TWI451508B - Pre-heating system and method for silicon dies - Google Patents

Description

Preheating system and method for tantalum grains

The present invention relates to a crystal grain preheater for bonding a plurality of crystal grains to various dielectrics, and a method of using the crystal grain preheater.

Flip-chip microelectronics components perform face-down direct electrical connections using conductive bumps on a bond pad, for example, "flipping" electronic components over a substrate , on a circuit board or carrier. In the conventional flip chip bonding, after the fluxing and wafer placement are completed, the wafer is then transferred to the reflow oven, and the solder tip of the lead is melted and padded with the board. Engage. In thermal compression bonding, the wafer placement is performed simultaneously with the reflow system. During placement, the die and the substrate are heated to melt the solder bumps, and the solder bumps form a plurality of solder joints between the bumps and the bond pads on the circuit.

One problem associated with today's flip chip technology is that the die is susceptible to thermal shock. A crystal having a low dielectric constant may cause circuit fatigue in the case of sudden exposure to high temperatures.

During the thermal compression process, the grains are heated from room temperature to the melting temperature of the solder, which can be heated up to 240 °C. In order to reduce the possibility of thermal shock, the ramp rate must be 10 deg/sec or less. In existing bonders, the bonding tool itself preheats the die using a series of pre-programmed temperature steps. In order to achieve the desired lift rate, the bonding tool must wait for more than 20 seconds before starting the bonding process. This delayed action results in a fairly low productivity of existing systems.

Another problem is the mismatch between the coefficient of thermal expansion of the die and the substrate. Figures 1A and 1B depict this problem. Figure 1A shows a portion of a typical assembled system 10. The system 10 includes a component 12 that is coupled to a substrate 14. In the construction shown below, the coefficient of thermal expansion (CTE) of the part 12 and the substrate 14 can be assumed to be different. The thermal mismatch Δu is given by Equation 1 below:

Δ u =Δ e ×L×ΔT (1)

Where Δ e = the difference in thermal expansion coefficient between the materials;

L = the longest dimension of the part (usually diagonal);

ΔT = temperature change

FIG. 1B depicts three examples of system 10, assuming that the thermal expansion coefficient of substrate 14 is greater than the thermal expansion coefficient of component 12. In the first example 20, the system 10 is in a state of thermal equilibrium. In the second example 22, the parts are in a cooled state, causing the substrate 14 to contract relative to the part 12. In a third example 24, the parts are in a heated state, causing expansion of the substrate 14 relative to the part 12.

A basic aspect of the invention provides a system comprising: a plurality of preheaters for preheating a plurality of grains from a base temperature to a desired temperature, the plurality of preheaters being capable of a desired average Increasingly heating each of the plurality of grains until a desired temperature is reached; a die holder containing a plurality of die stations, each of which is configured to Receiving one of the plurality of dies; and means for indexing each of the plurality of dies to each of the respective pre-heaters until a desired temperature is reached.

Embodiments of the invention may further include a bonding tool fitting that is capable of retracting the preheated die and bonding the die to the substrate. The plurality of pre-heaters can include at least 2 pre-heaters. In other embodiments, the plurality of pre-heaters comprises six pre-heaters. The indexing device can include means for rotatable indexing and linear indexing. The die pad may include a turret and the indexing device may also include a servo motor that drives the turntable.

Each of the plurality of dies may be sequentially directed to each preheater for a desired period of time to achieve a desired average rate. The desired lead time can be 3 seconds. Each of the plurality of dies may be sequentially positioned 0.2 mm from each preheater. The average rate can be 10 ° C per second.

In some embodiments, the indexing implements can move the die corresponding to the pre-heater. Alternatively, the indexing means can move the preheater corresponding to the die.

The bond pad can attach the die to the substrate using flip chip bonding. The die may have a bump structure selected from the group consisting of pillar bumps, solder bumps, standard flux, p-coat flux (p-coat flux) And a group of no-flow underfills.

The system can also include a computer control system that can independently control the desired temperature, average rate, pilot time, temperature of each pre-heater, and temperature of the engaged heater.

An alternative aspect of the present invention provides a method of preheating a die from a base temperature to a desired temperature to subsequently attach the die to the substrate, the method comprising the steps of: providing a plurality of preheaters for plural The grains are preheated from a base temperature to a desired temperature, and the plurality of preheaters are capable of gradually heating the grains at a desired rate until a desired temperature is reached; providing a die pad containing a plurality of die shelves Each of the die shelves is configured to receive one of the plurality of dies; and each of the plurality of dies is directed to each of the preheaters until a desired temperature is reached.

