JPH07120690B2 - Die placement device for inner lead bonder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a die mounting device for an inner lead bonder.

(Prior Art) A die mounting device for an inner lead bonder for bonding a pad of a die to inner leads previously provided at equal intervals on a carrier tape has hitherto been a wafer consisting of a plurality of dies divided at equal intervals. Is placed on a stage on a table driven in the XYZ directions, a carrier tape that is intermittently transferred is arranged above this table, and the carrier tape is directly attached by a bond tool arranged above the carrier tape. The die was pressed for bonding.

(Problems to be Solved by the Invention) However, in this conventional die mounting apparatus for inner lead bonds, the alignment of the die and the inner leads is performed by a camera installed above the carrier tape to form the pattern of the die and the inner leads. Therefore, there is a problem that it is difficult to detect the positional deviation of the die pattern.

Also, since the wafer is attached to a plate such as ceramic or glass with a low melting point adhesive, and this is divided into equal dies to form a die, when the carrier tape is directly pressed and bonded on the wafer as described above, , The heat of the bond tool is transmitted to the die around the bonded die, the adhesive is removed and the position of the die is easily displaced,
There is a problem in that the adhesive may melt from the slicing line of the adjacent die and rise to the surface of the adjacent die due to the capillary phenomenon, and the die may be soiled.

Further, in order to prevent the inner leads of the carrier tape to be bonded to the pads of the die adjacent to the die to be bonded from touching, the inner lead portion near the bond tool must be arranged so as to be curved away from the die, There were also problems that adversely affected the carrier tape.

Furthermore, recently, depending on the characteristics of the die, there are many types in which the bonding between the die pad and the inner lead is not good when the bonding is performed at room temperature. Therefore,
In the case of such a die, it is necessary to preheat the stage for fixing the wafer. However, since the wafer is fixed to the ceramic or the like with the adhesive having a low melting point as described above, there is a problem that the wafer cannot be fixed to the ceramic or the like when preheated and the wafer moves.

In view of such conventional problems, the present invention is capable of surely bonding the die to the inner leads, does not stain the die, and does not damage the carrier tape side. An object is to provide a mounting device.

[Structure of the Invention] (Means for Solving Problems) An inner lead bonder die mounting apparatus according to the present invention includes a rotary table that is rotatably supported by a mount, and a plurality of die mounted on the rotary table. A die for an inner lead bonder including a mounting table, a rotation driving unit that intermittently rotates the rotating table to position each of the die mounting tables at a die positioning position and a bond position, and a preheating unit that heats the rotating table. In the placement device, the preheating means sends hot air from the hot air supply device to the hot air path provided in the rotary table through the air supply pipe.

(Operation) In the die mounting device for the inner lead bonder of the present invention, the die is positioned at the die positioning position of the rotary table, and the rotary table is rotated to be positioned at the bond position. Then, at this bond position, the die is bonded to the inner lead of the carrier tape by the bond tool. Then, the rotary table is heated with hot air by the preheating means to bring the die into a preheated state and perform bonding, thereby improving the bonding of the inner leads.

(Example) Hereinafter, the present invention will be described with reference to illustrated examples.

1 to 4 show an embodiment of the present invention. A pedestal 4 is fixed on an XY table 3 driven in the XY directions by an X-axis drive motor 1 and a Y-axis drive motor 2. A pulse motor 5 is fixed to the frame 4, and a rotary table shaft 6 is rotatably supported.

At the upper end of the rotary table 6, a rotary table 9 including an upper rotary table 7 and a lower rotary table 8 is provided. A pulley 10 is fixed to the lower end of the rotary table shaft 6. Between this pulley 10 and the pulley 11 of the output shaft of the pulse motor 5 fixed to the frame 4,
Timing belt 12 is hung. As shown in detail in FIG. 2, on the upper rotary table 7 of the rotary table 9, the die mounting tables 13 and 14 are provided at the bond position A and the die positioning position B on the same circle as the bond position A and shifted by 180 degrees. Is fixed.

An inner lead provided on a carrier tape (not shown) is intermittently transferred and positioned above the bond position A, and is not shown above the inner lead immediately above the bond position A. A bond tool is provided so that it can move vertically and in the XY directions. Above the die positioning position B, a pair of opposed die positioning claws (not shown) are provided on the die mounting tables 13, 14.
It is placed with a gap that does not hinder the movement of.

