JPH038109B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a die mounting device in an inner lead bonder for bonding die pads to inner leads provided in advance at equal intervals on a carrier tape.

(Prior art) The conventional inner lead bonding method is
A wafer consisting of a plurality of dies divided at equal intervals is positioned and placed on a stage on a table driven in the XYZ directions, and a carrier tape that is intermittently transferred is placed above this table. Bonding is performed by directly pressing the carrier tape against the die using a bonding tool placed above.

However, this method has the disadvantage that it is difficult to detect misalignment of the die pattern because the die and lead alignment is performed by detecting the die and lead patterns with a camera placed above the carrier tape. .

In addition, the wafer is attached to a plate made of ceramic or glass with a low-melting adhesive and is divided into equal intervals, so the method of bonding by pressing the carrier tape directly onto the wafer as described above is called bonding. At times, the heat from the bonding tool is transmitted to the dies surrounding the bonded die, melting the adhesive and easily causing the die to shift its position, and also melting the adhesive from the slicing line of the adjacent die and causing it to become adjacent due to capillary action, etc. It may rise to the surface of the die and cause the die to die.

In addition, in order to prevent the inner lead of the carrier tape to be bonded from touching the pad of the die adjacent to the bonding die, the inner lead part near the bonding tool must be curved away from the die, and the carrier tape must be Adversely affect.

Furthermore, recently, depending on the characteristics of the die, there are many types in which the bond between the die pad and the inner leads is not good when bonding is performed at room temperature. Therefore, in such a case, it is necessary to preheat the stage on which the wafer is fixed. However, as mentioned above, since the wafer is fixed to the ceramic or the like with a low melting point adhesive, the wafer cannot be fixed to the ceramic or the like when preheating is performed, and has the disadvantage that it moves.

(Object of the Invention) An object of the present invention is to provide a die mounting device for an inner lead bonder that eliminates the drawbacks of the prior art described above.

(Embodiments of the Invention) The present invention will be described below with reference to illustrated embodiments.
FIG. 1 shows an embodiment of the present invention, a is a plan view,
b is a front view, FIG. 2 is an enlarged plan view of the heater base, and FIG. 3 is a cross-sectional view taken along line A-A in FIG. 2. X
A pedestal 4 is fixed on an XY table 3 that is driven in the XY directions by a shaft drive motor 1 and a Y direction drive motor 2.

A rotary table shaft 10 is rotatably supported on the pedestal 4, and a rotary table 11 is fixed to the upper end of the rotary table shaft 10. A pulley 12 is fixed to the lower end of the rotary table 11, and a timing belt 15 is hung between the pulley 12 and a pulley 14 fixed to the output shaft of a pulse motor 13 for driving the rotary table fixed to the pedestal 4. ing. On the rotary table 11 are a bond position 16A and a bond position 16A.
Die mounting tables 17A and 17B are respectively fixed to die positioning positions 16B that are concentrically shifted by 180 degrees. Above the bond position 16A, an inner lead provided on a carrier tape (not shown) is intermittently transferred and positioned, and further
A bonding tool (not shown) is provided above the inner lead directly above 6A so as to be movable in the vertical and XY directions. Also, die positioning position 1
A pair of opposing die positioning claws (not shown) are disposed above 6B with a gap that does not impede movement of the die mounting tables 17A, 17B.

Below the rotary table 11, two heater bases 20A and 20B divided into left and right parts are fixed to the pedestal 4 via a heat shield plate 21 with a slight gap between the rotary table 11 and the heater bases 20A and 20B. In the heater bases 20A, 20B, heaters 22 made of nichrome wire or the like are arranged in heater grooves 20a formed in the heater bases 20A, 20B, respectively, and the heaters 22 are connected to terminals 23 fixed to the heater bases 20A, 20B. It is connected to the. A voltage is supplied to the terminal 23 from a temperature control device (not shown). Moreover, since the heater 22 is very unstable due to its coil shape, it is prevented from floating up by the banks 20b provided at a plurality of locations protruding from the heater groove 20a side. Further, a thermocouple 24 is attached to the heater base 20A in order to control the temperature of the heater bases 20A and 20B.

