CN111524842A - Progressive baking and heating device - Google Patents
Progressive baking and heating device Download PDFInfo
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- CN111524842A CN111524842A CN202010641505.1A CN202010641505A CN111524842A CN 111524842 A CN111524842 A CN 111524842A CN 202010641505 A CN202010641505 A CN 202010641505A CN 111524842 A CN111524842 A CN 111524842A
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- heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a progressive baking and heating device, which relates to the technical field of wafer processing and comprises a heating mechanism, a driving mechanism, a lifting mechanism, a supporting plate and a thimble, wherein the supporting plate is connected with the thimble; the progressive heating device can stop the wafer at different heights under the driving of the driving mechanism and the lifting mechanism, thereby not only ensuring the continuous and stable lifting of the temperature in the baking process, but also avoiding the external impact on the wafer in the lifting process, and fundamentally avoiding the problems of warping and fragmentation of the thin wafer in the baking process. The progressive baking and heating device has the advantages of simple structure, convenience, practicability and capability of effectively improving the baking quality of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a progressive baking and heating device.
Background
The traditional wafer processing equipment is disclosed by the following patents, and Chinese patent specification CN 105470187B (2016, 04, 6 days published) discloses a lifting disk body device for preventing a wafer from sliding, which comprises a fixed cover, a lifting disk body, an ejector pin mechanism and a lower fixing plate, wherein the fixed cover and the ejector pin mechanism are respectively arranged on the lower fixing plate, the lifting disk body is positioned between the fixed cover and the ejector pin mechanism and comprises a heating disk body, an outer sealing body, a power device and stop pins, the power device is arranged on the fixing plate and drives the outer sealing body to lift, the heating disk body is placed in the outer sealing body and lift along with the outer sealing body, and a plurality of stop pins are uniformly distributed on the upper surface of the heating disk body along the circumferential direction; the thimble mechanism penetrates through the heating disc body, the wafer is supported at the lower limit position of the heating disc body, and the fixed cover is in sealing connection with the outer sealing body which rises to the upper limit position to form a process chamber. According to the invention, through the lifting of the lifting disc body, the wafer is kept still and still all the time before falling on the upper surface of the heating disc body, and the defect of sideslip caused by the conventional wafer lifting mode is avoided.
However, the cylinder of the above patent is of a single-stroke structure, and only one position can be stopped during the lifting process, and at the end position of the stroke, due to the existence of an impact phenomenon, the position of the wafer is easily changed, so that the possibility of fragments is caused when the manipulator takes the wafer; meanwhile, the wafer is sent into the heating plate device by the mechanical arm, in the baking process, due to the fact that a certain temperature difference exists between the inside and the outside of the heating device, the special wafer material is prone to warping to different degrees when the temperature changes rapidly, when the temperature changes too much, the warping of the wafer can generate certain stress, and the wafer can be directly broken under the action of external temperature change or external force, so that the performance of the product is directly influenced. Therefore, there is a need for a new progressive bake heating apparatus that overcomes the above-mentioned drawbacks.
Disclosure of Invention
First, technical problem to be solved
The invention aims at the defects in the prior art, and particularly provides a progressive baking and heating device which solves the problems that in the baking process of the conventional baking and heating device, due to the fact that a certain temperature difference exists between the inside and the outside of the heating device, special wafer materials are easy to warp to different degrees when the temperature changes rapidly, and fragments are likely to be generated under the action of external temperature change or external force.
Second, technical scheme
A progressive baking and heating device comprises a heating mechanism, a driving mechanism, a lifting mechanism, a supporting plate and ejector pins, wherein the supporting plate is connected with the ejector pins, the ejector pins extend into the heating mechanism, the driving mechanism drives the lifting mechanism, and the lifting mechanism drives the supporting plate to perform progressive lifting motion.
Wherein, hoist mechanism includes the curb plate, curb plate upper end fixedly connected with fixing base rotates on the fixing base and is connected with the band pulley, is provided with linear guide on the curb plate, and sliding connection has the sliding seat on the linear guide, and actuating mechanism fixed mounting is on the sliding seat, and actuating mechanism goes up the last fixedly connected with rotary drum, is connected with the belt on the rotary drum, and the belt is around establishing on the band pulley, fixedly connected with layer board on the sliding seat, and the layer board is located heating mechanism's below.
