JPH07108509B2 - Surface polishing method and apparatus - Google Patents
Surface polishing method and apparatusInfo
- Publication number
- JPH07108509B2 JPH07108509B2 JP61100438A JP10043886A JPH07108509B2 JP H07108509 B2 JPH07108509 B2 JP H07108509B2 JP 61100438 A JP61100438 A JP 61100438A JP 10043886 A JP10043886 A JP 10043886A JP H07108509 B2 JPH07108509 B2 JP H07108509B2
- Authority
- JP
- Japan
- Prior art keywords
- speed
- carrier
- rotation speed
- gear
- surface plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、ワークの両面を同時に加工する平面研磨方法
及び装置に関するものである。The present invention relates to a flat surface polishing method and apparatus for simultaneously processing both surfaces of a work.
［従来の技術］ 上下の定盤と内歯歯車及び太陽歯車を備え、両歯車によ
り遊星歯車状に駆動されるキャリヤに保持させたワーク
を上下の定盤により研磨するようにした平面研磨装置に
おいては、一般に、上下の定盤の回転速度とキャリヤの
公転速度との速度比を、 下定盤 ・・・・＋１ 上定盤 ・・・・−0.3333 キャリヤ ・・・・＋0.3333 なる関係を設定している。[Prior Art] A flat surface polishing apparatus having upper and lower surface plates, an internal gear and a sun gear, and a work held by a carrier driven in a planetary gear shape by both gears is polished by the upper and lower surface plates. Is generally the speed ratio between the rotation speed of the upper and lower surface plates and the revolution speed of the carrier, and the relationship is: lower surface plate ... +1 upper surface plate ...- 0.3333 carrier ... + 0.3333 is doing.
これは、下定盤の回転方向及びキャリヤの公転方向を
正、上定盤の回転方向を負とした場合、下定盤とキャリ
ヤとの速度比の差、及び上定盤とキャリヤとの速度比の
差がいずれも0.6666となるようにし、而して、ワークの
両面を等しく加工することができるようにするためであ
る。This is because when the rotation direction of the lower turn table and the revolving direction of the carrier are positive and the rotation direction of the upper turn table is negative, the difference in the speed ratio between the lower turn table and the carrier and the speed ratio between the upper turn table and the carrier are This is because all the differences are set to 0.6666, and both surfaces of the work can be processed equally.
ところが、従来では、第４図に示すように、上下の定盤
と内歯歯車及び太陽歯車の回転速度を上記速度比が得ら
れる一定の関係に固定し、それらを特定の回転数Ru,Rl,
Rs,Riまで上昇させてワークを研磨するようにしてお
り、そのため次に述べるような種々の問題があった。However, conventionally, as shown in FIG. 4, the rotation speeds of the upper and lower surface plates, the internal gear, and the sun gear are fixed in a fixed relationship such that the above speed ratio is obtained, and they are fixed at specific rotation speeds Ru, Rl. ,
The work is polished by raising it to Rs and Ri, which causes various problems as described below.
即ち、かかる平面研磨装置においては、加工時間を短縮
して加工能率の向上を図る場合、通常、パラメータとし
て回転速度か加工圧が選択されるが、定盤の回転速度を
上昇させる方法は、それに比例して研磨剤の飛散や振動
の発生等を生じ易く、しかも、動的精度の低下によって
加工精度が悪化するという問題があり、また、加工圧を
高める方法は、残留応力の増加やワークの破損、クラッ
ク等の発生を助長する方向に進み易い。That is, in such a surface polishing apparatus, in order to shorten the processing time and improve the processing efficiency, usually, the rotation speed or the processing pressure is selected as a parameter, but the method of increasing the rotation speed of the surface plate is There is a problem that abrasives are likely to scatter in proportion to the occurrence of vibration, and further, machining accuracy is deteriorated due to a decrease in dynamic accuracy, and a method of increasing machining pressure is to increase residual stress and work It is easy to proceed in a direction that promotes the occurrence of breakage and cracks.