In the method, the plurality of preheaters may comprise six preheaters, and the temperatures of the grains may increase at an average rate of 10 ° C per second.

The directing step includes sequentially moving each of the plurality of dies corresponding to each of the pre-heaters. Alternatively, the directing step can include sequentially moving each of the plurality of pre-heaters corresponding to each of the plurality of dies.

In some embodiments, the temperature and the rate of each of the plurality of pre-heaters can be controlled by a computer.

The method can include the step of bonding the preheated grains to the substrate using a bonding heater.

Another aspect of the present invention provides a bonding system for bonding a die to a substrate, the bonding system comprising: a grain preheater system including a plurality of preheaters for preheating a plurality of grains from a base temperature Up to the desired temperature, the plurality of pre-heaters can incrementally heat the grains at a desired rate until a desired temperature is reached; a die holder containing a plurality of die holders, each of which is grouped Forming to receive one of the plurality of grains; and means for directing each of the plurality of grains to each of the preheaters until a desired temperature is reached; and capable of retracting the preheated grains and The preheated die is bonded to a bonding tool fitting of the substrate.

The die pad can include a turntable. The indexing device can also include a servo motor that drives the turntable.

The plurality of pre-heaters can include six pre-heaters. Each of the plurality of dies may be sequentially directed to each of the preheaters for a desired period of time to achieve a desired average rate.

The bonding tool accessory can attach the die to the substrate using flip chip bonding. The die may comprise a bump structure selected from the group consisting of stud bumps, solder bumps, standard flux, p-coat flux, and no-flow underfill.

The bonding system can also include a die pickup tool that can pick up individual dies and place the dies into the dies. The die pad can include a turntable. The indexing device can also include a servo motor that drives the turntable. Each of the plurality of dies can be sequentially directed to each preheater for a desired period of time to achieve a desired average rate. The desired lead time can be 3 seconds. Each of the plurality of dies may be located 0.2 mm from each preheater in sequence. The average rate can be 10 ° C per second.

The engagement system can also include a computer to control the lead time, the desired temperature, the average rate, and the temperature of the bonding tool accessory.

One aspect of the present invention provides a grain preheater that overcomes the limitations described above. The die pre-heater allows the temperature of the die to gradually rise to a desired preheat temperature by, for example, room temperature before the die is bonded to the substrate. As described above, if the temperature of the crystal grains rises too fast, the crystal grains which can contain many motor/electronic circuit systems may be fatigued.

Figure 2 depicts an exploded perspective view of a pre-heater (indicated by symbol 100) in accordance with the present invention. Figure 3 depicts a perspective view of the assembled die preheater 100. The die pre-heater 100 can include a servo motor 102 that drives a turntable 104 by a turret holder. The turret 104 can include a plurality of die shelves 105 for preheating the dies before they are bonded to the substrate. The turntable 104 is an example of a die pad that can be used to hold a plurality of die and be used with the die preheater 100. It can be appreciated that depending on the type of die used, different die preheater configurations can be used. The die preheater 100 can also include a heater block 108 that can hold a plurality of preheaters 110. A compact actuator 112 can be attached to the servo motor 102. If the preheating procedure is interrupted, the delicate actuator 112 moves the preheater 100 away from the dies to avoid overheating the dies. For example, if the machine fails for a period of time, or is interrupted by the operator for any reason, the delicate actuator 112 operates automatically to avoid excessive heating of the dies.

The two preheaters 110 are described in the embodiments shown in Figs. 2 and 3. However, it will be appreciated that a greater or lesser number of preheaters 110 can be used. For example, up to 15 pre-heaters 110 can be used, depending on the demand for the heated die, and the rate of lift to be achieved. Similarly, the preheater 110 shown in Figures 2 and 3 is heated, for example, by radiation to heat the grains, i.e., the grains are placed relatively close to the preheaters 110. However, it will be appreciated that either thermal convection (e.g., by a blower motor) or thermal conduction (the preheater 110 being in contact with the die entities) can be used.

A plurality of brackets can be used to connect a plurality of portions of the preheater 100 having different functions and to connect the preheater 100 to the bonding machine. This section will be detailed later in the discussion of Figure 4. It will be appreciated that the specific brackets shown in this specification are for illustrative purposes only. A plurality of different bracket or seat systems can be utilized to connect a plurality of portions of the preheater 100 having different functions.

