JPH0696992A - Multilayer electronic component, production method thereof, and characteristics measuring method therefor - Google Patents

Abstract

PURPOSE:To make fine the arranging pitch without requiring any special step for providing an external electrode. CONSTITUTION:In a mother laminate 14 where a plurality of insulating sheets are laminated through conductive films 23, 24, via holes 19 filled with conductive material 18 are provided at positions being separated through cutting. The conductive material 18 provides an external electrode 12 for individual multilayer electronic component 10 obtained through cutting of the mother laminate 14. This constitution allows efficient measurement of characteristics of individual multilayer electronic components under the state of mother laminate without requiring any special step for forming the external electrode 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component having internal circuit elements arranged therein, a method of manufacturing the same, and a characteristic measuring method thereof, and more particularly, to improvement of a mode of forming external electrodes in the laminated electronic component. Is.

[0002]

2. Description of the Related Art A multilayer electronic component represented by, for example, a multilayer capacitor, a multilayer inductor, a multilayer circuit board, and a multilayer composite electronic component has a plurality of internal circuit elements such as a conductive film and / or a resistance film. And a laminated body formed by laminating the insulating sheets. As an insulating sheet,
Ceramic sheets are typically used.

FIG. 15 is a perspective view showing the appearance of a conventional laminated electronic component 1. The laminated electronic component 1 includes a laminated body 2 in which a plurality of insulating sheets are laminated with an internal circuit element (not shown) interposed. External electrodes 3 are formed on, for example, four side surfaces of the laminate 2.
These external electrodes 3 are electrically connected to internal circuit elements located inside the laminated body 2. The external electrode 3 is formed by applying a suitable metal paste to specific positions on each side surface of the laminate 2, but at this time, the external electrode 3 is necessarily formed on the upper and lower surfaces of the laminate 2. Part of it will extend around.

FIG. 16 is a perspective view showing the appearance of another conventional type of laminated electronic component 4. This laminated electronic component 4 also
A laminated body 5 is formed by laminating a plurality of insulating sheets with an internal circuit element (not shown) interposed. External electrodes 6 electrically connected to the internal circuit elements are formed on, for example, four side surfaces of the stacked body 5. These external electrodes 6
Is given by dividing the through hole 7 as shown by an imaginary line in FIG. That is, through holes 7 are formed in a mother laminated body prepared so that a plurality of laminated electronic components 4 can be obtained by cutting along a predetermined cutting line, and the external electrodes 6 are formed on the inner peripheral surface thereof. After forming the conductive film, the mother laminated body is cut so as to divide the through holes 7. Even in such a laminated electronic component 4, a part of the external electrode 6 extends in the circumferential direction to the upper and lower surfaces of the multilayer body 5 due to the method of forming the conductive film to be the external electrode 6.

These laminated electronic components 1 and 4 are chip-shaped and surface-mounted on an appropriate circuit board via external electrodes 3 and 6.

[0006]

However, in any of the above-described laminated electronic components 1 and 4, the external electrodes 3 and 6 are formed so as to extend to the upper and lower surfaces of the laminated bodies 2 and 5, respectively. Therefore, when another component is mounted on either the upper or lower surface or the upper or lower surface of the laminated electronic components 1 and 4 to form a composite, the area where such another component can be arranged is restricted. To be done.

Further, the portions of the external electrodes 3 and 6 extending to the upper and lower surfaces of the laminated bodies 2 and 5 prevent the external electrodes 3 and 6 from being arranged at a fine pitch. Further, since it is relatively difficult to make the size and shape of the portions of the external electrodes 3 and 6 that extend to the upper and lower surfaces as described above relatively constant,
This also prevents the arrangement pitch of the external electrodes 3 and 6 from being made fine.

Further, in particular, the laminated electronic component 4 shown in FIG.
In this case, the through holes 7 are drilled, but it is difficult to reduce the diameter at that time to less than 0.3 mm, which also restricts the arrangement pitch of the external electrodes 6. In addition, the life of the drill for forming the through hole 7 is relatively short, so that
This leads to an increase in costs.

Further, in the case of the laminated electronic component 1 shown in FIG. 15, since the external electrodes 3 are formed on the four side surfaces of the laminated body 2, at least the metal paste is applied to each of the four side surfaces separately. I need to do it. As a result, the number of steps for forming the external electrode 3 increases.

