JPS603948B2 - polishing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polishing device for simultaneously polishing both sides of a fixed surface smooth in an abrasive.

Conventional polishing machines that simultaneously process both sides of the workpiece include a device that polishes the workpiece held in a carrier by moving it in a planetary motion between two upper and lower polishing plates. Since it is installed at the bottom of the device at a position lower than the height of the polishing dish, it was impossible to polish it while immersing it in the polishing agent. Therefore, medium abrasive polishing is
A common method is to glue the workpiece to a polishing plate and rub it against a polishing plate soaked in an abrasive, for example using a lens polisher which requires skill to operate, and both sides are simultaneously rubbed with the abrasive. It has been considered difficult to process it inside. In order to solve these drawbacks, the present invention drives the polishing plate and the workpiece from the top of the device, provides equal and uniform relative movement to the polishing plate on both the upper and lower surfaces of the workpiece, and also provides a method for polishing the abrasive. The container has been improved to allow for smooth dispersion and circulation of particles, and is said to be capable of both mid-abrasive polishing and double-sided simultaneous polishing.The drawings will be explained in detail below.

FIG. 1 is a side view of one embodiment of the present invention.

22 is a lower base to which the container 21 is fixed.

A polishing plate, a workpiece, etc. are housed in this container 21. Further, an upper base 9 is supported by a support 27 provided on the lower base 22, and a motor 28, pulleys 1, 2, and other pressurizing systems such as a polishing device drive system and a pressurizing lever 16 are supported on the upper base 9. . A holder 7 holds the bearing of the pulley 2 and is fixed to the upper base 9.

10 is a driving shaft for the upper polishing plate, which will be explained later, and 11 is a bearing thereof.

FIG. 2 is a diagram for explaining the main parts of this embodiment, and is a perspective view including a partial cutout, with the support column 27, upper base 9, etc. in FIG. 1 omitted, and with the holder 7 removed. be. FIG. 3 is a vertical cross-sectional view of a drive shaft portion for rotationally driving a workpiece and a polishing plate. Pulleys 1 and 2 drive a carrier 4 that holds a workpiece 3.

The workpiece 3 is suspended in a workpiece holding hole provided in the carrier 4 and interlocks with the carrier 4. The pulley 1 is fixed to a carrier drive shaft 5, and rotates the carrier 4 on its own axis.On the other hand, the pulley 2 is used for the revolution of the carrier 4, and a bearing 6 is located eccentrically from the center of the pulley 2, and the carrier drive shaft 5 is fitted, allowing the carrier 4 to rotate eccentrically. 7 is a holder for holding the bearing 8 of the pulley 2, and is fixed to the upper base 9.

The shaft for driving the upper polishing plate has a gear 10' attached to the upper part thereof, and rotates in a bearing 11 provided on the upper base 9.

10' is a chain or belt that rotates gear IQ'.

Reference numerals 12 and 13 are annular upper and lower polishing plates, respectively, and the workpiece 3 sandwiched between them is held by a carrier 4.

Among these tools, the rotation of the carrier 4 and the upper polishing plate 12 is transmitted through the drive shafts 6 and 1, respectively. In order to facilitate replacement and installation, the upper polishing plate 12 is not directly connected to the driving shaft 1, but is connected to the shaft 10 via an upper polishing plate rotation rotor 14. The upper polishing plate rotating pick 14 is a cylinder having a disk-shaped portion 14' at the lower part, and a lower part of the driving shaft having an amount of 0 is installed in the center hole of the cylinder in the circumferential direction so as to be movable in all directions. is fixedly inserted, and the rotation of the shaft 10 is transmitted to the sleeve 14. Further, the disk portion 14' is provided with two protrusions 15, which are inserted into two holes on the upper surface of the upper polishing plate 12, and the rotation of the drive shaft 10 is controlled by the rotation of the upper polishing plate. It is transmitted to the upper polishing plate via the pick-up tool 14. A recess is provided at the top of the jig 14, and an annular thrust bearing 17 is housed in the recess. 16 is a pressure lever,
Its tip 16' is placed on the thrust bearing 17,
The other end 16' of the pressurizing lever i6 is connected by a wire 18 to a loading portion 20' for a weight I9, and the load on the upper polishing plate can be adjusted by the weight. Since the load is applied via the thrust bearing 17, the rotation of the rotary holder 14 is not affected by the load. Further, since the lower part of the pick-up tool 14 is a disk-shaped portion 14' having a large area, the load is uniformly applied to the upper polishing plate 12. Reference numeral 21 denotes a container fixed to a lower base 22, to which is fixed an annular lower polishing plate 13, and the bottom in contact with the polishing plate 13 is provided with a cross-shaped groove 23 which is longer than the diameter of the polishing plate.