Wherein, the heating mechanism is a heating plate.
Wherein the driving mechanism is a servo motor.
Wherein, the output shaft of the servo motor is fixedly connected with a rotary drum.
Wherein, the heating plate top is provided with the dish lid, and the dish lid rotates to be connected on the bottom plate, and the dish lid is rotated by cylinder drive.
Wherein, a plate cover plate is arranged on the plate cover.
Wherein, the fixing seat is provided with a belt seat, and the belt passes through a pair of through holes on the belt seat.
Wherein, the bottom plate is provided with a temperature controller which is connected with the heating plate through a circuit.
Wherein, the bottom plate is provided with a controller, and the controller is connected with the servo motor through a circuit.
Third, beneficial effect
Compared with the prior art, the progressive heating device can stop the wafer at different heights under the driving of the driving mechanism and the lifting mechanism, can ensure the continuous and stable lifting of the temperature in the baking process, can avoid the external impact on the wafer in the lifting process, and fundamentally avoids the problems of warping and fragmentation of the thin wafer in the baking process. The progressive baking and heating device has the advantages of simple structure, convenience, practicability and capability of effectively improving the baking quality of the wafer.
Drawings
FIG. 1 is a schematic perspective view of a progressive baking and heating apparatus according to the present invention;
FIG. 2 is a front view of a progressive bake heating apparatus of the present invention;
FIG. 3 is a schematic structural diagram of a driving mechanism of a progressive baking and heating device according to the present invention.
In the figure: the heating device comprises a heating mechanism 1, a tray cover plate 2, a tray cover 3, a cylinder 4, a heating tray 5, a temperature controller 6, a driving mechanism 7, a controller 8, a bottom plate 9, a side plate 10, a linear guide rail 11, a fixed seat 12, a belt wheel 13, a belt 14, a sliding seat 15, a servo motor 16, a supporting plate 17, a thimble 18 and a belt seat 19.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Example 1:
the progressive baking and heating device of the embodiment of the invention is shown in figures 1, 2 and 3: the lifting device comprises a bottom plate 9, wherein a heating mechanism 1, a driving mechanism 7 and a lifting mechanism are arranged on the bottom plate 9, the driving mechanism drives the lifting mechanism, and the lifting mechanism drives a supporting plate to perform progressive lifting motion. Specifically speaking, the lifting mechanism comprises a side plate 10, a fixed seat 12 is fixedly connected to the upper end of the side plate 10, a belt wheel 13 is rotatably connected to the fixed seat 12, a linear guide rail 11 is arranged on the side plate 10, a sliding seat 15 is slidably connected to the linear guide rail 11, a driving mechanism 7 is fixedly mounted on the sliding seat 15, a rotating cylinder is fixedly connected to the driving mechanism 7, a belt 14 is connected to the rotating cylinder, the belt 14 is wound on the belt wheel 13, a supporting plate 17 is fixedly connected to the sliding seat 15, a thimble 18 is fixedly connected to the supporting plate 17, the supporting plate 17 is located below the heating mechanism 1, and the thimble 18 extends into the heating mechanism 1. The heating mechanism 1 is specifically a heating plate 5. The drive mechanism 7 is embodied as a servomotor 16. A rotary drum is fixedly connected to an output shaft of the servo motor 16. During heating, the heating plate 5 is arranged at a certain temperature, the wafer is placed on the thimble 18 by the manipulator, the supporting plate 17 and the thimble 18 are driven by the servo motor 16 in the driving mechanism 7 to slowly descend under the transmission action of the belt 14, the temperature of the wafer is gradually increased, and the wafer is slowly and continuously raised under the baking action of the heating plate in the continuous and slow descending process, so that certain residual stress caused by impact of sudden change of the external temperature on the wafer material is avoided in the continuous heating process, and the possibility of fragment is reduced; on the other hand, the servo motor 16 can execute variable acceleration and deceleration rotation, so that the electric thimble assembly can realize flexible pause in the lifting process, thereby avoiding the mechanical impact action on the wafer in the lifting motion process, and avoiding the fragment phenomenon caused by the mechanical impact action when the wafer is in a warping state.
