JPH03201578A - Manufacture of thermoelectric module - Google Patents

Abstract

PURPOSE:To accurately secure thermoelectric elements to predetermined positions by arranging P-type thermoelectric elements and N-type thermoelectric elements on a predetermined insulating board, and heating to bond electrodes to the bonded parts of corresponding elements while pressing the tops of the individual elements. CONSTITUTION:A plurality of P-type and N-type thermoelectric elements 2 are correctly arranged on electrodes 3a on an insulating board 1a according to predetermined conditions. Thermoelectric element group are so covered with a rubber plate 4 molded of fluorine rubber having heat resistant characteristic as not to move the elements, and a push frame 5 having a pressure mechanism 6 is set on the plate. Then, when the mechanism 6 presses downward the frame, the plate 4 is pressed on the board 2a to secure the elements 2. Since both the upper and lower ends of the elements 2 and the surfaces of the electrodes formed on the board are covered with solders, the solders are melted if a hot plate 7 is heated by a heater 8, to bond the elements 2 to the electrodes 3a.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of manufacturing a thermoelectric module for controlling heat by using the Peltier effect, and in particular, it relates to a method of manufacturing a thermoelectric module for controlling heat by using the Peltier effect. The present invention relates to a method of manufacturing a thermoelectric module that can be fixed.

[Prior Art] As is well known, a thermoelectric module has a structure as shown in FIG. That is, in FIG. 1, 1a,
1b is a ceramic substrate provided with a plurality of electric fi 3a, 3b, and between the ceramic substrates 1a, 1b, both ends of each are soldered to the above 3a, 3b, and adjacent P-type thermoelectric fi The element 2a and the N-type thermoelectric element 2b are fixed.

Therefore, on the thermoelectric module, all P-type thermoelectric elements 2
A and an N-type thermoelectric element 2b are alternately connected in series by the electrodes 3a and 3b, and lead wires 20a- and 20b are drawn out from both ends of the series connection, respectively.

In the above structure, by not supplying current from the lead wires 20a and 20b to the P-type thermoelectric element 2a and the N-type thermoelectric element 2b connected in series, the insulating substrate Heat is transferred from 1a to 1b or from lb to 1a depending on the characteristics of the thermoelectric element corresponding to the current value.

The above-mentioned structure is formed in -ffl by the following means.

That is, in FIG. 6(A) showing a part of the thermoelectric module, as described above with reference to FIG.
ii 3 A is fixed facing upward First, the P-type thermoelectric element 2a and the N-type thermoelectric element 2b are respectively positioned at predetermined positions according to the slam of the electrode 3a, that is, at both ends of each of the plurality of electrodes. Arrange as follows.

In order to electrically connect and fix these thermoelectric elements and electrodes, before the above arrangement, solder is applied to both ends of each thermoelectric element 2a and 2b as shown in 62a and 62b, and as shown in 63a to each electrode 3a. Coated or cream solder applied.

After arranging as described above, each thermoelectric element is pressed from above with a presser plate 64 having approximately the same size as the insulating substrate 1a, and the solder at each joint portion is heated by the hot plate 7 to bond them.

Next, although not shown in the figure, the insulating substrate 1b is attached to the electrode 3.
b facing downward, and the electrodes 3b are aligned so that both ends of the plurality of electrodes 3b are located on each of the P-type thermoelectric elements 2a and N-type thermoelectric elements 2b arranged and fixed on the insulating substrate la.

Each electrode 3b on the insulating substrate lb is provided with a button so as to connect in series the thermoelectric elements arranged and fixed on the insulating substrate 1a as described above, so that each electrode 3b is connected to each joint in the same way as described above. A predetermined thermoelectric module having the structure shown in FIG. 1 is constructed by heating and bonding pre-coated solder or applied solder using a hot plate or the like.

[Problems to be Solved by the Invention] According to the above-mentioned conventional method, when each thermoelectric element is first arranged on an insulating substrate and the solder is melted in order to bond the insulating substrate and each thermoelectric element, as shown in FIG. As shown in >, since the height of each thermoelectric element is not uniform, when pressed by the push plate 64, the upper part of the short thermoelectric element does not contact the push W, 64 (thermoelectric element 2b). Since the upper solder portion 62b) is small, the surface tension of the molten solder may cause misalignment when the device is small.

