. The electronic device according to claim 1, wherein the heat dissipation member is supported by a fixing member whose opposing surface penetrates the printed circuit board.
た状態でプリント基板表面に当接する位置決め部が形成
されてなる請求項２記載の電子機器。3. The electronic device according to claim 2, wherein the fixing member is formed with a positioning portion that is in contact with the surface of the printed board while penetrating the printed board.
てなる請求項２又は請求項３記載の電子機器。4. The electronic device according to claim 2, wherein the fixing member is made of an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5160816A JPH0722765A (en) | 1993-06-30 | 1993-06-30 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5160816A JPH0722765A (en) | 1993-06-30 | 1993-06-30 | Electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0722765A true JPH0722765A (en) | 1995-01-24 |
Family
ID=15723046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5160816A Withdrawn JPH0722765A (en) | 1993-06-30 | 1993-06-30 | Electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722765A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002336391A (en) * | 2000-07-14 | 2002-11-26 | Toshiaki Fujita | Putter club |
-
1993
- 1993-06-30 JP JP5160816A patent/JPH0722765A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002336391A (en) * | 2000-07-14 | 2002-11-26 | Toshiaki Fujita | Putter club |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000905 |