従って、上記従来の加工方法では、加工精度を犠牲にし
て加工能率の向上を図るか、加工能率を犠牲にして加工
精度を維持するかのいずれかを選択しなければならず、
加工精度を維持した状態で加工能率を高めることは困難
であった。Therefore, in the above-described conventional processing method, it is necessary to select either one of improving the processing efficiency at the expense of the processing accuracy or maintaining the processing accuracy at the expense of the processing efficiency,
It was difficult to increase the machining efficiency while maintaining the machining accuracy.
［発明が解決しようとする問題点］ 本発明の課題は、定盤の回転速度や加工圧を上昇させる
ことなく、且つ、上下の定盤とキャリヤとの速度比を一
定の関係に保ったまま、該キャリヤの自転数を増大させ
ることによりワークと定盤との速度差即ち摺接長を増大
させ、而して、加工精度を維持した状態で加工能率の向
上を図ることにある。[Problems to be Solved by the Invention] An object of the present invention is to increase the rotational speed and processing pressure of a surface plate and to maintain a constant speed ratio between the upper and lower surface plates and a carrier. By increasing the number of rotations of the carrier, the speed difference between the work and the surface plate, that is, the sliding contact length is increased, thereby improving the machining efficiency while maintaining the machining accuracy.
［問題点を解決するための手段］ 上記課題を解決するため、本発明の平面研磨方法は、内
歯歯車及び太陽歯車で遊星歯車状に駆動されるキャリヤ
の公転速度と、該キャリヤに保持されたワークを研磨す
る上下の定盤の回転速度との速度比を、キャリヤの公転
速度に対する上定盤の回転速度と下定盤の回転速度との
差が互いに等しくなるような関係に設定し、上下の定盤
でワークの両面を均等に研磨する平面研磨方法におい
て、上記速度比を一定に保ったまま、内歯歯車及び太陽
歯車の回転速度を変化させてキャリヤの自転数を変える
ことにより、ワークと上下定盤との摺接長を制御するこ
とを特徴とするものである。[Means for Solving the Problems] In order to solve the above problems, the surface polishing method of the present invention is a revolving speed of a carrier that is driven in a planetary gear shape by an internal gear and a sun gear, and the carrier retained by the carrier. Set the speed ratio with the rotation speed of the upper and lower surface plates for polishing the workpiece so that the difference between the rotation speed of the upper surface plate and the rotation speed of the lower surface plate with respect to the revolution speed of the carrier becomes equal to each other. In the surface polishing method of uniformly polishing both surfaces of the work on the surface plate of, the work speed is kept constant by changing the rotation speed of the internal gear and the sun gear to change the rotation number of the carrier, It is characterized in that the sliding contact length between the upper and lower surface plates is controlled.
また、本発明の平面研磨装置は、キャリヤを遊星歯車状
に駆動する内歯歯車及び太陽歯車と、該キャリヤに保持
されたワークを研磨する上下の定盤と、キャリヤの公転
速度と上下の定盤の回転速度との速度比を、キャリヤの
公転速度に対する上定盤の回転速度と下定盤の回転速度
との差が互いに等しくなるような関係に保ったまま、両
歯車及び両定盤の駆動を制御する主制御器と、内歯歯車
または太陽歯車の回転速度を設定する速度設定器と、該
速度設定器で設定された一方の歯車の設定速度と上記速
度比とから、他方の歯車についての上記速度比を維持し
得る回転速度を演算し、それらの速度に応じた両歯車の
制御信号を出力する演算装置と、を備えたことを特徴と
するものである。Further, the flat surface polishing apparatus of the present invention comprises an internal gear and a sun gear for driving the carrier in a planetary gear shape, upper and lower surface plates for polishing the work held by the carrier, a revolution speed of the carrier and an upper and lower fixed surface. Driving both gears and both surface plates while keeping the speed ratio with the rotation speed of the board such that the difference between the rotation speed of the upper surface plate and the rotation speed of the lower surface plate relative to the revolution speed of the carrier becomes equal to each other. From the main controller for controlling the, the speed setting device for setting the rotation speed of the internal gear or the sun gear, and the setting speed of the one gear set by the speed setting device and the speed ratio, the other gear And a computing device that computes a rotation speed capable of maintaining the above speed ratio and outputs a control signal for both gears according to those speeds.
