JP2531128B2 - Wire-bonding apparatus and method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus and method for wire bonding between pads and leads of electronic parts.

[0002]

2. Description of the Related Art Conventionally, a general wire bonding apparatus is for wire-bonding pads and leads on mutually parallel surfaces, and between pads and leads on mutually perpendicular surfaces such as a flat plate type filter. No wire bonding was done. Therefore, the wiring between the pad and the lead of the flat plate type filter is handled by manually soldering the wire, which causes a problem that the production efficiency is low and the quality varies depending on the operator. Regarding the problem of wire bonding between pads and leads which are perpendicular to each other, as for the semiconductor laser, JP-A-59-59
A solution is presented in No. 101845. this is,
After bonding the wire to the horizontal upper surface of the lead fixed to the stem of the semiconductor laser, the stage holding the stem is inverted 90 degrees around the midpoint between the bonding point on the wire lead and the lower end of the capillary as the rotation center. By doing so, the wire is then bonded to the vertical pad on the semiconductor laser chip.

As shown in FIG. 1, the structure of the flat plate type filter 2 is such that two flat plate resonators 21 are arranged in parallel on a glass epoxy substrate 22 with a predetermined distance, and two flat plate resonators 21 are provided on both side surfaces. The electrode pads at the locations and the leads at the two locations on the substrate 22 are connected by wires. On the other hand, in the wire bonding apparatus disclosed in Japanese Patent Laid-Open No. 59-101845, only one vertical pad on the semiconductor laser chip is wire-bonded to the horizontal upper surface of the lead. After wire-bonding the plate resonator on one side, it is necessary to temporarily remove the plate-type filter from the stage, rotate it by 180 degrees and fix it again on the stage, and wire-bond the remaining plate resonators. In this way, in the case of products that require wire bonding on multiple vertical pads, wire bonding work causes a decrease in production efficiency.
Improvement is needed.

[0004]

In the conventional wire bonding apparatus, when the wire bonding is performed between the pads and the leads which are perpendicular to each other, the production is performed when the wire bonding is performed between the plurality of pads and the plurality of leads. There was a problem of poor efficiency.

[0005]

The wire bonding apparatus of the present invention includes a reversing mechanism for rotating an upper plate in a horizontal or vertical state by rotating it about a horizontal axis passing through a reversing center, A stage that is rotatably provided about an axis perpendicular to the upper plate and that can be stopped at a predetermined rotation angle to hold the work, and a wire that moves up and down through the reversing center to move the wire on the work. And a capillary for bonding to.

In the wire bonding method of the present invention, a fixing step of fixing a work to a stage, and a capillary is first bonded to a surface of the work parallel to the stage, and then the capillary is raised so that a lower end of the wire is centered. Is stopped so as to be positioned in the vicinity of, and then the stage is rotated by 90 ° around an axis parallel to the stage passing through the inversion center, and then the wire is moved by the capillary on a surface perpendicular to the stage of the work. After the second bonding, the capillary is lifted and stopped so that the lower end is located near the inversion center, and then the stage is rotated by 90 ° about the axis parallel to the stage passing through the inversion center. Bonding step and rotating the stage by a predetermined angle about an axis perpendicular to the stage And a step of rotating a predetermined position on the work below the capillary.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A wire bonding apparatus according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1A is a front view of the embodiment of the present invention with the front cover removed, and FIG. 1B is a side sectional view. The stage 4 is fixed to a heater block 5, the heater block 5 is fixed to a thrust bearing 7 via a spacer 6 which is a heat insulating material, and the stage 4 is fixed to a side plate 11 and a horizontal upper plate 17 (see FIG. Rotation of ± 180 degrees is possible within the plane 1 (a) (not shown). When the rotary handle 15 (not shown in FIG. 1A) is rotated, the stage 4 rotates, and the plunger pin 14 attached to the rotary handle 15 is inserted into the groove 16 provided on the upper plate fixed to the side plate 11. The stage 4 stops at the fitted position (the stage 4 is at the position shown in FIG.
The groove 16 is provided so that it can be stopped at a position rotated once.

A rotating mechanism for freely rotating the stage 4 and the like is fixed to a side plate 11, and the side plate 11 is guided around an outer periphery of an arc and is rotatable about a reversing center 3 and is concentric with the reversing center 3. The arc-shaped guide rail 8 is integrally provided. Gears are cut on the inner and outer edges of the guide rail 8, and support gears 9 that make a pair of these gears are engaged with each other. The support gear 9 meshes with the reversing gear 10, and drives a motor 12 (not shown in FIG. 1A) connected to the reversing gear 10 to perform the reversing operation of the stage 4. The reversal center 3, which is the center of this reversal operation, is defined by the perpendicular line at the first bonding point a on the lead (not shown) of the substrate 22 and the perpendicular line at the second bonding point b on the pad (not shown) of the plate resonator 21. Although it is an intersection, an appropriate point may be adopted as the reversal center based on the movement trajectory of the capillary 1 and the wire shape.