In the embodiment shown in Figures 2 and 3, the preheater 100 can include left and right attachment brackets 114a, 114b and a turret motor bracket 116 and one or more preheater attachments. Shelves 118a, 118b. A joint tool fitting 130 including a joint heater 132, an insulator 134, and a joint heater attachment bracket 136 is also shown in the drawings. The joint tool fitting 130 is not attached to the pre-heater fitting 100 as described in the detailed discussion below.

The servo motor 102, preheater 110, bonding tool assembly 130, and bonding heater 132 can include a plurality of electrical connections (not shown) that provide operation. In some embodiments, the operation of these parts can be controlled by a computer to provide a specific preheating time to ensure the efficiency of the joining process without sacrificing quality control.

The servo motor 102 can be any type of motor capable of controlling the turntable 104. In some embodiments, the servo motor can be a 400 watt Mitsubishi servo motor (such as model HFKP 43K) that can be directed during stylization. It should be understood that other types of motors can also be used.

In the embodiment shown in Figures 2 and 3, the die preheater 110 can be a ULTRAMIC 600 advanced ceramic heater (Part #CER-1-01-00130). This model is a 24 volt, 72 watt heater with a maximum temperature of 400 °C. Likewise, the bond heater 132 can be a ULTRAMIC 600 advanced ceramic heater (Part #CER-1-01-00129). This model is a 240 volt, 750 watt heater with a maximum temperature of 400 °C. It can be appreciated that different models and/or types of preheaters and heaters having different electrical and heating characteristics can also be used.

Figure 4 depicts one embodiment of an bonder (designated with reference numeral 200) that can be used with the preheater 100 to assemble preheated dies to a substrate. The bonding machine 200 can include, by way of example only and not limitation, a wafer magazine 202 that is supplied to a wafer tensioner 204. The wafer bottom is used to supply a plurality of wafers (not shown), each wafer containing a plurality of dies that will be bonded to the substrate in a later step. In some embodiments, a thin tape (blue tape) having a thickness of 20 to 30 microns may be included on one side of the wafer. The wafers can then be pre-sawned into individual dies. The wafer tensioner is then used to tension the pre-sawed wafers to loosen the individual dies to enable the die picking tool 216 to pick up the dies.

A tray buffer 206 can be placed next to the wafer tensioner 204. A substrate feeder 280 and a die feeder holder 210 provide the substrate and die being assembled. The die pick tool 216 can be attached to the die feeder holder 210 to pick up the die from the wafer tensioner 204 and place the die into the die shelves 105. Orientation and bump height inspection can be implemented in this step. The grains are then preheated as described below. Once preheated, the dies are transferred to the bonding tool fitting 130. At the same time, the substrate/printed circuit board can be picked up and inspected for print flux and substrate height, and the substrate is loaded onto a hot plate for preheating. A vision alignment and correction step is performed as described below, and the bonding tool assembly 130 is then used to bond the dies to the substrate. In some embodiments, the visual alignment is done entirely by computer 600 (as in Figure 7). This program is a known technique and will not be further described.

At least one die preheater 100 is placed within the bonder 200. The die pre-heater 100 can be attached using, for example, the left and right attachment brackets 114a, 114b. The bonding machine 200 can also include a computer 600 (as in Figure 7) for controlling many different functions of the bonding machine 200. Alternatively, an external computer can be used. In these embodiments, the computer 600 can be configured to separately control the temperature of the preheaters, the distance of the dies on the index tray from the preheaters, the temperature of the substrate to be joined, and the bonding. The temperature of the tool...etc. It will be appreciated that a number of different variations of the control parameters are available, depending on the particular material being joined and/or the type of joint being implemented. In some embodiments, a plurality of pre-heaters 100 and bonding tool fittings 130 can be used to increase the engagement rate. For example, using two pre-heaters 100 and bonding tool fittings 130, the bonding machine 200 can perform 2,400 engagements per hour.

Figure 5 depicts a partial perspective view of a portion of the preheater 100. As previously mentioned, the turret 104 includes a plurality of dies 105 for receiving the dies. It will be appreciated that the die shelves 105 can have many different shapes and sizes depending on the type of die used. A series of die shelves 105 are labeled with sequential component symbols 151 through 159 to represent positions 1 through 9. Figure 5 also shows the heater block 108 and the bonding tool fitting 130 containing a plurality of preheaters 110.