A plate cover 3 is arranged above the heating plate 5, the plate cover 3 is rotatably connected to the bottom plate 9, and the plate cover 3 is driven to rotate by the air cylinder 4. After the manipulator places the wafer on the thimble 18, the cover 3 closes the upper port of the heating plate 5 under the driving of the cylinder 4, so as to improve the heating effect.
The base plate 9 is provided with a temperature controller 6, and the temperature controller 6 is connected with the heating plate 5 through a circuit. The temperature controller 6 controls the temperature of the heating plate 5.
The bottom plate 9 is provided with a controller 8, and the controller 8 is connected with a servo motor 16 through a circuit. The controller 8 controls the rotation speed and the rotation direction of the servo motor 16.
The working principle of the invention is as follows: during heating, the heating plate 5 is arranged at a certain temperature, the wafer is placed on the thimble 18 by the manipulator, the supporting plate 17 and the thimble 18 are driven by the servo motor 16 in the driving mechanism 7 to slowly descend under the transmission action of the belt 14, the temperature of the wafer is gradually increased, and the wafer is slowly and continuously raised under the baking action of the heating plate in the continuous and slow descending process, so that certain residual stress caused by impact of sudden change of the external temperature on the wafer material is avoided in the continuous heating process, and the possibility of fragment is reduced; on the other hand, the servo motor 16 can execute variable acceleration and deceleration rotation, so that the electric thimble assembly can realize flexible pause in the lifting process, thereby avoiding the mechanical impact action on the wafer in the lifting motion process, and avoiding the fragment phenomenon caused by the mechanical impact action when the wafer is in a warping state. After the manipulator places the wafer on the thimble 18, the cover 3 closes the upper port of the heating plate 5 under the driving of the cylinder 4, so as to improve the heating effect. The temperature controller 6 controls the temperature of the heating plate 5. The controller 8 controls the rotation speed and the rotation direction of the servo motor 16.
Example 2:
in the present embodiment, the disk cover 3 is provided with the disk cover plate 2, as compared with embodiment 1. The plate cover plate 2 is convenient for observing the wafer in the heating plate 5; and the fixed seat 12 is provided with a belt seat 19, and the belt 14 passes through a pair of perforating holes on the belt seat 19. The belt seat 19 plays a role in stabilizing the belt 14, and further improves the wafer lifting control precision.
Example 3:
the embodiment of the invention is basically the same as embodiments 2 and 3, except that the lifting mechanism in the embodiment of the invention specifically comprises a fixed seat 12 which is rotatably connected with a chain wheel, a side plate 10 is provided with a linear guide rail 11, the linear guide rail 11 is slidably connected with a sliding seat 15, a driving mechanism 7 is fixedly arranged on the sliding seat 15, the driving mechanism 7 is fixedly connected with a rotating cylinder which is connected with a chain, the chain is wound on the chain wheel, the sliding seat 15 is fixedly connected with a supporting plate 17, the supporting plate 17 is fixedly connected with a thimble 18, the supporting plate 17 is positioned below the heating mechanism 1, and the thimble 18 extends into the heating mechanism 1. During heating, heating plate 5 sets up under certain temperature, and the manipulator is placed the wafer on thimble 18, and servo motor 16 drives layer board 17 and thimble 18 and slowly descends under chain drive effect among the actuating mechanism 7, the gradual increase of wafer temperature, because the wafer receives heating plate 5's stoving effect at the in-process that descends slowly in succession, its temperature slowly rises continuously, at this continuous intensification in-process, avoided the abrupt change of ambient temperature to wafer material impact and cause certain residual stress, thereby reduced the possibility of piece.
