JPH0719155Y2 - 半導体パツケージ - Google Patents

半導体パツケージ

Info

Publication number
JPH0719155Y2
JPH0719155Y2 JP1988158032U JP15803288U JPH0719155Y2 JP H0719155 Y2 JPH0719155 Y2 JP H0719155Y2 JP 1988158032 U JP1988158032 U JP 1988158032U JP 15803288 U JP15803288 U JP 15803288U JP H0719155 Y2 JPH0719155 Y2 JP H0719155Y2
Authority
JP
Japan
Prior art keywords
substrate
ceramic substrate
semiconductor package
ceramic
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988158032U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0279044U (US07576130-20090818-C00114.png
Inventor
直志 入沢
勝正 中原
一成 渡辺
一夫 砂原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP1988158032U priority Critical patent/JPH0719155Y2/ja
Publication of JPH0279044U publication Critical patent/JPH0279044U/ja
Application granted granted Critical
Publication of JPH0719155Y2 publication Critical patent/JPH0719155Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1988158032U 1988-12-06 1988-12-06 半導体パツケージ Expired - Lifetime JPH0719155Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988158032U JPH0719155Y2 (ja) 1988-12-06 1988-12-06 半導体パツケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988158032U JPH0719155Y2 (ja) 1988-12-06 1988-12-06 半導体パツケージ

Publications (2)

Publication Number Publication Date
JPH0279044U JPH0279044U (US07576130-20090818-C00114.png) 1990-06-18
JPH0719155Y2 true JPH0719155Y2 (ja) 1995-05-01

Family

ID=31437997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988158032U Expired - Lifetime JPH0719155Y2 (ja) 1988-12-06 1988-12-06 半導体パツケージ

Country Status (1)

Country Link
JP (1) JPH0719155Y2 (US07576130-20090818-C00114.png)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2853599B2 (ja) * 1995-03-10 1999-02-03 日本電気株式会社 半導体装置の製造方法
KR100620810B1 (ko) * 2005-03-07 2006-09-07 삼성전자주식회사 Ｍｅｍｓ 소자 패키지 및 그 제조방법
EP1953816A4 (en) 2005-11-25 2011-07-27 Panasonic Elec Works Co Ltd SENSOR ARRANGEMENT AND PROCESS FOR THEIR MANUFACTURE
US8067769B2 (en) 2005-11-25 2011-11-29 Panasonic Electric Works Co., Ltd. Wafer level package structure, and sensor device obtained from the same package structure
EP1953817B1 (en) * 2005-11-25 2012-10-31 Panasonic Corporation Sensor device and method for manufacturing same
EP1953814B1 (en) * 2005-11-25 2017-09-06 Panasonic Intellectual Property Management Co., Ltd. Wafer level package structure and method for manufacturing same
JP5612558B2 (ja) * 2011-11-16 2014-10-22 日機装株式会社 半導体パッケージ用基板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053054A (ja) * 1983-09-02 1985-03-26 Hitachi Ltd 半導体装置
JPH0793394B2 (ja) * 1985-10-25 1995-10-09 株式会社日立製作所 半導体基体搭載用セラミックパッケージ

Also Published As

Publication number Publication date
JPH0279044U (US07576130-20090818-C00114.png) 1990-06-18

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