［作 用］ 上記構成を有する平面研磨装置において、キャリヤは太
陽歯車及び内歯歯車により遊星歯車状に駆動され、該キ
ャリヤに保持されたワークが上下の定盤により研磨され
る。[Operation] In the flat-surface polishing apparatus having the above structure, the carrier is driven in a planetary gear shape by the sun gear and the internal gear, and the work held by the carrier is ground by the upper and lower surface plates.
このとき、両歯車及び両定盤の回転速度は、キャリヤの
公転速度と上下の定盤の回転速度との速度比が、キャリ
ヤの公転速度に対する上定盤の回転速度と下定盤の回転
速度との差が互いに等しくなるような関係に設定されて
おり、その関係を保ったまま太陽歯車及び内歯歯車の回
転速度の制御が行われ、キャリヤの自転速度が増大す
る。At this time, the rotational speeds of both gears and both surface plates are such that the speed ratio between the revolution speed of the carrier and the rotation speeds of the upper and lower surface plates is the rotational speed of the upper surface plate and the lower surface plate with respect to the revolution speed of the carrier. Are set to be equal to each other, and the rotational speeds of the sun gear and the internal gear are controlled while maintaining this relationship, so that the rotation speed of the carrier increases.
これによって、該キャリヤに保持されたワークと定盤と
の速度差が増大し、それらの摺接距離が増大するため、
研磨時間が短縮されて研磨能率が向上する。This increases the speed difference between the work held on the carrier and the surface plate, and increases the sliding contact distance between them,
The polishing time is shortened and the polishing efficiency is improved.
［実施例］ 以下、本発明の実施例を図面を参照しながら詳述する。Embodiments Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図に示す平面研磨装置は、上下の定盤11,12と太陽
歯車13、及び内歯歯車14を備え、両歯車13,14で遊星歯
車状に駆動されるキャリヤ15に保持させたワーク16を上
下の定盤11,12で研磨するように構成したもので、これ
らの定盤11,12と太陽歯車13及び内歯歯車14における駆
動軸11a,12a,13a,14aの下端にはそれぞれスプロケット1
7,18,19,20が取付けられ、これらのスプロケットがモー
タ21,22,23に接続されており、これらの各モータは制御
装置24に接続されている。The plane polishing apparatus shown in FIG. 1 includes upper and lower surface plates 11 and 12, a sun gear 13, and an internal gear 14, and a workpiece 15 held by a carrier 15 driven by both gears 13 and 14 in a planetary gear shape. 16 is configured to be polished by the upper and lower surface plates 11 and 12, and the lower ends of the drive shafts 11a, 12a, 13a and 14a in these surface plates 11 and 12 and the sun gear 13 and the internal gear 14, respectively. Sprocket 1
7,18,19,20 are mounted, these sprockets are connected to motors 21,22,23, each of these motors being connected to a controller 24.
なお、上定盤11は、図示しないシリンダにより昇降自在
に支持され、図示した下降位置において上記駆動軸11a
の上端のドライバ11bに係合するようになっている。The upper platen 11 is supported by a cylinder (not shown) so as to be able to move up and down, and in the lowered position shown, the drive shaft 11a is
It is adapted to engage with the driver 11b at the upper end of the.
上記制御装置24は、第２図に具体的に示すように、各モ
ータ21,22,23の回転を制御するコントローラ25,26,27
と、これらのコントローラを制御する主制御器28と、両
歯車13,14の回転速度を変化させることによってキャリ
ヤ15の自転数を制御する自転数制御装置29とで構成され
ている。The control device 24, as specifically shown in FIG. 2, is a controller 25, 26, 27 for controlling the rotation of each motor 21, 22, 23.