One method of preheating the die from the base temperature to the desired temperature for subsequent attachment of the die to the substrate is depicted in Figure 6 and is designated by the symbol 500. The method 500 can include a first step (element symbol 502) of providing a plurality of preheaters for preheating a plurality of dies from a base temperature to a desired temperature, the plurality of preheaters being capable of increasing at a desired rate Heating the grains until a desired temperature is reached; providing a second step (element symbol 504) of the die holders comprising a plurality of die shelves, each die frame being configured to receive the plurality of grains One of them; and the last step (element symbol 506) for directing each of the plurality of dies to each of the pre-heaters until the desired temperature is reached. Further details are as follows.

Accordingly, a system is provided to implement the method 500, the system comprising: a plurality of preheaters for preheating a plurality of dies from a base temperature to a desired temperature, the plurality of preheaters being capable of being at a desired rate Gradually heating the plurality of grains until a desired temperature is reached; the die pad, comprising a plurality of die shelves, each die frame being configured to receive one of the plurality of grains; and And for directing each of the plurality of dies to each of the plurality of pre-heaters until a desired temperature is reached.

Referring to Figures 2 through 6, the die pre-heater 100 mounted in the bonding machine 200 will now be described. However, it will be appreciated that the use of the pre-heater 100 is not limited to the particular bonding machine 200 described. The preheater 100 can be used with any type of bonding machine that may require the die to experience a desired rate of temperature change prior to bonding. Additionally, multiple preheaters 100 can be used in a single bonder. All such applications are considered to fall within the scope of the embodiments of the invention.

The die pick tool 216 places the die at position 1 (151). Whenever the servo motor 102 directs the turntable 104, another die is placed at position 1 (151). When used in conjunction with the bonding machine 200, in order to preheat the die to a desired temperature at a desired rate, the turntable 104 on the preheater 100 can be directed at varying time intervals. Since the turret 104 is rotated to sequentially move the dies relative to the preheater 110, such a form of guidance is a known rotation guide.

For purposes of explanation, in the apparatus and method outlined in this patent, the terms "guide" and "guide" refer to sequentially moving a die relative to a plurality of preheaters, and then prior to joining the die. Raise to the desired temperature. While the above examples provide for directing the dies to the substrate relative to the pre-heater 110 (that is, the dies are moved corresponding to the pre-heater 110), it will be appreciated that other guidance methods can be used as well. . For example, linear guidance can be used in which the grains move linearly relative to the heaters. Similarly, the manner of directing is not relevant to the purpose of the wafers in the present invention corresponding to the movement of the preheaters. It is also possible that the preheater moves relative to the dies. It is to be understood that all such guidelines are considered to be within the scope of the embodiments of the invention.

As the guidance of the turntable 104 continues, the dies are sequentially moved to the preheating positions 3 to 8 (153 to 158). The directing step ends at position 8, and the dies are heated to the desired temperature. After the next guiding step, the dies are picked up by the bonding tool assembly 130 at position 9 (159). The bonding tool assembly 130 then lifts the temperature of the die using the bond heater 132 and then bonds the die to the substrate.

With the above embodiment, the actual time required for the turret to move was 0.2 seconds, and a 2.8 second delay in preheating the die. The new die is then placed at position 1 (151), that is, one die is directed every three seconds. In this embodiment, each of the preheaters 110 is set at a fixed temperature of 223 °C. Then, the grain temperature was raised from 20 ° C to 200 ° C in 18 seconds. This heating process provides an average rate of rise and fall of the grains of 10 ° C per second. Similarly, the temperature of the bonding heater 132 is set at 260 ° C to effectively carry out the bonding step between the die and the substrate.

For this embodiment, the tantalum grain is 10 mm by 10 mm and has a thickness of 0.75 mm. The die is placed 0.2 mm below the preheater 110. In some embodiments, the pilot time, the temperature of the pre-heater 110 and the bond heater 132, the die placement, etc., can be controlled by computer input. This section is detailed in Figure 7. It should be understood that the invention is not limited to the embodiments described. Different grain sizes, different preheater 110 and junction heater 132 temperatures, different lead times, and different die placements can also be used, depending on the particular parameters applied. All such changes to the individual elements are considered to be within the scope of the embodiments of the invention.