Further, the laminated electronic components 1 and 4 must be measured for their characteristics at least before shipping. However, in principle, the laminated electronic components 1 and 4 cannot measure the characteristics unless they are in the state of a chip. That is, in the laminated electronic component 1 shown in FIG. 15, the characteristics can be measured after the external electrode 3 is formed. Further, even in the laminated electronic component 4 shown in FIG. 16, at the stage of the mother laminated body, the characteristics of each laminated electronic component 4 cannot be measured, and the mother laminated body is divided so that the through holes 7 are divided. The characteristics can be measured only after cutting.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a laminated electronic component and a manufacturing method thereof in which the arrangement pitch of external electrodes can be made fine.

Another object of the present invention is to provide a characteristic measuring method capable of efficiently measuring the characteristic of a plurality of laminated electronic components.

[0013]

A laminated electronic component according to the present invention is a laminated body in which a plurality of insulating sheets are laminated with an internal circuit element interposed, and an electrical connection to the internal circuit element. An external electrode is formed on the outer surface of the laminate, and the external electrode is formed by exposing at least a side portion of a via hole provided in the insulating sheet and provided with a conductive material by cutting the insulating sheet. It is characterized by being a thing.

In the method for manufacturing a laminated electronic component according to the present invention, a plurality of laminated electronic components can be obtained by cutting along a predetermined cutting line, and individual laminated layers are formed in each area defined by the cutting line. In order to distribute internal circuit elements for electronic parts, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a conductive material electrically connected to the internal circuit elements is provided. The method includes a step of preparing a mother laminated body, and a step of cutting the mother laminated body along the cutting line, which is provided at a position where the provided via hole is exposed to the cutting surface by cutting along the cutting line.

In the method for measuring characteristics of a laminated electronic component according to the present invention, a plurality of laminated electronic components can be obtained by cutting along a predetermined cutting line, and each of the regions partitioned by the cutting line is individually cut. A conductive material in which a plurality of mother insulating sheets are laminated with the internal circuit elements interposed so as to distribute the internal circuit elements for the laminated electronic component, and which is electrically connected to the internal circuit elements. The step of preparing the mother laminated body is provided at a position where the via hole provided with is exposed to the cutting surface by cutting along the cutting line, and forming a groove in the mother laminated body along the cutting line, thereby at least the via hole. Exposing the inner surface of the groove to the inner surface of the groove, and measuring the characteristics of each laminated electronic component using the via hole exposed on the inner surface of the groove as an external electrode. Tsu and a flop.

The form of the laminated electronic component provided in the above-mentioned characteristic measuring method, that is, the aggregate of laminated electronic components composed of the mother laminated body having the groove formed therein may be used as it is as the form at the time of shipment.

[0017]

According to the laminated electronic component of the present invention, the external electrode is provided by exposing at least the side portion of the via hole provided with the conductive material. In this case, since the via holes can be easily provided with a smaller diameter for punching without using a drill, the arrangement pitch of the external electrodes can be made fine. Further, since it is not necessary to use a drill, it is possible to avoid an increase in cost due to the life of the drill.

Further, since the external electrode formed by the via hole does not need to be formed in such a manner that it extends in the circumferential direction to at least one main surface of the laminated body, at least one main surface of the laminated body is made to be composite. It can be widely used as a mounting surface for other components. Therefore, high density mounting of components can be achieved.

Further, since the external electrode is provided by the conductive material provided in the via hole, if the conductive material is filled so as to fill the via hole, the dimension corresponding to the film thickness can be made relatively large. . Therefore, when soldering the laminated electronic component to the circuit board, the problem of solder erosion can be reduced. In addition, the conductive material to be the external electrode is
Since it is embedded in a part of the via hole, the strength of soldering can be increased.

Next, according to the method for manufacturing a laminated electronic component according to the present invention, the via hole provided with the conductive material to be the external electrode is already provided in the mother laminated body, and the mother laminated body is cut. As a result, the conductive material is exposed and becomes an external electrode, so that a special process for providing the external electrode is unnecessary.

Further, according to the method for measuring characteristics of a laminated electronic component according to the present invention, by forming a groove, a plurality of laminated electronic components can be mechanically formed as a mother laminated body in an electrically independent state. The characteristics of the individual laminated electronic components can be measured while being integrated. Therefore,
There is no need to handle mechanically independent laminated electronic components,
For example, by screening, the characteristics of many laminated electronic components can be efficiently measured.