And a main controller 28 that controls these controllers, and a rotation speed control device 29 that controls the rotation speed of the carrier 15 by changing the rotation speeds of both gears 13 and 14.
上記主制御器28は、上下の定盤11,12の回転速度とキャ
リヤ15の公転速度との速度比を前述したような関係、即
ち、 下定盤：上定盤：キャリヤ ＝＋1:−0.3333:＋0.3333 に保ったまま、上記各コントローラ25,26,27を介して両
定盤11,12及び両歯車13,14を定常回転速度まで昇降させ
るものである。The main controller 28 has the above-described relationship between the rotational speeds of the upper and lower surface plates 11 and 12 and the revolution speed of the carrier 15, that is, lower surface plate: upper surface plate: carrier = + 1: -0.3333: While maintaining +0.3333, both surface plates 11, 12 and both gears 13, 14 are moved up and down to the steady rotation speed through the above controllers 25, 26, 27.
また、自転数制御装置29は、両定盤11,12とキャリヤ15
との速度比が上述の関係を保ち得る範囲内において太陽
歯車13と内歯歯車14の回転速度を変化させ、それによっ
てキャリヤ15の自転速度を制御するもので、太陽歯車13
または内歯歯車14の回転速度を設定するための速度設定
器31と、上記速度比と該速度設定器31で設定された一方
の歯車の設定速度とから、他方の歯車についての上記速
度比を維持し得る回転速度を演算により求め、それらの
回転速度に応じた制御信号をコントローラ26,27に出力
する演算装置32とで構成されている。Further, the rotation speed control device 29 includes both the surface plates 11, 12 and the carrier 15
The rotation speed of the sun gear 13 and the internal gear 14 is changed within a range in which the speed ratio of the sun gear 13 can maintain the above relationship, and the rotation speed of the carrier 15 is thereby controlled.
Or, from the speed setter 31 for setting the rotation speed of the internal gear 14, and the set speed of one gear set by the speed ratio and the speed setter 31, the speed ratio for the other gear is set. It is composed of an arithmetic unit 32 that calculates the maintainable rotation speed and outputs a control signal corresponding to the rotation speed to the controllers 26 and 27.
ここで、上記キャリヤ15の自転数制御についてさらに具
体的に説明する。Here, the rotation number control of the carrier 15 will be described more specifically.
いま、下定盤12の回転速度を基準として、 内歯歯車の歯数 ・・・Zi 内歯歯車の下定盤に対する速度比 ・・・Pi 太陽歯車の歯数 ・・・Zs 太陽歯車の下定盤に対する速度比 ・・・Ps キャリヤの公転軌道 上における仮想歯数 ・・・Zc キャリヤ公転速度の 下定盤に対する速度比 ・・・Pc （下定盤の回転速度を１とするとPc＝0.3333） とすると、各歯車13,14の回転速度とキャリヤ15の公転
速度との間には、 なる関係がある。従って、 となる。Now, based on the rotation speed of the lower platen 12, the number of teeth of the internal gear ・ ・ ・ Zi The speed ratio of the internal gear to the lower platen ・ ・ ・ Pi The number of teeth of the sun gear ・ ・ ・ Zs The lower platen of the sun gear Speed ratio ・ ・ ・ Ps Number of virtual teeth on the revolution path of the carrier ・ ・ ・ Zc Speed ratio of the carrier revolution speed to the lower surface plate ・ ・ ・ Pc (Pc = 0.3333 when the rotation speed of the lower surface plate is 1) Between the rotation speed of the gears 13 and 14 and the revolution speed of the carrier 15, There is a relationship. Therefore, Becomes
これは、この（１）式を満足する範囲内で太陽歯車13及
び内歯歯車14の回転速度を変化させても、上記定盤11,1
2とキャリヤ15との速度比の関係は変わらないことを意
味している。This is because even if the rotation speeds of the sun gear 13 and the internal gear 14 are changed within the range that satisfies the formula (1),
This means that the relationship of the speed ratio between 2 and the carrier 15 does not change.
