JPH0711984Y2 - 印字ヘッド - Google Patents

印字ヘッド

Info

Publication number
JPH0711984Y2
JPH0711984Y2 JP1988061387U JP6138788U JPH0711984Y2 JP H0711984 Y2 JPH0711984 Y2 JP H0711984Y2 JP 1988061387 U JP1988061387 U JP 1988061387U JP 6138788 U JP6138788 U JP 6138788U JP H0711984 Y2 JPH0711984 Y2 JP H0711984Y2
Authority
JP
Japan
Prior art keywords
chip
measurement
pad
print head
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988061387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01165247U (US06650917-20031118-M00005.png
Inventor
利幸 白崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP1988061387U priority Critical patent/JPH0711984Y2/ja
Publication of JPH01165247U publication Critical patent/JPH01165247U/ja
Application granted granted Critical
Publication of JPH0711984Y2 publication Critical patent/JPH0711984Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body

Landscapes

  • Electronic Switches (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1988061387U 1988-05-10 1988-05-10 印字ヘッド Expired - Lifetime JPH0711984Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988061387U JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988061387U JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Publications (2)

Publication Number Publication Date
JPH01165247U JPH01165247U (US06650917-20031118-M00005.png) 1989-11-17
JPH0711984Y2 true JPH0711984Y2 (ja) 1995-03-22

Family

ID=31287059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988061387U Expired - Lifetime JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Country Status (1)

Country Link
JP (1) JPH0711984Y2 (US06650917-20031118-M00005.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2563642B2 (ja) * 1990-04-26 1996-12-11 松下電器産業株式会社 サーマルヘッドおよびその抵抗値トリミング法
JP2001301219A (ja) * 2000-04-19 2001-10-30 Rohm Co Ltd サーマルプリントヘッド

Also Published As

Publication number Publication date
JPH01165247U (US06650917-20031118-M00005.png) 1989-11-17

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