The bonder 200 and die preheater 100 can be used to implement a variety of different types of joints. By way of example and not limitation, the bonding machine can be implemented for fine pitch paper leadframes, memory modules, high pin count dies on a substrate, glass wafers, and chip on chip processes. Thermo-compression bonding. The bonding machine 200 is capable of producing a bellows-like joint of optimum strength by precise height control and compression-contraction techniques. The bonding machine 200 can also support different bump structures such as, but not limited to, stud bumps, solder bumps, standard flux, p-coat flux, and no-flow underfill.

Some of the above are presented explicitly or implicitly in terms of algorithms and functional or symbolic representations of the operation of data in computer memory. These computational descriptions, as well as functional or symbolic representations, are within the skill of the art having the ability to control a variety of different machines and programs and to best communicate the nature of their operations. The algorithm proposed herein is generally considered to be a self-consistent sequence of steps leading to a desired result. These steps are steps that require physical control of physical quantities, such as electrical, magnetic or optical signals that can be stored, transmitted, combined, compared, and or controlled.

Unless explicitly stated, and as apparent from the following, it should be understood that the terms discussed throughout the specification such as "calculating," "decision," "replace," "generate," "initialize," "output," or the like. Refers to the actions and procedures of a computer system or similar electronic device that controls and converts data represented as physical quantities within the computer system into the computer system or other information storage device, transmission or display device. Other materials expressed as similar physical quantities. Such data can be output as electrical signals to control a variety of different aspects of the above described manufacturing process. By way of example only and not limitation, such an output signal can be used to control the temperature of the preheater 110, the temperature of the junction heater 132, the lead time, and the distance or gap between the die and the preheater (thus Control the rate of rise and fall of the grain).

This specification also discloses apparatus for performing the operations of the above methods. Such equipment is specifically constructed for the desired purpose, or includes a general purpose computer or other device selectively activated or reconfigured by a computer program stored in the computer. The algorithms and displays presented herein are not necessarily related to a particular computer or other specific device. Many general purpose machines can be used with the program in accordance with the teachings of this specification. Alternatively, more specialized equipment may be constructed to implement the desired method steps. The structure of a conventional general purpose computer will appear in the following description.

Moreover, the present specification implicitly discloses a computer program which, for those of ordinary skill in the art, will be apparent from the individual steps of the method and the manufacturing process described herein. The computer program is not limited to any particular programming language or its implementation. It will be appreciated that many different programming languages and their encodings can be used to implement the teachings disclosed herein. In addition, the computer program is not limited to any particular control process. Many other variations of the computer program can use different control processes without departing from the spirit and scope of the invention.

Furthermore, one or more steps of the computer program can be implemented in parallel and not necessarily sequentially. This computer program can be stored on any computer readable medium. The computer readable medium can include storage devices (such as a magnetic or optical disk, a memory chip, or other storage device suitable for connection to a general purpose computer). The computer readable medium can also include hard-wired media, such as an internet system, or wireless media, such as a GSM mobile phone system. When loaded or executed on such a general purpose computer, the computer program can effectively produce a device that implements the preferred method.

The computer control of the manufacturing program can also be implemented by a hardware module. More specifically, from a hardware perspective, a module is a functional hardware unit designed to work with other parts or modules. For example, a module can be implemented using discrete electronic components or form part of an overall electronic circuit, such as an application specific integrated circuit (ASIC). In addition, there are many possible implementations. Those of ordinary skill in the art will appreciate that the system can be implemented in a combination of hardware and software modules.

The method and system of the exemplary embodiment can be implemented in computer system 600 (shown generally in Figure 7). The method and system can be implemented in a software manner (e.g., a computer program executed on the computer system 600) and instructions can be issued to the computer system 600 to control the heater 100 and the die bonder 200. For example, the computer can be used to independently control the temperature of the preheaters 110, the engagement heater 132, the pilot time of the servo motor 102 that controls the turret 104, and the dies and the preheaters 110. the distance between.

The computer system 600 includes a computer module 602, input modules (such as a keyboard 604 and a mouse 606), and a plurality of output devices (such as a display 608 and a printer 610). The computer module 602 is connected to the computer network 612 via a suitable transceiver device 614, thereby enabling access to, for example, the Internet or other network systems (such as a local area network (LAN)). Or Wide Area Network (WAN).