そこで、上記（１）式を演算装置32に入力しておき、速
度設定器31にいずれかの歯車11,12の設定速度が入力さ
れたとき、この（１）式から他方の歯車12,11の速度が
演算により求められ、これらの速度に応じて太陽歯車13
及び内歯歯車14の回転速度が制御されるようにしておけ
ば、上下の定盤11,12の回転速度とキャリヤ15の公転速
度との速度比を一定の関係に保ったまま、キャリヤ15の
自転数のみを増大させることができ、これによって、ワ
ーク16と定盤11,12との摺接距離を増大させて研磨能率
の向上を図ることができる。Therefore, when the equation (1) is input to the arithmetic unit 32 and the set speed of one of the gears 11 and 12 is input to the speed setter 31, the other gears 12 and 11 are calculated from the equation (1). The speed of the sun gear 13 is calculated according to these speeds.
By controlling the rotation speed of the internal gear 14 and the internal gear 14, the carrier 15 of the carrier 15 is maintained while maintaining a constant speed ratio between the rotation speeds of the upper and lower surface plates 11 and 12 and the revolution speed of the carrier 15. Only the number of rotations can be increased, whereby the sliding distance between the work 16 and the surface plates 11 and 12 can be increased, and the polishing efficiency can be improved.
上記構成を有する平面研磨装置において、制御装置24に
より上下の定盤11,12及び両歯車13,14が駆動されると、
これらの歯車13,14によりキャリヤ15は遊星歯車状に駆
動され、該キャリヤ15に保持されたワーク16は上下の定
盤11,12により研磨される。In the surface polishing apparatus having the above configuration, when the control device 24 drives the upper and lower surface plates 11, 12 and both gears 13, 14,
The carrier 15 is driven in the shape of a planetary gear by these gears 13 and 14, and the work 16 held by the carrier 15 is ground by the upper and lower surface plates 11 and 12.
第３図Ａ、Ｂは、上記平面研磨装置の動作特性を、キャ
リヤ15を正転させる場合と逆転させる場合とについて示
したものである。FIGS. 3A and 3B show the operating characteristics of the above-described flat polishing apparatus when the carrier 15 is normally rotated and when it is reversed.
キャリヤ15が正転される場合を示す図Ａにおいて、主制
御器28により各コントローラ25,26,27を介してモータ2
1,22,23が駆動されると、T1時間後に両定盤11,12及び両
歯車13,14が所定の回転速度Ru,Rl,Rs,Riに到達する。こ
のとき、両定盤11,12及び両歯車13,14の回転速度は、上
下の定盤11,12の回転速度とキャリヤ15の公転速度との
速度比が前述した関係を保つように設定されている。In FIG. A, which shows the case where the carrier 15 is rotated in the normal direction, the motor 2 is controlled by the main controller 28 via the controllers 25, 26, 27.
When 1,22,23 are driven, both surface plates 11,12 and both gears 13,14 reach predetermined rotation speeds Ru, Rl, Rs, Ri after 1 hour T. At this time, the rotation speeds of both surface plates 11 and 12 and both gears 13 and 14 are set so that the speed ratio between the rotation speeds of the upper and lower surface plates 11 and 12 and the revolution speed of the carrier 15 maintains the above-mentioned relationship. ing.
定常回転数に到達してT2時間が経過すると、主制御器28
からの指令により、太陽歯車13及び内歯歯車14の速度制
御が自転数制御装置29を通じての制御に切換わり、太陽
歯車13の回転速度が速度設定器31に予め設定されている
設定速度Rmに従って減少していき、それと同時に、内歯
歯車14の回転速度が演算装置32で求められた速度Rnに従
って増大していく。When the steady speed is reached and T 2 time elapses, the main controller 28
Command from, the speed control of the sun gear 13 and the internal gear 14 is switched to control through the rotation speed control device 29, the rotation speed of the sun gear 13 according to the set speed Rm preset in the speed setter 31. At the same time, the rotational speed of the internal gear 14 increases in accordance with the speed Rn calculated by the arithmetic unit 32.
