JP3301188B2 - LAMINATED ELECTRONIC COMPONENT, ITS MANUFACTURING METHOD, AND ITS CHARACTERISTIC MEASUREMENT METHOD - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer electronic component having an internal circuit element disposed therein, a method of manufacturing the same, and a method of measuring the characteristics thereof, and more particularly to an improvement in the form of external electrodes in the multilayer electronic component. It is.

[0002]

2. Description of the Related Art For example, a multilayer electronic component represented by a multilayer capacitor, a multilayer inductor, a multilayer circuit board, and a multilayer composite electronic component includes a plurality of multilayer electronic components in which internal circuit elements such as conductive films and / or resistive films are interposed. Are provided. As an insulating sheet,
Typically, a ceramic sheet is used.

FIG. 9 is a perspective view showing the appearance of a conventional laminated electronic component 1 which is of interest to the present invention. The multilayer electronic component 1 includes a multilayer body 2 in which a plurality of insulating sheets are stacked with an internal circuit element (not shown) interposed therebetween. External electrodes 3 electrically connected to internal circuit elements are formed on, for example, four side surfaces of the laminate 2. These external electrodes 3 are provided by dividing through holes 4 as shown by imaginary lines in FIG.

That is, in a mother laminated body 5 prepared so that a plurality of laminated electronic components 1 can be obtained by dividing along a predetermined dividing line, through holes 4 are formed, and external holes are formed on the inner peripheral surface thereof. After applying the conductive material 6 to be the electrode 3, the mother laminate 5 is divided so as to divide the through hole 4.

[0005] Such a laminated electronic component 1 is mounted on an appropriate circuit board via external electrodes 3 in the form of a chip.

[0006]

The above-described application of the conductive material 6 to the through holes 4 is generally performed by screen printing using a conductive paste. Therefore, the conductive material 6 constituting the external electrode 3 extends not only on the inner peripheral surface of the through hole 4 but also partially on the peripheral surface of the through hole 4 to each main surface of the laminate 2. Is given to As a result, the external electrode 3 forms the overhang portion 7 on each main surface of the laminate 2.

The presence of such an overhang 7 causes the following problem. That is, when another component is to be mounted on both principal surfaces or any one of the principal surfaces of the multilayer electronic component 1 to achieve the composite, the area in which such another component can be arranged is restricted.

When the conductive material 6 serving as the external electrode 3 is formed by, for example, applying and baking a silver paste, nickel plating is applied thereon to protect silver, and solder is further applied thereon. Tin plating may be applied in order to improve the attachability. On the other hand, when applying a silver paste to be the conductive material 6 in the through hole 4,
If it is excessive, the penetrability of the through hole 4 may be hindered. However, if the penetrability of the through hole 4 is hindered in this way, it becomes impossible to apply the plating as described above to the inside of the through hole 4. Therefore, the through hole 4 is divided and the external electrode 3
Is exposed, a portion where a desired plating film is not formed is formed on such an external electrode 3, and a situation occurs in which the plating function as described above is not properly exhibited.

In addition, the characteristics of the laminated electronic component 1 must be measured at least before shipment. However, the characteristics of the laminated electronic component 1 cannot be measured unless the state of the chip is in principle.
That is, at the stage of the mother laminate 5, the characteristics of the individual multilayer electronic components 1 cannot be measured, and
The characteristics can be measured only after the mother laminate 5 is divided such that is divided. Therefore, it is not possible to efficiently measure the characteristics of many multilayer electronic components 1.

[0010] Therefore, an object of the present invention is to use at least one principal surface more widely as a mounting surface for other components for compounding, and to increase the density of component mounting. It is an object of the present invention to provide a laminated electronic component and a method for manufacturing the same.

Another object of the present invention is to provide a characteristic measuring method capable of efficiently measuring the characteristics of a plurality of laminated electronic components.

[0012]

According to the present invention, there is provided a laminated electronic component comprising: a laminated body in which a plurality of insulating sheets are laminated with an internal circuit element interposed; and a laminate electrically connected to the internal circuit element. And an external electrode formed on an outer surface of the laminate, wherein the external electrode is formed by exposing the inside of a through hole provided in the laminate and provided with a conductive material by dividing the laminate. The conductive material is formed so as not to reach at least one end in the axial direction of the through hole ,
At least the conductive material does not reach the end of the number of main surfaces
The main surface on the side constitutes a mounting surface of the electronic component .

In the method of manufacturing a laminated electronic component according to the present invention, a plurality of laminated electronic components can be obtained by dividing the electronic component along a predetermined dividing line. A step of preparing a mother laminate, in which a plurality of mother insulating sheets are laminated with these internal circuit elements interposed so as to distribute the internal circuit elements for the laminated electronic component, A step of providing a through hole at a position passing through the dividing line, and a step of providing a conductive material electrically connected to the internal circuit element so that the through hole does not reach at least one end in the axial direction. Dividing the mother laminate along the division line, and
The main surface on the side where the conductive material does not reach the end
And a step of forming a mounting surface .