In the exemplary embodiment, the computer module 602 includes a processor 618, a random access memory (RAM) 620, and a read only memory (ROM) 622. The computer module 602 also includes input/output (I/O) interfaces, such as an I/O interface 624 that connects the display 608 and an I/O interface 626 that connects the keyboard 604. The parts of the computer module 602 are conventionally in communication with each other via the interconnect bus 628 and in a manner known to those of ordinary skill in the art.

The application can be encoded on a data storage medium, such as a CD-ROM or flash memory carrier, for presentation to a user of the computer system 600 and read using a data storage media drive corresponding to the data storage device 630. The processor 618 executes the application to read and control the application. The intermediate storage of program data may be achieved using RAM 620.

The grain preheater 100 described above provides several advantages over the prior art. Since the bonding heater is no longer used for preheating, the time period required to manufacture the die bonded to the substrate can be greatly shortened. For example, in an experimental test using a single preheater, an assembled die/substrate can be fabricated every three seconds. As also noted above, multiple preheaters can be added to a single die bonder to increase the efficiency of the die bonding process.

It will be appreciated by those skilled in the art that the present invention may be modified and/or modified as shown in the specific embodiments without departing from the spirit and scope of the invention. Therefore, all the embodiments of the present invention are intended to be illustrative only and not to limit the invention.

10. . . Accessory system, system

12. . . Components

14. . . Substrate

20, 22, 24. . . example

100. . . Grain preheater

102. . . Servo motor

104. . . Turntable

105. . . Grain frame

106. . . Turntable

108. . . Heater seat

110. . . Preheater

112. . . Actuator

114a, 114b. . . Pickup bracket

118a, 118b. . . Preheater attachment bracket

116. . . Turntable motor bracket

130. . . Bonding tool accessories

132. . . Joint heater

134. . . Insulator

136. . . Joint heater attachment bracket

151, 152, 153, 155, 156, 157, 158, 159. . . Grain frame

200. . . Bonding machine

202. . . Wafer bottom

204. . . Wafer tensioner

206. . . Tray buffer

208. . . Substrate feeder bracket

210. . . Die feeder bracket

216. . . Die picking tool

500. . . method

502, 504, 506. . . step

600. . . Advanced ceramic heater

602. . . Computer module

604. . . keyboard

606. . . mouse

608. . . monitor

610. . . Printer

612. . . Computer network

614. . . Transceiver device

618. . . processor

620. . . Random access memory

622 read-only memory

626. . . I/O interface

628. . . Interconnect bus

630. . . Data storage device

A better understanding of the present invention will be apparent to those skilled in the <RTIgt;

1A and 1B depict the problem of thermal expansion coefficient mismatch between a plurality of different parts in an electrical system;

Figure 2 is an exploded perspective view of one embodiment of a grain preheater in accordance with the present invention;

Figure 3 is a perspective view showing the assembly of the die preheater of Figure 2;

Figure 4 is a diagram depicting one embodiment of a die bonder that can be used with the die preheater of Figures 2 and 3;

Figure 5 is a partial exploded view showing a portion of the die preheater of Figures 2 and 3;

Figure 6 is a diagram depicting one embodiment of a method of preheating a die using the die preheater of Figures 2 and 3;

Figure 7 is a diagram showing a computer system that can be used to control the preheater of Figs. 2 and 3 and the die bonder of Fig. 4.

100. . . Grain preheater

102. . . Servo motor

104. . . Turntable

105. . . Grain frame

108. . . Heater seat

110. . . Preheater

112. . . Actuator

114a, 114b. . . Pickup bracket

116. . . Turntable motor bracket

118a, 118b. . . Preheater attachment bracket

130. . . Bonding tool accessories

132. . . Joint heater

134. . . Insulator

136. . . Joint heater attachment bracket

Claims (28)