両歯車13,14の速度がRm,Rnとなった状態でT3時間研磨が
行われると、自転数制御装置29による速度制御が解除さ
れ、太陽歯車13及び内歯歯車14は再び主制御器28によっ
て最初の速度Rs,Riに復帰せしめられ、さらにT4時間後
に研磨が終了すると、装置は徐々に減速されて停止す
る。When polishing is performed for T 3 hours while the speeds of both gears 13 and 14 are Rm and Rn, the speed control by the rotation speed control device 29 is released, and the sun gear 13 and the internal gear 14 are again the main controller. It is returned to the initial speed Rs, Ri by 28, and when polishing is completed after T 4 hours, the apparatus is gradually decelerated and stopped.
キャリヤ15を逆転させる場合には、第３図Ｂに示すよう
に、太陽歯車13と内歯歯車14との速度の大小関係は逆に
なる。When the carrier 15 is reversed, the speed relationship between the sun gear 13 and the internal gear 14 is reversed, as shown in FIG. 3B.
従って、速度設定器31には、キャリヤが正転する場合と
逆転する場合についての２種類の速度が設定されること
になる。Therefore, the speed setter 31 is set with two kinds of speeds when the carrier rotates forward and when the carrier rotates in reverse.
［発明の効果］ このように本発明によれば、上下の定盤の回転速度とキ
ャリヤの公転速度との速度比を、キャリヤの公転速度に
対する上下両定盤の回転速度差が互いに等しい一定の関
係に保ったまま、上下定盤の回転速度や加工圧等は変え
ることなく、キャリヤの自転数のみを変化させてワーク
と上下の定盤との摺接長を制御するようにしたので、上
下定盤の回転速度を上昇させる場合のような研磨材の飛
散や振動の発生といった問題や、加工圧を高める場合の
ような残留応力の増加やワークの破損、クラックの発生
といった問題を何ら生じることなく、ワークと上下定盤
との摺接長を増大させて、加工精度を維持したまま加工
能率の向上を図ることができる。[Effects of the Invention] As described above, according to the present invention, the speed ratio between the rotation speeds of the upper and lower surface plates and the revolution speed of the carrier is set to a constant value such that the rotation speed difference between the upper and lower surface plates is equal to the revolution speed of the carrier. While keeping the relationship, the sliding speed between the work and the upper and lower surface plates is controlled by changing only the rotation speed of the carrier without changing the rotation speed and processing pressure of the upper and lower surface plates. Any problems such as scattering of abrasives and vibration when increasing the rotation speed of the surface plate, increase of residual stress such as when increasing the processing pressure, damage to the work and cracks Instead, it is possible to increase the sliding contact length between the work and the upper and lower surface plate, and improve the machining efficiency while maintaining the machining accuracy.
第１図は本発明に係る平面研磨装置の一実施例を示す縦
断面図、第２図は制御装置の構成図、第３図A,Bは上記
平面研磨装置の正転時と逆転時における動作特性図、第
４図は従来の平面研磨装置の動作特性図である。 11……上定盤、12……下定盤、 13……太陽歯車、14……内歯歯車、 15……キャリヤ、16……ワーク、 28……主制御器、31……速度設定器、 32……演算装置。FIG. 1 is a vertical cross-sectional view showing an embodiment of a flat surface polishing apparatus according to the present invention, FIG. 2 is a block diagram of a control apparatus, and FIGS. FIG. 4 is an operating characteristic diagram of the conventional flat polishing apparatus. 11 …… Upper surface plate, 12 …… Lower surface plate, 13 …… Sun gear, 14 …… Internal gear, 15 …… Carrier, 16 …… Workpiece, 28 …… Main controller, 31 …… Speed setter, 32 …… Calculator.