24, 24' are abrasive inflow/outlets, of which the opening 24 communicates with the cross-shaped groove 23 at the inlet. As an accessory device, reference numeral 25 indicates a pipe connected to an abrasive circulation pump 26, which also makes it possible to control the temperature of the abrasive. The container 21 is filled with abrasive to about the level of the upper polishing plate 12, but the parts that come into direct contact with the abrasive are made of corrosion-resistant material, such as the container 21, the upper polishing plate rotation tool 141, vinyl chloride, and the carrier 4. polycarbonate,
The upper and lower polishing plates 12 and 13 are made of synthetic resin such as vinyl chloride or Teflon, and the carrier drive shaft 5 and the upper polishing plate drive shaft 10 are made of stainless steel.If they are coated with Teflon, etc., strong acids and strong alkalis can be removed. can be used as an abrasive.

Incidentally, since the upper lid can be easily attached to the container 21, it is possible to prevent the abrasive from escaping to the outside of the container 21. In this embodiment, the lower polishing plate 13 is fixed to the container 21, and the upper polishing plate 12 and carrier 4 rotate in the same direction, with a rotation ratio of approximately 2:1.

In order to ensure flatness of the polishing plate and workpiece 3,
The carrier drive shaft 5 is eccentrically rotated by a pulley 2 by several degrees so that it protrudes from the polishing plate several times as the workpiece 3 moves. Its revolution is 1/1 per rotation of carrier 4
It has 5 rotations. Without considering the eccentric revolution of the carrier 4, if the rotation ratio between the upper polishing plate 12 and the carrier 4 is set to 2:1, the relative speed relationships between the upper polishing plate 12 and the carrier 4 and between the carrier 4 and the lower polishing plate 13 will be equal. The polishing resistance applied to the workpiece 3 is canceled out between the upper and lower polishing plates 12 and 13, and there is almost no load on the carrier 4. Even if the workpiece 3 is loosely placed in the holding hole of the carrier 4, the polishing resistance on both the upper and lower surfaces remains balanced. If the eccentric revolution of the carrier 4 is large, this balance will be disrupted, but as mentioned above, the amount of eccentricity is small, and the revolution speed is smaller than the rotation speed, so the rotation speed ratio of the upper polishing plate 12 and the carrier 4 is approximately the same. By setting the ratio to 2:1, the load on the carrier 4 can be made very small. Upper polishing plate 12, workpiece 3
When the carrier 4 rotates in the abrasive, the abrasive in the container 21 is flowed around by centrifugal force, and the liquid level becomes a paraboloid of rotation. Groove 23
Since the abrasive passes through and returns to the hollow part of the inner diameter of the lower polishing plate 13, circulation of the abrasive is improved. Abrasive inlet and outlet 24, 24'
The effect is even greater if an abrasive circulation pump coupled to the abrasive pump is used. Of course, the above effect can also be obtained by providing the lower polishing plate itself, for example, with grooves or holes between the inner and outer plates. It goes without saying that this device can also be used for general double-sided simultaneous polishing, which cannot be done in the presence of an abrasive. Note that the machining pressure is controlled by the pressure lever 16.
Since the pressure is applied from above using the weight 19, the necessary pressure can be freely obtained without stopping the device. Next, a specific example will be explained.

Specific example 1 Six GGG single crystals with a diameter of 300 mm are used as workpieces, and AI
203 (IA, 0.06 mm) Cr203 (0.2 mm) or other abrasive grains and water are used as abrasive agents (1 t%), and a polishing plate with a cloth attached is used at a pressure of 50 to 300 mm/ground. When polishing was carried out at a polishing speed of 20 to 40 kites/min, uniform and smooth interfaces with few edges were secured on both sides, and the thickness of the carrier was 200 mm and the thickness of the workpiece was 21 mm.
It was possible to sufficiently polish both sides of a thin piece of the same size as a zero-mounted machine at the same time.

Specific Example 2 Under the same conditions as in Specific Example 1, for example, after 20 minutes of polishing, the liquid temperature of the abrasive increased by 10 qo or more due to frictional heat.

Therefore, when the abrasive was mixed with an etching liquid ratio S04 (3N) solution for the workpiece, the chemical elution effect was increased, and the processing amount was 2 to 5 times that when no etching liquid was mixed. If it is necessary to actively raise the abrasive temperature further, this can be done by warming the pipe 25. In order to have reproducibility in the amount of abrasive, the pipe 25 was cooled with water, and it was found that a constant temperature (soil 0.500 It was also possible to maintain the Specific example 3 The rotation ratio between the rotation of the upper polishing plate 12 and the rotation of the carrier 4 is 2:
The upper and lower surfaces could be polished evenly even when the polishing ratio was 0.5 to 1.5.