In addition, if the aggregate of laminated electronic components, which is a form for carrying out the above-mentioned characteristic measurement and is composed of a mother laminated body having grooves formed, is used as it is for the form at the time of shipment, it will be a consumer side. The individual laminated electronic components can be taken out from the mother laminated body only by dividing the mother laminated body along the grooves. In this case, since the characteristics of the individual laminated electronic components can be already measured, the laminated electronic components can be mounted without any problem, and the aggregate of the laminated electronic components has a state in which the individual laminated electronic components are in a separated state. It should be noted that it is easier to pack and handle than the case in.

[0023]

1 is a perspective view showing the external appearance of a laminated electronic component 10 according to an embodiment of the present invention. Multilayer electronic component 10
Is mounted on an appropriate circuit board in the form of the illustrated chip. In FIG. 1, the laminated electronic component 10 is illustrated with the surface facing the circuit board facing upward. There is.

The laminated electronic component 10 comprises a laminated body 11 in which a plurality of insulating sheets are laminated with an internal circuit element (not shown) interposed. For example, 4 of the laminated body 11
An external electrode 12 exposed on the outer surface of the stacked body 11 is formed on each of the two side surfaces. Although not shown, these external electrodes 12 are electrically connected to internal circuit elements.

As will be apparent from the following description of the manufacturing method, the external electrode 12 as described above is formed by cutting at least a side portion of the via hole provided in the insulating sheet and filled with the conductive material with the insulating sheet. It is formed by exposing by. In addition, the laminated body 11
For example, the step 13 is formed on each of the four side surfaces, but the reason why the step 13 is formed will be apparent from the following description of the manufacturing method.

In order to obtain the laminated electronic component 10 as described above, a mother laminated body 14 as shown in FIG. 2 is prepared.
The mother laminated body 14 provides a plurality of laminated electronic components 10 by cutting along a predetermined cutting line 15 (dashed-dotted line), and each laminated electronic component is provided in each region divided by the cutting line 15. A plurality of mother insulating sheets 16 and 1 with the internal circuit elements interposed so that the internal circuit elements (not shown) for 10 are distributed.
7 is laminated. This mother laminate 14
A via hole 19 filled with a conductive material 18 that is electrically connected to an internal circuit element (not shown) is provided at a position where the via hole 19 is divided by cutting along the cutting line 15. The external electrode 12 shown in FIG. 1 is provided by the conductive material 18 in these via holes 19.

In order to obtain the mother laminated body 14 as described above, for example, the following steps are carried out. In addition,
In this example, the mother insulating sheets 16 and 17 are
Is composed of a ceramic sheet.

First, sheet formation is performed by a doctor blade method or the like, and mother insulating sheets 16 and 17 are formed.
Get a ceramic green sheet that should be. A via hole is formed in a particular one of these ceramic green sheets by punching or the like in order to enable electrical conduction through the sheet in the thickness direction. At this time,
Mother insulating sheet 16 located relatively above in
A via hole 19 is further formed in the ceramic green sheet to be formed. Next, a conductive film and / or a resistance film to be an internal circuit element is printed on a specific one of the ceramic green sheets. At this time, the conductive material is filled in the already formed via hole. The illustrated via hole 19 is filled with a conductive material 18.
The conductive film is printed on the mother insulating sheet 16 shown in FIG.
If it is performed from the lower surface side, it is possible to prevent the conductive material 18 from forming conductive lands on the peripheral portion of the via hole 19 on the upper surface side of the mother insulating sheet 16. It should be pointed out that even if such a conductive land is formed, it falls within the scope of the present invention.

Next, the mother insulating sheets 16 and 17 as described above are stacked and pressed. Thereby, the mother laminated body 14 is obtained. In this mother laminated body 14, the via holes 19 provided in each of the plurality of mother insulating sheets 16 are aligned in the thickness direction, so that the conductive material 18 filled in each via hole 19 is formed.
Are connected in series.