Example 4:
the progressive baking and heating device provided by the embodiment of the invention is not shown in the attached drawing, and comprises a bottom plate 9, wherein a heating mechanism 1, a driving mechanism 7 and a lifting mechanism are arranged on the bottom plate 9, and the lifting mechanism comprises a gear and a rack. The driving mechanism 7 drives the lifting mechanism, specifically, the driving mechanism 7 is connected with a gear, the gear is connected with a rack, the rack is connected with a supporting plate 17, a thimble 18 is fixedly connected on the supporting plate 17, the supporting plate 17 is positioned below the heating mechanism 1, and the thimble 18 extends into the heating mechanism 1. The heating mechanism 1 is specifically a heating plate 5. The drive mechanism 7 is embodied as a servomotor 16. During heating, the heating plate 5 is arranged at a certain temperature, the wafer is placed on the thimble 18 by the manipulator, the servo motor 16 in the driving mechanism 7 drives the gear, the gear drives the rack, the rack drives the supporting plate 17 and the thimble 18 to slowly descend, the temperature of the wafer is gradually increased, the temperature of the wafer is slowly and continuously increased due to the baking effect of the heating plate 5 in the continuous and slow descending process, and in the continuous heating process, certain residual stress caused by impact of sudden change of external temperature on the wafer material is avoided, so that the possibility of fragment is reduced; on the other hand, the servo motor 16 can execute variable acceleration and deceleration rotation, so that the electric thimble 18 assembly can realize flexible pause in the lifting process, thereby avoiding the mechanical impact action on the wafer in the lifting motion process, and avoiding the fragment phenomenon caused by the mechanical impact action when the wafer is in a warping state.
Example 5:
the progressive baking and heating device provided by the embodiment of the invention is not shown in the attached drawing, and comprises a bottom plate 9, wherein a heating mechanism 1, a driving mechanism 7 and a lifting mechanism are arranged on the bottom plate 9, and the lifting mechanism comprises a sliding block and a guide rail. The driving mechanism 7 drives the lifting mechanism, specifically, the driving mechanism 7 drives the sliding block, the sliding block slides on the guide rail, the sliding block is connected with a supporting plate 17, a thimble 18 is fixedly connected on the supporting plate 17, the supporting plate 17 is positioned below the heating mechanism 1, and the thimble 18 extends into the heating mechanism 1. The heating mechanism 1 is specifically a heating plate 5. The drive mechanism 7 is embodied as a servomotor 16. During heating, the heating plate 5 is arranged at a certain temperature, the wafer is placed on the thimble 18 by the manipulator, the servo motor 16 in the driving mechanism 7 drives the slide block, the slide block drives the supporting plate 17 and the thimble 18 to slowly descend, the temperature of the wafer is gradually increased, and the wafer is slowly and continuously increased under the baking action of the heating plate 5 in the continuous and slow descending process, so that certain residual stress caused by impact of sudden change of the external temperature on the wafer material is avoided in the continuous heating process, and the possibility of fragment is reduced; on the other hand, the servo motor 16 can execute variable acceleration and deceleration rotation, so that the electric thimble 18 assembly can realize flexible pause in the lifting process, thereby avoiding the mechanical impact action on the wafer in the lifting motion process, and avoiding the fragment phenomenon caused by the mechanical impact action when the wafer is in a warping state.
The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, it is possible to make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention.
Claims (9)
1. A progressive baking and heating device is characterized in that: comprises a heating mechanism (1), a driving mechanism (7), a lifting mechanism, a supporting plate (17) and a thimble (18), wherein the supporting plate (17) is connected with the thimble (18), the thimble (18) extends into the heating mechanism (1), the driving mechanism (7) is used for driving the lifting mechanism, the lifting mechanism drives the supporting plate (17) to perform progressive lifting motion, the lifting mechanism comprises a side plate (10), the upper end of the side plate (10) is fixedly connected with a fixed seat (12), the fixed seat (12) is connected with a belt wheel (13) in a rotating way, the side plate (10) is provided with a linear guide rail (11), the linear guide rail (11) is connected with a sliding seat (15) in a sliding way, the driving mechanism (7) is fixedly arranged on the sliding seat (15), the driving mechanism (7) is connected with a rotating drum, the rotating drum is connected with a belt (14), and the belt (14) is wound on the belt wheel (, the sliding seat (15) is fixedly connected with a supporting plate (17), and the supporting plate (17) is positioned below the heating mechanism (1).