That is, as shown in FIG. 6(B), for example, the push plate 64
The thermoelectric element 2b that was in contact with the press plate 6 does not move, but the
The thermoelectric element 2a that was not in contact with 4 moves from 3α1 to 302 shown by the dotted line. In this kind of movement,
If two thermoelectric elements connected to the same electrode are both short and not fixed by a push plate, or if they are connected without being fixed, if they are at the i-end, they will contact the neighboring thermoelectric element. This problem arises.

As a means to prevent such positional deviation, a method is sometimes used in which the position of each thermoelectric element is maintained using a grid-shaped jig.

However, when trying to arrange thermoelectric elements of minute dimensions, for example, elements with dimensions of 0-64m+, in 5 pitches of l■, it is difficult to make the thickness of the grid in the grid-shaped jig extremely thin. It is also difficult to obtain a certain machining accuracy.

Furthermore, even if each thermoelectric element is arranged in the center of the grid-shaped jig described above, when the solder is melted, the thermoelectric elements will move due to the surface tension of the molten solder and come into contact with the grid, and the grid-shaped jig will be removed after processing. There was a problem that not only excessive force was required when removing the thermoelectric element, but also that the thermoelectric element in contact with the thermoelectric element could be chipped, resulting in a poor yield.

An object of the present invention is to solve the above-mentioned conventional problems and provide a method for manufacturing a thermoelectric module that can accurately fix each thermoelectric element in a predetermined position without using a grid-shaped jig. .

[Means for Solving the Problems] In order to achieve the above object, in the method for manufacturing a thermoelectric module based on the present invention, a plurality of P-type In a method for manufacturing a thermoelectric module, in which thermoelectric elements and N-type thermoelectric elements are alternately connected in series, and the P-type thermoelectric element and N-type thermoelectric element are sandwiched and fixed between the two opposing insulating substrates. , P-type thermoelectric elements and N-type thermoelectric elements are arranged at appropriate positions on the electrode fixed to a specific one of the two insulating substrates via a bonding agent such as solder paste, and each of the above-mentioned individual The joints between each of the electrodes and the corresponding thermoelectric elements are heated and bonded while pressing the upper part of each thermoelectric element, and a rubber sheet is used as a means for pressing the upper part of each individual thermoelectric element. did.

Further, magnetic force is used as a means for pressing the upper part of each individual thermoelectric element.

[Operation] According to the above means, the P-type thermoelectric element and the N-type thermoelectric element are arranged on a predetermined insulating substrate, and while pressing the upper part of each individual thermoelectric element, the joint portion between each electrode and the corresponding thermoelectric element is Since the thermoelectric elements are bonded by heating, even minute thermoelectric elements are not moved by the surface tension of the molten solder. It became possible to connect and fix thermoelectric elements.

[Example] Hereinafter, details of the manufacturing method according to the present invention of the thermoelectric module shown in FIG. 1 in the prior art will be explained with reference to the drawings.

FIG. 2 is a sectional view illustrating manufacturing operations related to the first manufacturing method based on the manufacturing method of the present invention, and FIG. 3 is a sectional view illustrating manufacturing operations related to the second manufacturing method based on the manufacturing method of the present invention. It is a diagram. 4 is a flowchart relating to the manufacturing operation shown in FIG. 2, and FIG. 5 is a flowchart relating to the manufacturing operation shown in FIG. 3.

First, a first manufacturing method based on the present invention will be explained with reference to FIGS. 2 and 4.

In the flowchart shown in FIG. 4, when entering the main manufacturing process from the previous process, first, in step 1, as described above in the conventional technology with reference to FIG. A predetermined first of two insulating substrates molded from ceramic or the like, FIG. 2 (A)
1a shown in FIG. 1 is set on a hot plate 7 equipped with a heater 8 provided at a predetermined position on a processing table by an automatic transport/assembly machine i (not shown) such as a robot. The hot plate 7 is heated by a heater 8 at a predetermined timing.

In the next step 2, a plurality of P-type and N-type thermoelectric elements 2 are transferred onto the above-mentioned insulating substrate la by an automatic transport/assembly mechanism (not shown) such as a robot according to predetermined conditions. correctly arranged on the electrode 3a.

In step 3, an automatic transport/assembly machine (not shown) such as a robot moves a rubber plate 4 made of heat-resistant fluororubber or the like and has a size that covers the insulating substrate to each of the arranged thermoelectric cells. The element is placed over the thermoelectric element group so as not to be moved, and in step 4, a pressure machine f! is placed on the rubber plate. 6 is set.

FIG. 2(A) shows a cross-sectional view from the side during manufacturing at the time when step 4 of the manufacturing steps in the present manufacturing method is completed.