Next, as shown in FIG. 3, the mother laminated body 1
4, a groove 20 is formed along the cutting line 15 (FIG. 2) by, for example, a dicing saw so that at least the via hole 19 is divided. By forming the groove 20, the via hole 19 is exposed on the inner surface of the groove 20, and the conductive material 18 in the via hole 19 is formed.
The part that is to be the individual laminated electronic component 10 surrounded by the groove 20 is electrically isolated from each other. Further, preferably, slits 21 and 22 are provided on the bottom surface of the groove 20 and the lower surface of the mother laminated body 14 facing the groove 20, respectively. One of the slits 21 and 22 may be omitted.

Incidentally, in FIG. 3, some conductive films 23 and 24 to be internal circuit elements are shown.
Further, a state in which the conductive film 23 is electrically connected to the conductive material 18 is also illustrated.

Next, the mother laminated body 14 is fired to sinter the ceramics constituting the mother insulating sheets 16 and 17. Thereafter, if necessary, a conductive film and / or a resistance film is formed on the surface of the mother laminated body 14, an overcoat is applied, and a solder resist is applied. In addition, the conductive material 18 or other conductive film to be the external electrode 3 is plated if necessary.

When the above steps are completed, the mother laminated body 1
Since the plurality of laminated electronic components 10 included in No. 4 are electrically independent from each other, the conductive material 1 present in each part of the via hole 19 divided by the groove 20.
The characteristic of each laminated electronic component 10 can be measured using 8 as an external electrode.

In this way, after the characteristics have been measured, other electronic components for compounding are mounted on the laminated electronic component 10 determined to be non-defective, if necessary. The steps described so far can be efficiently performed in the state of the mother laminated body 14. The laminated electronic component 10 may be shipped at this stage.

Next, in order to obtain a plurality of mechanically independent laminated electronic components 10, the mother laminated body 14 is cut along the cutting line 15.
(Fig. 2), i.e. cut completely along the groove 20 (Fig. 3). This cutting is easily accomplished by breaking the mother laminate 14 along the grooves 20, much like breaking chocolate. The slits 21 and 22 described above make such division easier.

In this way, the laminated electronic component 10 shown in FIG. 1 is obtained. As can be seen from the above description,
The step 13 is a result of the formation of the groove 20 described above. Further, when the laminated body 11 is divided into an upper half portion and a lower half portion by the boundary surface corresponding to the position of the step 13, the external electrode 12 is exposed only in the upper half portion.

Next, the laminated electronic component 10 is casing if necessary. This casing, when other components are mounted on the lower surface of the laminated electronic component 10 according to FIG. 1,
It covers this. Details of this casing are shown in Fig. 1.
3 and FIG. 14 will be described later.

Although the present invention has been described above with reference to the embodiments shown in FIGS. 1 to 3, several other modifications are possible within the scope of the present invention.

For example, in FIG. 1, the external electrode 12 is formed so as to be exposed not only on the side surface of the laminated body 11 but also on the upper surface according to FIG. 1, but the laminated electronic component 10 shown in FIG.
The external electrode 12a may be formed so as to be exposed only on the side surface of the stacked body 11 as in a. In FIG. 4, elements corresponding to those shown in FIG. 1 are designated by the same reference numerals, and redundant description will be omitted.

According to the laminated electronic component 10a shown in FIG. 4, not only the lower surface of the laminated body 11 in the drawing but also the upper surface thereof is
It can be widely used as a mounting surface of other components for composite formation without being interfered by the external electrode 12a. In order to obtain this laminated electronic component 10a, in the manufacturing stage of the mother laminated body 14 shown in FIG.
It suffices to use some of the mother insulating sheets located at the uppermost part of which the via holes 19 for forming the external electrodes are not provided.

As shown in FIG. 5, the above-described laminated electronic component 10a has the circuit board 3 when placed on the circuit board 31.
A gap is formed between 1 and the external electrode 12a. In this state, the laminated electronic component 10a is placed on the circuit board 31.
For mounting, the solder fillet 32 is advantageously used in order to electrically connect the conductive land (not shown) on the circuit board 31 and the external electrode 12a.

Further, as shown in FIG. 6, the laminated electronic component 1
0a, the terminal member 33 made of metal may be attached to the external electrode 12a.

The external electrode 12 shown in FIG. 1 and the external electrode 12a shown in FIG. 4 may be mixed in one laminated electronic component.

Further, in the embodiment shown in FIGS. 1 to 3, the via hole 19 for providing the external electrode 12 is
Although the cross section is circular, it may be changed to other shapes such as a quadrangle. Further, in order to expose the external electrode in a wider area, one external electrode may be provided by a plurality of via holes whose cross sections partially overlap each other, that is, a laterally long via hole.