2. The progressive baking heating apparatus of claim 1, wherein: the heating mechanism (1) is a heating plate (5).
3. The progressive baking heating apparatus of claim 2, wherein: the driving mechanism (7) is a servo motor (16).
4. A progressive baking heating apparatus as set forth in claim 3, wherein: and a rotary drum is fixedly connected to an output shaft of the servo motor (16).
5. The progressive baking heating apparatus of claim 2, wherein: heating plate (5) top is provided with dish lid (3), dish lid (3) rotate to be connected on bottom plate (9), dish lid (3) are rotated by cylinder (4) drive.
6. The progressive baking heating apparatus of claim 5, wherein: the plate cover (3) is provided with a plate cover plate (2).
7. The progressive baking heating apparatus of claim 1, wherein: the fixed seat (12) is provided with a belt seat (19), and the belt (14) penetrates through a pair of belt penetrating holes in the belt seat (19).
8. The progressive baking heating apparatus of claim 5, wherein: the heating device is characterized in that a temperature controller (6) is arranged on the bottom plate (9), and the temperature controller (6) is connected with the heating plate (5) through a circuit.
9. The progressive baking heating apparatus of claim 8, wherein: the bottom plate (9) is also provided with a controller (8), and the controller (8) is connected with a servo motor (16) through a circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010641505.1A CN111524842A (en) | 2020-07-06 | 2020-07-06 | Progressive baking and heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010641505.1A CN111524842A (en) | 2020-07-06 | 2020-07-06 | Progressive baking and heating device |
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| CN111524842A true CN111524842A (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010641505.1A Pending CN111524842A (en) | 2020-07-06 | 2020-07-06 | Progressive baking and heating device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216634A (en) * | 2020-10-13 | 2021-01-12 | 宁波润华全芯微电子设备有限公司 | Progressive wafer baking method |
| CN112349626A (en) * | 2020-09-28 | 2021-02-09 | 芯米(厦门)半导体设备有限公司 | Wafer baking device |
| CN113617607A (en) * | 2021-07-30 | 2021-11-09 | 华进半导体(嘉善)有限公司 | Baking device and baking method |
| CN114678297A (en) * | 2022-03-11 | 2022-06-28 | 智程半导体设备科技(昆山)有限公司 | Semiconductor heating plate |
| CN115020300A (en) * | 2022-06-29 | 2022-09-06 | 江苏实为半导体科技有限公司 | Partitioned heating plate based on compound semiconductor equipment |
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| CN108630584A (en) * | 2018-05-11 | 2018-10-09 | 上海华力集成电路制造有限公司 | The heating device and method of coating developing machine |
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| JP2001052983A (en) * | 1999-08-09 | 2001-02-23 | Tokyo Electron Ltd | Heat treatment apparatus and method therefor |
| JP2004022805A (en) * | 2002-06-17 | 2004-01-22 | Tokyo Electron Ltd | Heat treatment device and heat treatment method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112349626A (en) * | 2020-09-28 | 2021-02-09 | 芯米(厦门)半导体设备有限公司 | Wafer baking device |
| CN112216634A (en) * | 2020-10-13 | 2021-01-12 | 宁波润华全芯微电子设备有限公司 | Progressive wafer baking method |
| CN113617607A (en) * | 2021-07-30 | 2021-11-09 | 华进半导体(嘉善)有限公司 | Baking device and baking method |
| CN113617607B (en) * | 2021-07-30 | 2023-03-14 | 华进半导体(嘉善)有限公司 | Baking device and baking method |
| CN114678297A (en) * | 2022-03-11 | 2022-06-28 | 智程半导体设备科技(昆山)有限公司 | Semiconductor heating plate |
| CN115020300A (en) * | 2022-06-29 | 2022-09-06 | 江苏实为半导体科技有限公司 | Partitioned heating plate based on compound semiconductor equipment |
| CN115020300B (en) * | 2022-06-29 | 2023-09-19 | 江苏实为半导体科技有限公司 | Partitioned heating plate based on compound semiconductor equipment |
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Application publication date: 20200811 |
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| RJ01 | Rejection of invention patent application after publication |