As shown in FIGS. 3 and 4, a hot air path 15 is provided in the rotary shaft 6 and the rotary table 9. Further, as shown in detail in FIG. 1, the hot air passage 15 is connected to an air supply pipe 17 by a pipe joint 16 and connected to an exhaust pipe 19 by a pipe joint 18. Further, the air supply pipe 17 has a hot air supply device 20.
Connected with. A thermocouple 21 is attached to the rotary table 9 for temperature detection.

Next, the operation of the die mounting device for the inner lead bonder having the above configuration will be described. When a die is supplied to the die mounting table 14 at the die positioning position B by a die transfer device (not shown), the die is positioned by opening and closing a die positioning claw (not shown). After that, the pulse motor 5 for driving the rotary table drives to rotate the rotary table 9 180
The die mounting table 14 and the die mounting table 13 are rotated by one degree and positioned at the bond position A and the die positioning position B, respectively.

At the die positioning position B, each time the die mounting table 13 or the die mounting table 14 is positioned, the die is positioned and mounted according to the procedure described above.

When the die mounting table 14 on which the die is positioned as described above is located at the bond position A, the inner leads of a carrier tape (not shown) are pressed against the pads of the die for bonding. After that, the bond tool rises and the rotary table 9
Rotates 180 degrees again. At the bond position A, bonding is performed according to the above-described procedure every time the die mounting table 13 or the die mounting table 14 on which the die is positioned and mounted is positioned.

As described above, the rotary table 9 having a size including the die positioning position B and the bond position A is provided, the die is positioned at the die positioning position B on the rotary table 9, and then the rotary table 9 is rotated to perform the positioning. The dies thus formed are brought to the bond position A and bonded one after another. Therefore, the positional accuracy of the die at the bond position A is determined by the rotational accuracy of the rotary table 9, and high-accuracy bonding can be performed without displacement of the die position.

Next, the preheating operation of the die will be described. The rotary table 9 is heated by the hot air from the hot air supply device 20 being sent to the hot air path 15 through the air supply pipe 17. The heat of the rotary table 9 is transferred to the die via the die mounting tables 13 and 14.

Therefore, the die is bonded to the inner lead in a heated state, and good bonding can be realized. Further, the temperature of the rotary table 9 is returned to the hot air supply device 20 by the thermocouple 21 and the temperature of the rotary table 9 is appropriately controlled, so that bonding under the optimum temperature condition is possible.

The hot air sent from the hot air supply device 20 to the hot air path 15 is discharged to the outside of the device via the exhaust pipe 19.

Incidentally, the preheating means for the rotary table 9 is not particularly limited, and it is possible to directly perform it by a heater, for example. However, when the rotary table 9 is directly heated by hot air as in the above embodiment, not only can the die be heated to a high temperature of 250 ° C., but the rotary table 9 is simply provided with the hot air passage 15. There is no need to embed a heater or the like, and a simple structure can be realized, and maintenance is easy.

EFFECTS OF THE INVENTION As described above, according to the present invention, since the rotary table having the size including the die positioning position and the bond position is provided, the rotary table is positioned after the die is positioned at the die positioning position on the rotary table. By rotating the, the die can be positioned at the bond position, highly accurate bonding can be performed, and the die can be preheated by heating the rotary table by the preheating means, and the inner lead bonding can be performed more efficiently. It can be good. Further, since the dies are positioned one by one on the rotary table and then the bonding is performed, there is no possibility that the adhesive adheres to the adjacent dies and stains the dies as in the conventional case.

[Brief description of drawings]

FIG. 1 is a front view of an embodiment of the present invention, FIG. 2 is a top view of the rotary table of the above embodiment, FIG. 3 is an enlarged sectional view of the rotary table of the above embodiment, and FIG. It is an expansion top view which shows the hot air path of a rotary table. 4 ...... Stand 5 ...... Pulse motor 6 ...... Rotating shaft 9 ...... Rotating table 12 ...... Timing belt 13, 14 ...... Die mounting table 15 ...... Hot air path 17 ...... Air supply pipe 19 ...... Exhaust pipe 20 ...... Hot air supply device

Claims (1)

[Claims] 1. A rotary table rotatably supported on a gantry, a plurality of die mounting tables provided on the rotary table, and the die mounting table for positioning each of the die mounting tables at a platform positioning position and a bond position. A die mounting device for an inner lead bonder, comprising: a rotation driving means for intermittently rotating a rotary table; and a preheating means for heating the rotary table, wherein the preheating means is provided with respect to a hot air path provided in the rotary table. A die mounting device for an inner lead bonder, wherein hot air is sent from a hot air supply device through an air supply pipe.