Next, the effect will be explained. When a die is supplied onto the die mounting table 17B at the die positioning position 16B by a die transfer device (not shown), the die is positioned by opening/closing a die positioning claw (not shown). After that, the rotary table driving pulse motor 13 is driven, and the rotary table 11 is
After being rotated 180 degrees, the die mounting table 17B is located at the bond position 16A, and the die mounting table 17A is located at the die positioning position 16B. In the die positioning position 16B, a die is positioned and placed as described above every time the die mounting table 17A or 17B is positioned.

When the die mounting table 17B on which the die is positioned as described above is located at the bond position 16A,
A bonding tool (not shown) descends and presses an inner lead of a carrier tape (not shown) against a part of the die for bonding. Thereafter, the bonding tool is raised and the rotary table 11 is rotated 180 degrees again. In the bond position, bonding is performed as described above each time the die mounting table 17A or 17B on which the die is positioned and mounted is located.

In this way, the rotary table 11 is provided with a size that includes the die positioning position 16B and the bond position 16A, and after positioning the die at the die positioning position 16B on this rotary table 11, the positioning is performed by rotating the rotary table 11. The die is bond position 16A.
bond position 16A.
The die size is determined by the rotational accuracy of the rotary table 11, and the die is positioned at the bond position 16A without any positional deviation, so that highly accurate bonding is performed.

Incidentally, the rotary table 11 is heated by the radiant heat of the heaters 22 provided on the heater bases 20A and 20B, and the heat of the rotary table 11 is transmitted to the die via the die mounting tables 17A and 17B. Therefore, since the die is heated and bonded to the inner leads, good bonding is achieved.

Here, the heater 22 is provided on the heater bases 20A and 20B, which are fixed parts, and is not provided on the rotating rotary table 11, so there is no need to run a heater cable, and there is no abrasion powder caused by brushes due to the contact structure. It has excellent safety and has a simple structure. Also, rotary table 1
There is a gap between the rotary table 11 and the heater bases 20A and 20B, and the rotary table 11 is heated by the radiant heat of the heater 22, so the rotary table 11 is heated at a low temperature below the temperature that does not destroy the die pattern, for example, a low temperature state of 30 to 50 degrees Celsius. can be easily controlled.

In addition, in the above embodiment, the rotary table 1
Although two die mounting tables 17A and 17B are provided on the die mounting table 1, three or more die mounting tables may be provided and rotated at a rotation angle corresponding to the number of die mounting tables. Further, the rotary table 11 does not need to be formed in a circular shape, and may have a shape in which only the die mounting tables 17A and 17B are connected. In addition, die mounting tables 17A, 17
The die may be placed directly on the rotary table 11 without providing B. Also heater base 2
Although 0A and 20B are formed in two parts to facilitate assembly, they do not necessarily have to be divided into two parts.

(Effects of the Invention) As is clear from the above description, the present invention includes a rotary table whose size includes a die positioning position and a bond position. By rotating the die, the positioned die can be positioned at the bond position, and bonding can be performed with high precision. In addition, the heater base equipped with the heater is fixed to the stand below the rotary table with a small gap between the rotary table and the rotary table, which provides excellent safety and a simple structure, while also keeping the temperature of the rotary table at a low temperature. Can be easily controlled.

[Brief explanation of the drawing]

Fig. 1 shows an embodiment of the present invention, in which a is a plan view, b is a front view, Fig. 2 is an enlarged plan view of the heater base, and Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2. . 4... Frame, 11... Rotating table, 16A...
...Bon position, 16B...Die positioning position, 20A, 20B...Heater base, 22
……heater.

Claims (1)

[Claims] 1 Send the dies one by one to a die positioning position for positioning, and send the positioned dies to the bond position, while sending the inner lead of the carrier tape to the bond position above the die on the bond position. In the inner lead bonder, which presses the inner lead of the carrier tape against the die using a bonding tool for bonding, the die is rotatably provided on a pedestal with a size that includes the die positioning position and the bond position. An inner die comprising: a rotary table on which the die is placed and transferred from the die positioning position to the bond position; and a heater base having a heater, which is fixed to the pedestal with a slight gap between the rotary table and the rotary table below the rotary table. Die placement device for lead bonder.