Concrete Example 4: In order to examine the effectiveness of the abrasive circulation groove in this device, the groove was covered with tape and the abrasive precipitated around it, but when the tape was removed, the abrasive circulated very well. Therefore, the grooves were effective in medium abrasive polishing on both sides at the same time.

As explained above, the present invention minimizes the polishing resistance exerted on the carrier holding the workpiece by fixing the lower polishing plate and rotating the carrier and the upper polishing plate in the same direction at an appropriate rotation ratio. This is an apparatus for simultaneously polishing both surfaces in an abrasive that can be made small, and by making the rotation of the carrier eccentric, it is possible to maintain flatness on the surface of the polishing plate, thereby increasing the flatness of the workpiece. Note that the abrasive can be circulated without being precipitated by grooves or holes for circulating the abrasive between the outer diameter and the inner diameter of the annular polishing dish provided on the bottom of the container or in the polishing dish. It is also possible to control the temperature of the abrasive.
Furthermore, since it has a rust-proof structure, it can be applied to chemical polishing and mechanochemical polishing using alkaline or acidic solutions, and it can provide a uniform and smooth surface to both sides of the workpiece, making processing more efficient and economical. There are advantages to doing so.

[Brief explanation of the drawing]

FIG. 1 is a side view of one embodiment of the apparatus of the present invention, FIG. 2 is a partially cutaway perspective view thereof, and FIG. 3 is a vertical sectional view of the drive shaft portion of FIG. 1. 1, 2... Pulley, 3... Workpiece, 4...
...Carrier, 5...Carrier drive shaft, 6...Bearing, 7...Holder, 8
...Bearing, 9...Top base, 10...
...Upper polishing plate drive shaft, 11...Bearing, 12...Upper polishing plate, 13...Lower polishing plate, 14...Top Waste odor for rotating polishing plates, 15...
...Protrusion, 16... Pressure lever, 17...
...Thrust bearing, 18...Wire, 1
9... Weight, 20... Weight loading section, 21
...Container, 22...Lower base L 23...
(For abrasive circulation) Groove, 24... Abrasive inlet/outlet, 2
5... Pipe, 26... Abrasive circulation pump, 27... Support column, 28... Motor. Tsutomu 3 Figure Tsutomu/Figure Sakai 2 Figure

Claims (1)

[Claims] 1. A workpiece held in a carrier is sandwiched between an annular upper polishing plate and a lower polishing plate, a predetermined pressure is applied, and the workpiece and polishing plate are moved relative to each other. In this polishing device, the lower polishing plate is fixed to the container, and the upper polishing plate has a hollow part. An upper polishing plate driving shaft is connected to the upper polishing plate driving shaft, and a first transmission member is provided above the upper polishing plate driving shaft for transmitting the rotation of the motor to the upper polishing plate driving shaft. A carrier driving shaft is fixed to the carrier passing through the upper polishing plate driving shaft, and the upper part of the carrier driving shaft causes the carrier to eccentrically revolve in the same direction as the upper polishing plate by rotation of a motor. The second transmission member is automatically held at a position slightly eccentric from its axis, and the rotation of the motor is transmitted to a part of the carrier drive shaft to move the carrier drive shaft to the second transmission member. Approximately 1/1 in the same direction as the polishing plate
A third transmission member that rotates at a rotation ratio of 2 is provided, and a groove or hole is provided at the bottom of the container or between the inner and outer diameters of the lower polishing plate, through which the abrasive can circulate. A polishing device featuring: 2. A workpiece held in a carrier is sandwiched between an annular upper polishing plate and a lower polishing plate, a predetermined pressure is applied, the workpiece and the polishing plate are moved relative to each other, and they are processed. In a polishing device that performs polishing by immersing it in a container containing an abrasive in which abrasive grains are dispersed in liquid, the lower polishing plate is fixed to the container, and a hollow upper polishing plate for driving the upper polishing plate is attached to the upper polishing plate. A first transmission member for transmitting the rotation of the motor to the upper abrasive plate driving shaft is provided on the upper part of the upper abrasive plate driving shaft, and the upper abrasive plate drive shaft is connected to the upper abrasive plate drive shaft. A carrier drive shaft is fixed through the plate drive shaft, and a second transmission member is provided on the upper part of the carrier drive shaft to eccentrically revolve the carrier in the same direction as the upper polishing plate by rotation of a motor. The rotation of the motor is transmitted to a part of the carrier drive shaft so that the carrier drive shaft is rotated in the same direction as the upper polishing plate. almost 1
A third transmission member is provided that rotates at a rotation ratio of /2, and a groove or hole is provided at the bottom of the container or between the inner and outer diameters of the lower polishing plate, through which the abrasive can circulate. . A polishing device, characterized in that an abrasive circulation pump and a pipe connected to the groove or hole to control the temperature of the abrasive are provided outside the container.