In the above explanation, the setting of the rubber plate 4 and the setting of the push frame 5 were explained as two steps.
It is also possible to attach a rubber plate 4 to the step and make it into one step.

Next, in step 5, when the pressure mechanism 6 presses the push frame downward, the rubber plate 4 is pressed against each thermoelectric element 2.
is pressed against the insulating substrate 1a regardless of variations in height, and each thermoelectric element 2 is fixed.

Since the upper and lower ends of each thermoelectric element 2 and the surface of each electrode formed on the insulating substrate are coated with solder or cream solder in advance, the hot plate 7 is heated by the heater 8 in step 6. When heated, the solder melts and each thermoelectric element 2 and each corresponding electrode 3a are joined.

When the bonding between each thermoelectric element and the electrode is completed, in step 7, the push frame 5 and the rubber plate 4 are removed, and in step 8, each electrode 3b provided on the insulating substrate 1b is placed on each thermoelectric element. Set it so that it is located at

Furthermore, in step 9, a hot plate 7 equipped with a heater 8 is set on the insulating substrate 1b as shown in FIG. 2(B).

As mentioned above, the upper and lower ends of each thermoelectric element and the surface of each electrode formed on the insulating substrate are coated with solder or cream solder in advance, so in step 10, the heater As described above, each thermoelectric element and its corresponding electrode are joined by the hot plate 7 heated by the hot plate 7, thereby completing a thermoelectric module having the structure described above with reference to FIG. 1 and having good processing accuracy.

Next, in step 11, the hot plate 7 is removed, and in step 12, the thermoelectric module is carried out from the processing table to a predetermined position by a transport/assembly mechanism (not shown) such as the aforementioned robot, and the process is completed. death,
Continue to step 1 of the next process.

Next, a second manufacturing method based on the present invention will be explained with reference to FIGS. 3 and 5.

In the flowchart shown in Fig. 5, when entering the main manufacturing process from the previous process, first, in step (2), electrodes are formed in advance on one side of the thermoelectric module, sandwiching each thermoelectric element, as described above in Fig. 1. Figure 2 (A
) is set on a hot plate 7 equipped with a heater 8 placed at a predetermined position on a processing table by an automatic conveyance/assembly mechanism (not shown) such as a robot. 8, heating is performed at a predetermined timing.

In the next step 2, a plurality of P-type and N-type thermoelectric elements 2 are formed on the above-mentioned insulating substrate 1a according to predetermined conditions by an automatic transport/assembly mechanism (not shown) such as a robot. are correctly arranged on the electrode 3a.

In step 3, a holding mechanism is set on the thermoelectric element group by a moving mechanism (not shown) so as not to move each of the thermoelectric elements 2 arranged previously.

FIG. 3(A) shows a cross-sectional view seen from the side during manufacturing at the timing when step 3 of the manufacturing steps in the present manufacturing method is completed.

In FIG. 3(A), 13 is a case made of a non-magnetic material of the holding mechanism.

Reference numeral 11 denotes an iron core, and 12 a coil. Solenoids are formed at both upper and lower ends of the iron core 11 to generate S and N magnetic poles as shown in the figure by passing a current through the coil 12.

Reference numeral 14 denotes a bushing rod with tP1 holes in the same arrangement as the arrangement of each thermoelectric element constituting the thermoelectric module, and a permanent magnet 1 is provided at the upper part of each bushing rod 14.
5 is installed.

The polarity of each permanent magnet is such that the upper part has the same magnetic polarity as the magnetic pole generated at the lower part of the iron core 11 described above. Therefore, when a current is applied to the coil 12, each bushing rod equipped with the permanent magnet generates a downward repulsive force.

In step 4, the above-mentioned solenoid core 11 is activated by passing current through the coil 12, so that each bushing rod 14 respectively presses against each thermoelectric element 2, and pushes each thermoelectric element onto the insulating substrate 1a irrespective of its height variations. Press it to secure it.

The upper and lower ends of each thermoelectric element and the surface of each electrode formed on the insulating substrate are coated with solder or cream solder in advance, so step 5
When the hot plate 7 is heated by the heater 8, the solder melts and each thermoelectric element 2 and each corresponding electrode 3a are joined.

When the bonding between each thermoelectric element 2 and the electrode 3a is completed, the holding mechanism is removed in step 6, and the holding mechanism is removed in step 7.
, each electrode 3b provided on the insulating substrate 1b
are set so as to be positioned above each corresponding thermoelectric element 2.

