JPH071797Y2 - 半導体製造装置 - Google Patents
半導体製造装置Info
- Publication number
- JPH071797Y2 JPH071797Y2 JP1986141317U JP14131786U JPH071797Y2 JP H071797 Y2 JPH071797 Y2 JP H071797Y2 JP 1986141317 U JP1986141317 U JP 1986141317U JP 14131786 U JP14131786 U JP 14131786U JP H071797 Y2 JPH071797 Y2 JP H071797Y2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- lead
- encapsulating
- semiconductor manufacturing
- enclosing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000004065 semiconductor Substances 0.000 title claims description 7
- 239000011521 glass Substances 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 5
- 238000005299 abrasion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986141317U JPH071797Y2 (ja) | 1986-09-17 | 1986-09-17 | 半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986141317U JPH071797Y2 (ja) | 1986-09-17 | 1986-09-17 | 半導体製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6349234U JPS6349234U (enExample) | 1988-04-04 |
| JPH071797Y2 true JPH071797Y2 (ja) | 1995-01-18 |
Family
ID=31048984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986141317U Expired - Lifetime JPH071797Y2 (ja) | 1986-09-17 | 1986-09-17 | 半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071797Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6927542B1 (ja) * | 2020-12-11 | 2021-09-01 | 公立大学法人 富山県立大学 | ピン移載装置、ピン移載方法及び処理装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55146999A (en) * | 1979-05-02 | 1980-11-15 | Tokyo Shibaura Electric Co | Method of feeding electronic component |
| JPS5639886A (en) * | 1979-09-04 | 1981-04-15 | Nippon Electric Co | Handling device |
| JPS5868031U (ja) * | 1981-10-30 | 1983-05-09 | 日本電気ホームエレクトロニクス株式会社 | ダイオ−ド組立封止治具のウエイト |
-
1986
- 1986-09-17 JP JP1986141317U patent/JPH071797Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6349234U (enExample) | 1988-04-04 |
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