The grooves 20 and the slits 21 and 22 may be formed after firing the mother laminated body 14. Further, if efficiency of forming or plating a conductive film / resistive film of the laminated body 14 after firing, plating, characteristic measurement, etc. is not taken into consideration, cutting along the cutting line 15 is performed before firing and is performed in a mechanically separated state. The laminated electronic component 10 may be fired. Further, after firing, the cutting may be performed along the cutting line 15 at once without passing through the step of forming the groove 20.

Further, the conductive material 18 filled in the via hole 19 is not applied at the same time as the printing of the conductive film,
The via hole 19 may be filled with a metal paste in another step. In this case, in the embodiment shown in FIGS. 1 to 3, it is possible to fill the conductive material 18 into the plurality of via holes 19 in series at a time in a state where the plurality of mother insulating sheets 16 are stacked. .

The insulating sheet is not limited to the ceramic sheet, and may be replaced with an insulating sheet made of another material.

Further, as in the laminated electronic component 10b shown in FIG. 7, the external electrode 12b may be provided with a conductive material formed in layers on the inner peripheral surface of the via hole 19 (FIGS. 2 and 3). Good. In this case, the external electrode 12b forms a recess on its outer surface.

Further, the present invention is not limited to the laminated electronic component in which all of the plurality of external electrodes are formed based on the via holes, but is also applied to the laminated electronic component in which some of the external electrodes are formed by another method. be able to.

For example, the laminated electronic component 10 shown in FIG.
Like c, some external electrodes 12 may be formed based on the via holes, while other external electrodes, for example, the shield electrode 25 may be formed by another method. This shield electrode 2
5 shows, for example, when forming the groove 20 as shown in FIG. 3, after forming the groove 20 whose inner side surface is the surface where the shield electrode 25 is to be formed, the groove 20 is filled with a metal paste. And the groove 20 is cut again so that the conductive material provided by the metal paste is finally divided. Although not shown, the shield electrode 25 is often electrically connected to the internal circuit element on the ground side of the laminated body 11.

The shield electrode 25 described above is, of course,
It may be formed based on a via hole. In this case, the via hole is formed in a slot shape elongated in the extending direction of the shield electrode 25. Further, the shield electrode 25 may be formed after obtaining the individual laminated electronic components 10c.

As shown in FIG. 9, the shield electrode 25a
Has a step 13 to improve the shielding performance.
May be formed to extend below. Such a shield electrode 25a can be formed by, for example, the following method.

(A) The entire shield electrode 25a is formed based on the via hole. (B) Of the shield electrode 25a, only the lower half part with the step 13 as a boundary is formed based on the via hole, and the upper half part is
It is formed by filling the groove 20 shown in FIG. 3 with a metal paste.

(C) The upper half is formed by filling the groove 20 with a metal paste to obtain the individual laminated electronic components 10a, and then the lower half is formed.

(D) The upper half is formed based on the via hole, and the individual laminated electronic component 10d is obtained, and then the lower half is formed.

(E) The entire shield electrode 25a is formed after the individual laminated electronic components 10d are obtained.

Of the methods of forming the shield electrode 25a described above, when the method (a) or (b) is adopted, FIG.
At the stage of forming the groove 20 shown in (1), the plurality of laminated electronic components 10d are in a state of being electrically connected to each other via the shield electrode 25a, and the plurality of laminated electronic components 10d are completely electrically independent. Not in a state. However, when such a shield electrode 25a is commonly used as a ground electrode in the characteristic measurement, it hinders the characteristic measurement of the individual laminated electronic components 10d in the state of the mother laminated body 14 as described above. Don't waste

In the laminated electronic component 10d shown in FIG. 9, the presence of the shield electrode 25a may reduce the mounting area for other components provided on the lower surface of the laminated body 11. In order to avoid this inconvenience, the shield electrode 25b may be formed so as not to reach the lower surface of the laminated body 11 in the figure, as in the laminated electronic component 10e shown in FIG.