A system comprising: a plurality of preheaters for preheating a plurality of grains from a base temperature to a desired temperature, the plurality of preheaters being capable of incrementally heating the plurality of grains at a desired average rate Each, until the desired temperature is reached; the die pad, comprising a plurality of die shelves, each die frame being configured to receive one of the plurality of grains; and an appliance for the plurality of Each of the grains is directed to each of the respective plurality of preheaters until the desired temperature is reached. The system of claim 1, wherein the system includes a bonding tool fitting that retracts the preheated die and bonds the die to the substrate. The system of claim 1 or 2, wherein the plurality of preheaters comprises at least 2 preheaters. The system of claim 1 or 2, wherein the plurality of preheaters comprises six preheaters. The system of claim 1 or 2, wherein the appliance comprises means capable of rotary or linear guidance. The system of claim 1 or 2, wherein the die pad includes a turntable, and the tool includes a servo motor that drives the turntable. The system of claim 6, wherein each of the plurality of dies is sequentially directed to each of the respective preheaters for a desired period of time to achieve the desired average rate. The system of claim 7, wherein the desired guiding time is 3 seconds, each of the plurality of dies being sequentially located 0.2 mm from each of the plurality of heaters, and the average rate Is 10 ° C per second. The system of claim 1 or 2, wherein the appliance moves the die corresponding to the preheaters. The system of claim 1 or 2, wherein the appliance moves the preheaters corresponding to the die. The system of claim 1 or 2, wherein the bonding tool component attaches the die to the substrate using flip chip bonding, and wherein the die comprises a bump structure, the bump structure is selected A group of free-column bumps, solder bumps, standard flux, p-coat flux, and no-flow underfill. A system as claimed in claim 1 or 2, further comprising a computer control system capable of independently controlling the desired temperature, the average rate, the guidance time, and each of the preheaters The temperature and the temperature of the joining heater. A method of preheating a die from a base temperature to a desired temperature to subsequently attach the die to a substrate, the method comprising the steps of: providing a plurality of preheaters for self-basing temperatures of the plurality of grains Preheating to a desired temperature, the plurality of preheaters can incrementally heat the grains at a desired rate until a desired temperature is reached; providing a die pad containing a plurality of die shelves, each die frame Each being configured to receive one of the plurality of grains; Each of the plurality of dies is directed to each of the respective plurality of pre-heaters until the desired temperature is reached. The method of claim 13, wherein the plurality of preheaters comprises six preheaters. The method of any one of clauses 13 or 14, wherein the temperature of the grains is increased at an average rate of 10 ° C per second. The method of claim 13 or 14, wherein the directing step comprises sequentially moving each of the plurality of dies corresponding to each of the preheaters. The method of claim 13 or 14, wherein the directing step comprises sequentially moving each of the plurality of preheaters corresponding to each of the plurality of dies. The method of claim 13 or 14, wherein the temperature of each of the plurality of preheaters and the rate of the guidance are controlled by a computer. The method of claim 13 or 14, further comprising the step of bonding the preheated grains to the substrate using a bonding heater. A bonding system for bonding die to a substrate, the bonding system comprising: a grain preheater system comprising: a plurality of preheaters for preheating a plurality of grains from a base temperature to a desired temperature, The plurality of pre-heaters are capable of incrementally heating each of the plurality of grains at a desired average rate until the end of the period a temperature block; a die holder having a plurality of die shelves, each die frame being configured to receive one of the plurality of crystal grains; and an apparatus for each of the plurality of crystal grains Directing to each of the respective plurality of preheaters until the desired temperature is reached; and engaging the tool fitting to retract the preheated die and bond the die to the substrate. The joining system of claim 20, wherein the die pad comprises a turntable, and the tool comprises a servo motor that drives the turntable. The joining system of claim 20 or 21, wherein the plurality of preheaters comprises 6 preheaters, and wherein each of the plurality of crystal grains is sequentially directed to the corresponding one of the preheaters Each of the heaters lasts for a desired period of time to achieve the desired average rate. The joining system of claim 20 or 21, wherein the joining tool fitting attaches the die to the substrate using flip chip bonding, and wherein the die comprises a bump structure, the bump structure is selected A group of free-column bumps, solder bumps, standard flux, p-coat flux, and no-flow underfill. The bonding system of claim 20 or 21 includes a die picking tool capable of picking up individual dies and placing the dies into the dies. For example, in the joint system of claim 20 or 21, wherein The die pad includes a turntable and the tool includes a servo motor that drives the turntable. The joining system of claim 25, wherein each of the plurality of dies is sequentially directed to each of the respective preheaters for a desired period of time to achieve the desired average rate. The bonding system of claim 26, wherein the desired guiding time is 3 seconds, each of the plurality of crystal grains being sequentially located 0.2 mm from each of the plurality of heaters, and the average The rate is 10 ° C per second. The bonding system of claim 27, further comprising a computer for controlling the guiding time, the desired temperature, the average rate, and the temperature of the bonding tool accessory.