Next, the operation of this embodiment will be described with reference to FIG.
This will be described with reference to FIG. (A) The work consisting of the flat plate type filter 2 is placed on the stage 4
A ball is formed on the wire passed through the capillary 1 by electric spark, and the flat plate type filter 2 is heated to a predetermined temperature by the heater block 5 to prepare for wire bonding. After the positioning, the capillary 1 is lowered, the first bonding for connecting the wire to the lead on the side of the one plate resonator 21 on the substrate 22 is performed, raised, and the lower end is positioned in the vicinity of the inversion center 3 and the capillary 1 is positioned.
To stop. (B) The motor 12 is driven to rotate, the operation is transmitted in the order of the reversing gear 10 → the supporting gear 9 → the guide rail 8, the side plate 11 is rotated about the reversing center 3, and the stage 4 is reversed so as to be vertical. I will let you. (C) With the stage 4 vertical and the plate resonator 21 horizontal, the capillary 1 is lowered to perform the second bonding in which the wire is bonded to the pad on one plate resonator 21 by bonding. (D) After raising the capillary 1, the motor 11 is rotated in the reverse direction to return the stage 4 to the horizontal state. Above (a) ~
By the operation shown in (d), wire bonding of the pad to the lead on the substrate 22 is completed for one of the pair of plate resonators 21, and then wire bonding is performed for the other of the plate resonator 21. (E) The stage 4 is moved to the horizontal plane by the rotation bundle 15.
The substrate 22 on the other side of the plate resonator 21 is rotated by 80 degrees.
The upper lead is located below the reversal center 3, ie below the capillary 1. (F) A ball is formed on the wire by electric spark, and the above-described operations (a) to (d) are repeated to repeat the flat plate resonator 21.
Wire bonding is performed between the other pad and the lead of the substrate 22.

As described above, the work of the flat plate type filter 2 is wire-bonded between the pads in the vertical direction on both side surfaces of the pair of flat plate resonators and the leads of the substrate without re-fixing the work piece with respect to the stage 4. Therefore, the production efficiency is doubled. Further, by changing the position and number of the grooves 16, the stage 14 can be stopped at an arbitrary rotation position, and wire bonding can be performed on a vertical pad on a side surface in an arbitrary direction, thereby expanding the range of application of the product. A product with a larger number of wire bonds has a greater effect on improving the production efficiency.

[0012]

According to the wire bonding apparatus and method of the present invention, a stage reversing mechanism for making the stage horizontal or vertical and a stage rotation for rotating the stage mounted on the reversing mechanism about an axis perpendicular to the stage. Since the mechanism is provided, it is possible to perform wire bonding between a plurality of vertical surfaces and a horizontal surface of the work without attaching / detaching the work, thereby improving the production efficiency. In the embodiment shown in FIG. 1, the rotating mechanism is manually moved by a rotating handle, but by controlling the rotation using a servo motor or the like, work can be automated.
Further, the efficiency can be improved. Further, by arbitrarily providing the groove 16 for rotational positioning, wire bonding can be applied to various products.

[0013]

[Brief description of drawings]

1A and 1B are respectively a front view and a side sectional view of a wire bonding apparatus according to an embodiment of the present invention with a front cover removed.

FIG. 2 is a diagram for explaining the operation of the wire bonding apparatus of the embodiment shown in FIG. (A) to (d) show the reversing operation of the stage 4, and (e) to (f) show the rotating operation of the stage 4.

[Explanation of symbols]

 1 Capillary 2 Work 3 Inversion Center 4 Stage 5 Heater Block 6 Spacer 7 Thrust Bearing 8 Guide Rail 9 Support Gear 10 Inversion Gear 11 Side Plate 12 Motor 13 Case 14 Plunger Pin 15 Rotation Handle 16 Groove 17 Upper Plate

Claims (2)

(57) [Claims] 1. A reversing mechanism for rotating an upper plate in a horizontal or vertical state by rotating it about a horizontal axis passing through a reversing center, and enabling the upper plate to rotate about an axis perpendicular to the upper plate. A stage for holding a work, which is provided and capable of stopping at a predetermined rotation angle, and a capillary for vertically moving through the reversing center and bonding a wire onto the work are characterized by being included. Wire bonding equipment. 2. A fixing step of fixing a work to a stage, and firstly bonding a wire to a surface of the work parallel to the stage by means of a capillary, and then raising the capillary so that the lower end is located near the inversion center. And then the stage is rotated by 90 ° about an axis parallel to the stage passing through the center of inversion, and then the wire is second-bonded on the surface of the workpiece perpendicular to the stage by the capillary. A bonding step of raising the capillary to stop the lower end of the capillary so that the lower end is located near the inversion center, and then rotating the stage by 90 ° in the reverse direction about an axis parallel to the stage passing through the inversion center; The stage is rotated by a predetermined angle about an axis perpendicular to the stage to set a predetermined position on the workpiece to the carriage. A wire bonding method, which comprises a rotating step of locating the lower side of the pilari.