The shield electrode 2 shown in FIGS. 8 to 10
Regarding each of the formation modes of 5, 25a, and 25b, the upper half part of the shield electrode may be formed on only one side surface of the stacked body 11 or may be formed on three side surfaces. The lower half of the shield electrode may be formed on three side surfaces or four side surfaces of the stacked body 11. In FIG. 8, the shield electrode 25 corresponding to the upper half of the shield electrode
Although only the shield electrode is formed, only the shield electrode corresponding to the lower half of the shield electrode may be formed.

Furthermore, the laminated electronic component 10f shown in FIG.
As described above, the shield electrode 25c may be formed so as to cover only a part of one side surface of the stacked body 11 in the width direction.

In each of the above-described embodiments, the two via holes 19 are divided to separate the two laminated electronic components 10 from each other.
External electrodes 12 for each of the. However, when the width of the groove 20 shown in FIG. 3 occupies a considerable portion of the diameter of the via hole 19, as shown in FIG.
One via electrode 19a may be provided to provide one external electrode. In FIG. 12, a part of the via hole 19a before the groove 20 is formed is shown by a chain double-dashed line.

FIG. 13 is a sectional view showing the laminated electronic component 42 that is casing by the case 41.

A step portion 44 is formed on the laminated body 43 included in the laminated electronic component 42, and an external electrode 45 is formed below the step portion 44. Further, on the upper surface of the laminated body 43 in the figure, some electronic components 46 for compounding the laminated electronic component 42 are mounted. Case 41
Is made of metal. The case 41 has a step portion 47 formed so as to fit to the side surface of the laminated body 43, and the external electrode 4
5 is soldered, for example.

FIG. 14 shows another laminated electronic component 42a casingd by a case 41a. Note that, in FIG. 14, elements corresponding to those shown in FIG. 13 are designated by the same reference numerals, and duplicated description will be omitted.

In FIG. 14, not only the step 44 but another step 48 is formed in the laminated body 43 provided in the laminated electronic component 42a. On the other hand, the case 41a has a stepped portion 48.
Is formed with a step 49. In this way, by engaging the stepped portion 49 of the case 41a with the stepped portion 48 of the laminated body 43, the attachment state of the case 41a to the laminated body 43 becomes stronger. In particular, even if a force that pushes the case 41a downward is applied toward the upper surface of the case 41a, the joint between the case 41a and the external electrode 45 does not come off. Such a force of pressing the case 41a downward is often given, for example, by a vacuum suction chuck (not shown) that sucks and holds the laminated electronic component 42a on the upper surface of the case 41a. Stepped portion 48 formed in the laminated body 43
Can be formed by a method similar to that of the step portion 44. That is, at the stage of the mother laminated body 14 shown in FIG. 3, similar grooves may be formed from below at positions corresponding to the grooves 20.

[Brief description of drawings]

FIG. 1 is a perspective view showing an appearance of a laminated electronic component 10 according to an embodiment of the present invention.

2 is a perspective view showing a mother laminate 14 prepared to obtain the laminated electronic component 10 shown in FIG.

3 is an enlarged perspective view showing a state in which a groove 20 enabling characteristic measurement is formed in the mother laminated body 14 shown in FIG.

FIG. 4 is a multilayer electronic component 10 according to another embodiment of the present invention.
It is a perspective view which shows the external appearance of a.

5 is a circuit board 3 including the laminated electronic component 10a shown in FIG.
It is sectional drawing which shows the state mounted on 1.

FIG. 6 is a view showing the laminated electronic component 10a shown in FIG.
It is sectional drawing which shows the state which attached 3.

FIG. 7 is a perspective view showing an appearance of a laminated electronic component 10b according to still another embodiment of the present invention.

FIG. 8 is a perspective view showing an external appearance of a laminated electronic component 10c according to still another embodiment of the present invention.

FIG. 9 is a perspective view showing an appearance of a laminated electronic component 10d according to still another embodiment of the present invention.

FIG. 10 is a perspective view showing an appearance of a laminated electronic component 10e according to still another embodiment of the present invention.

FIG. 11 is a perspective view showing an external appearance of a laminated electronic component 10f according to still another embodiment of the present invention.

FIG. 12 is a plan view showing a part of a mother laminated body 14 for explaining still another embodiment of the present invention.

FIG. 13 is a sectional view showing a casing of the laminated electronic component 42 according to still another embodiment of the present invention.

FIG. 14 is a cross-sectional view showing a casing of the laminated electronic component 42a according to still another embodiment of the present invention.