Claims (2)
されるキャリヤの公転速度と、該キャリヤに保持された
ワークを研磨する上下の定盤の回転速度との速度比を、
キャリヤの公転速度に対する上定盤の回転速度と下定盤
の回転速度との差が互いに等しくなるような関係に設定
し、上下の定盤でワークの両面を均等に研磨する平面研
磨方法において、 上記速度比を一定に保ったまま、内歯歯車及び太陽歯車
の回転速度を変化させてキャリヤの自転数を変えること
により、ワークと上下定盤との摺接長を制御する、 ことを特徴とする平面研磨方法。1. A speed ratio between the revolution speed of a carrier driven by an internal gear and a sun gear in a planetary gear shape and the rotation speed of upper and lower surface plates for polishing a work held by the carrier,
A plane polishing method in which the difference between the rotation speed of the upper surface plate and the rotation speed of the lower surface plate with respect to the revolution speed of the carrier is set to be equal to each other, and both surfaces of the work are uniformly polished by the upper and lower surface plates, It is characterized in that the sliding contact length between the work and the upper and lower surface plate is controlled by changing the rotation speed of the internal gear and the sun gear while changing the rotation speed of the carrier while keeping the speed ratio constant. Surface polishing method.
及び太陽歯車と、 該キャリヤに保持されたワークを研磨する上下の定盤
と、 キャリヤの公転速度と上下の定盤の回転速度との速度比
を、キャリヤの公転速度に対する上定盤の回転速度と下
定盤の回転速度との差が互いに等しくなるような関係に
保ったまま、両歯車及び両定盤の駆動を制御する主制御
器と、 内歯歯車または太陽歯車の回転速度を設定する速度設定
器と、 該速度設定器で設定された一方の歯車の設定速度と上記
速度比とから、他方の歯車についての上記速度比を維持
し得る回転速度を演算し、それらの速度に応じた両歯車
の制御信号を出力する演算装置と、 を備えたことを特徴とする平面研磨装置。2. An internal gear and a sun gear for driving a carrier in a planetary gear shape, upper and lower surface plates for polishing a work held by the carrier, a revolution speed of the carrier and a rotation speed of the upper and lower surface plates. The main control that controls the drive of both gears and both surface plates while maintaining the relationship that the difference between the rotation speed of the upper surface plate and the rotation speed of the lower surface plate relative to the revolution speed of the carrier becomes equal to each other. And a speed setter for setting the rotation speed of the internal gear or the sun gear, and the set speed of one gear set by the speed setter and the speed ratio, the speed ratio of the other gear A planar polishing apparatus comprising: a calculation device that calculates a rotation speed that can be maintained and outputs a control signal for both gears according to the rotation speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61100438A JPH07108509B2 (en) | 1986-04-30 | 1986-04-30 | Surface polishing method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61100438A JPH07108509B2 (en) | 1986-04-30 | 1986-04-30 | Surface polishing method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62255063A JPS62255063A (en) | 1987-11-06 |
| JPH07108509B2 true JPH07108509B2 (en) | 1995-11-22 |
Family
ID=14273946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61100438A Expired - Lifetime JPH07108509B2 (en) | 1986-04-30 | 1986-04-30 | Surface polishing method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07108509B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102990504A (en) * | 2011-09-16 | 2013-03-27 | 硅电子股份公司 | Method for the simultaneous double-side material-removing processing of at least three workpieces |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07308855A (en) * | 1995-06-08 | 1995-11-28 | Fujikoshi Mach Corp | Lapping method and lapping surface plate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603948B2 (en) * | 1975-09-16 | 1985-01-31 | 日本電信電話株式会社 | polishing equipment |
| JPS55125977A (en) * | 1979-10-04 | 1980-09-29 | Hamai Sangyo Kk | 4-direction lapping machine |
-
1986
- 1986-04-30 JP JP61100438A patent/JPH07108509B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102990504A (en) * | 2011-09-16 | 2013-03-27 | 硅电子股份公司 | Method for the simultaneous double-side material-removing processing of at least three workpieces |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62255063A (en) | 1987-11-06 |
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