Further, in step 8, a hot plate 9 equipped with a heater 10 is set on the insulating substrate 1b as shown in FIG. 3 (13).

In step 6, a current may be passed through the coil 12 in the opposite direction to the current passed in step 4, thereby repelling the bushing rod against the opposing thermoelectric element.

As mentioned above, the upper and lower ends of each thermoelectric element and the surface of each electrode formed on the insulating substrate are coated with solder or cream solder in advance, so in step 9, the heater As described above, each thermoelectric element and its corresponding electrode are joined by the hot plate 9 heated by the hot plate 10, thereby completing the thermoelectric module of the WJ construction described above with high processing precision as shown in FIG.

Next, in step 10, the hot plate 7 is removed, and in step 11, the thermoelectric module is carried out from the processing table to a predetermined position by a transport/assembly mechanism (not shown) such as the aforementioned robot, and the process is completed. death,
Continue to step 1 of the next process.

In the above explanation, each sequence operation such as driving the automatic transport/assembly mechanism by a robot etc. not shown in the figure, moving and heating the hot plate, moving and driving the presser mechanism, etc. is not shown in the figure. It is controlled by a well-known sequence control device composed of a computer or the like.

Furthermore, in the above explanation, after step 7 in FIG. 4 and after step 6 in FIG. I explained that they should be bonded, but in order to shorten the process time, the insulating substrate with the thermoelectric element bonded to it should be reversed and moved onto the hot plate on which the insulating substrate to be bonded is set next, and then bonded. Also good.

In addition, although not shown in the diagram, automated transport systems such as robots, etc.
The mechanical structures of moving machines such as assembly machines, push frames, holding mechanisms, and hot plates can be made to have arbitrary structural dimensions in accordance with the structural dimensions of their respective corresponding mechanisms.

[Effects of the Invention] As explained above, according to the present invention, a P-type thermoelectric element and an N
type thermoelectric elements were arranged on a predetermined insulating substrate, and the joints between each electrode and each corresponding thermoelectric element were heated and joined while pressing the upper part of each individual thermoelectric element.
Even minute thermoelectric elements are not moved by the surface tension caused by the melted solder, so each thermoelectric element can be connected and fixed on a predetermined insulating substrate while maintaining its originally precisely arranged position. The excellent effect of being able to efficiently manufacture thermoelectric modules with good processing accuracy was achieved.

[Brief explanation of drawings]

Figure 1 is a thermoelectric module diagram. FIG. 2 is a sectional view illustrating manufacturing operations related to the first manufacturing method based on the manufacturing method of the present invention. FIG. 3 is a cross-sectional view illustrating manufacturing operations related to the second manufacturing method based on the manufacturing method of the present invention. FIG. 4 is a flowchart related to the manufacturing operations shown in FIG. 2. FIG. 5 is a flow diagram relating to the manufacturing operation shown in FIG. 3. FIG. 6 is an explanatory diagram of mounting a conventional thermoelectric element. 1a, 1b...Insulated substrate, 2...
...Thermoelectric element, 2a... P-type thermoelectric element, 2b... N-type thermoelectric element, 3a, 3b... Electrode, 4-... ...Rubber plate, 5...Press frame. 6......Pressure mechanism, 7...--Hot plate, 8...
...Heater, 9...Hot plate, 10...
...Heater, 11...Iron core, 12...Coil, ■3...Case, 14... ...butschrod, 15...
......Permanent magnet, 20a, 20b...Lead wire, 64-...
・・・・・・Press board. Figure (A) Figure M3 (B) Figure 1 (A) (B) Figure 5 Figure

Claims (3)

[Claims] (1) A plurality of adjacent P-type thermoelectric elements and N-type thermoelectric elements are alternately connected in series by electrodes fixed to two opposing insulating substrates, and between the two opposing insulating substrates. In the method of manufacturing a thermoelectric module in which the P-type thermoelectric element and the N-type thermoelectric element are sandwiched and fixed to A P-type thermoelectric element and an N-type thermoelectric element are arranged through a bonding agent made of the like, and the joint portion between each of the electrodes and the corresponding thermoelectric element is heated while pressing the upper part of each individual thermoelectric element. A method for manufacturing a thermoelectric module, characterized by bonding the thermoelectric module. (2) The method for manufacturing a thermoelectric module according to claim 1, characterized in that a rubber sheet is used as a means for pressing the upper part of each individual thermoelectric element. (3) The method for manufacturing a thermoelectric module according to claim (1), characterized in that magnetic force is used as means for pressing the upper portion of each individual thermoelectric element.