FIG. 15 is a perspective view showing an appearance of a conventional laminated electronic component 1.

FIG. 16 is a perspective view showing an external appearance of another type of conventional laminated electronic component 4.

[Explanation of symbols]

10, 10a, 10b, 10c, 10d, 10e, 10
f, 42, 42a Laminated electronic component 11,43 Laminated body 12, 12a, 12b, 45 External electrode 13, 44, 47, 48, 49 Stepped portion 14 Mother laminated body 15 Cutting line 16, 17 Mother insulating sheet 18 Conductive material 19, 19a Via hole 20 Groove 23, 24 Conductive film (internal circuit element) 25, 25a, 25b, 25c Shield electrode 41, 41a Case

Claims (14)

[Claims] 1. A plurality of insulating sheets are laminated with an internal circuit element interposed therebetween, the first and second main surfaces facing each other and side surfaces connecting the main surfaces. A laminated body having the same, and an external electrode electrically connected to the internal circuit element and formed on an outer surface of the laminated body, the external electrode being provided on the insulating sheet and provided with a conductive material. A laminated electronic component formed by exposing at least a side portion of a via hole by cutting the insulating sheet. 2. The laminated electronic component according to claim 1, wherein the conductive material is filled in the via hole. 3. The laminated electronic component according to claim 1, wherein the conductive material is formed in layers on the inner peripheral surface of the via hole. 4. The laminated body is divided into a first half on the side of the first main surface and a second half on the side of the second main surface by a boundary surface extending parallel to the main surface. The laminated electronic component according to claim 1, wherein the external electrode is exposed only in the first half portion. 5. The laminated electronic component according to claim 4, further comprising a second electronic component formed on the second main surface of the laminated body. 6. The step according to claim 4, wherein a step is formed on a side surface of the laminated body in correspondence with a position of a boundary surface between the first half portion and the second half portion. Laminated electronic components. 7. The laminated electronic component according to claim 5, further comprising a case attached to the laminated body so as to cover the second electronic component. 8. The laminated electronic component according to claim 4, wherein the external electrode is exposed on the side surface and the first main surface of the laminated body. 9. The laminated electronic component according to claim 4, wherein the external electrode is exposed only on the side surface of the laminated body. 10. A plurality of laminated electronic components can be obtained by cutting along a predetermined cutting line, and an internal circuit for each of the laminated electronic components is provided in each region divided by the cutting lines. In order to distribute the elements, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a via hole provided with a conductive material electrically connected to the internal circuit elements is provided. A method for manufacturing a laminated electronic component, comprising: preparing a mother laminated body provided at a position exposed to a cut surface by cutting along the cutting line and cutting the mother laminated body along the cutting line. 11. The step of cutting the mother laminated body includes the step of forming a groove in the mother laminated body so as to expose the via hole to a cut surface, and the step of cutting the mother laminated body in which the groove is formed into the groove. The method for manufacturing a laminated electronic component according to claim 10, further comprising the step of dividing at the position of. 12. The method for manufacturing a laminated electronic component according to claim 10, wherein the mother insulating sheet is a ceramic green sheet, and the method further comprises the step of firing the mother laminated body. 13. A plurality of laminated electronic components can be obtained by cutting along a predetermined cutting line, and an internal circuit for each of the laminated electronic components is provided in each region divided by the cutting line. In order to distribute the elements, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a via hole provided with a conductive material electrically connected to the internal circuit elements is provided. A mother laminated body, which is provided at a position exposed to the cutting surface by cutting along the cutting line, is prepared, and a groove is formed in the mother laminated body along the cutting line, whereby at least the via hole is formed in the groove. Each step of exposing the side surface and measuring the characteristics of the individual laminated electronic component by using the via hole exposed on the inner side surface of the groove as an external electrode; Method for measuring characteristics of electronic parts. 14. A plurality of laminated electronic components are obtained by cutting along a predetermined cutting line, wherein an internal circuit for each of the laminated electronic components is provided in each region divided by the cutting line. In order to distribute the elements, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a via hole provided with a conductive material electrically connected to the internal circuit elements is provided. Provided at a position exposed to the cutting surface by cutting along the cutting line, comprising a mother laminated body, the mother laminated body, a groove is formed along the cutting line, thereby at least the via hole of the groove A group of laminated electronic components exposed on the inner surface.