According to the method of measuring the characteristics of a multilayer electronic component according to the present invention, a plurality of multilayer electronic components can be obtained by dividing the multilayer electronic component along a predetermined dividing line. In order to distribute the internal circuit elements for the laminated electronic component, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a through hole is provided at a position passing through the dividing line. A step of preparing a mother laminate, to which a conductive material electrically connected to the internal circuit element is provided so that the through hole does not reach at least one end in the axial direction thereof, Forming a groove in the mother laminate along the division line so as to divide the conductive material into a plurality of portions so that each portion is electrically independent of each other;
Measuring the characteristics of the individual laminated electronic components using each of the divided portions of the conductive material as an external electrode.

The form of the laminated electronic component provided in the above-described characteristic measuring method, that is, the aggregate of the laminated electronic parts formed of the mother laminated body having the grooves formed therein can also be used as it is in the form at the time of shipment.

[0016]

According to the laminated electronic component of the present invention, the external electrode is formed by exposing the conductive material provided to the through-hole by dividing the through-hole. Since it is formed so as not to reach at least one end in the axial direction of the through hole, on the main surface of the laminated body at one end side of the through hole which is prevented from reaching the conductive material, No overhang of the external electrode is formed. Therefore, the main surface of the laminate can be widely used as a mounting surface for other components for compounding or a surface for forming circuit conductors without interference from external electrodes, and as a result, the height of component mounting can be increased. Density can be increased.

Further, according to the method for manufacturing a multilayer electronic component of the present invention, many steps for obtaining a multilayer electronic component can be performed in a state of a mother multilayer body.
A large number of laminated electronic components can be efficiently manufactured.
Further, when the mother laminate is divided to obtain a plurality of laminated electronic components, grooves are formed in the mother laminate in advance along the dividing lines, thereby forming grooves in the conductive material in the through holes. By doing so, even if the conductive material is applied so as to impede the penetration of the through hole, plating for imparting preferable properties as an external electrode can be applied to a portion exposed on the side surface of the groove. . As a result, the surface of the external electrode of the laminated electronic component obtained by finally dividing the mother laminate is surely covered with such a plating film.

According to the method for measuring the characteristics of a multilayer electronic component according to the present invention, the plurality of multilayer electronic components are electrically isolated from each other by forming the groove, so that the mother multilayer is formed. Mechanically integrated,
The characteristics of each laminated electronic component can be measured. Therefore, there is no need to handle a plurality of mechanically independent multilayer electronic components, and the characteristics of a large number of multilayer electronic components can be efficiently measured.

Further, if the aggregate of the laminated electronic components formed of the mother laminate having the grooves, which is the mode for carrying out the above-described characteristic measurement, is taken as it is at the time of shipment, the consumer side By simply dividing the mother laminate along the groove, individual laminated electronic components can be taken out therefrom. In this case, since the measurement of the characteristics of the individual multilayer electronic components can be completed, the individual multilayer electronic components can be mounted without any problem, and the aggregate of the multilayer electronic components is in a state in which the individual multilayer electronic components are separated. It should be noted that packaging and handling are easier than in

[0020]

1 and 2 are perspective views showing the appearance of a laminated electronic component 11 according to one embodiment of the present invention. The laminated electronic component 11 is mounted on an appropriate circuit board in the form of a chip shown in FIG. 1. FIG. 1 shows a main surface side facing upward in such a mounted state, and FIG. The main surface side facing downward in the state is shown.

The laminated electronic component 11 includes a laminated body 12 in which a plurality of insulating sheets are laminated with an internal circuit element (not shown) interposed. For example, 4
On each of the two side surfaces, an external electrode 13 exposed on the outer surface of the laminate 12 is formed. Although not shown, these external electrodes 13 are electrically connected to internal circuit elements.

As will be clear from the description of the manufacturing method described below, the external electrode 13 as described above
2 and is formed by exposing the inside of the through hole provided with the conductive material 14 by dividing the laminated body 12, and the conductive material 14 reaches one end in the axial direction of the through hole. Not formed. Further, a step 15 is formed on each of the four side surfaces of the laminate 12, for example.
Is formed from the following description of the manufacturing method.

In order to obtain the above-described laminated electronic component 11, a mother laminated body 16 as shown in FIG. 3 is prepared.
The mother laminated body 16 provides a plurality of laminated electronic components 11 by dividing along a predetermined dividing line 17 (dot-dash line). A plurality of mother insulating sheets are laminated with these internal circuit elements interposed so as to distribute internal circuit elements (not shown).

In order to obtain the mother laminate 16 as described above, for example, the following steps are performed.

First, a sheet is formed by a doctor blade method or the like to obtain a ceramic green sheet to be a mother insulating sheet. In certain of these ceramic green sheets, via holes are formed by punching or the like in order to enable electrical conduction through the sheet in the thickness direction. Next, a conductive film and / or a resistive film to be an internal circuit element are printed on a specific one of the ceramic green sheets. At this time, the conductive material is filled in the via holes already formed.

Next, the above-mentioned mother insulating sheets are stacked and pressed. Thereby, the mother laminate 16 is obtained.

Next, as shown in FIG.
Through holes 18 are formed at positions passing through the dividing lines 17 of FIG.

Next, as shown in FIG.
8, conductive material 14 electrically connected to internal circuit elements
Is given. For the application of the conductive material 14, for example,
A method of applying the conductive material 14 by screen printing from the other side while applying a negative pressure to one side of the through hole 18, a method of applying the conductive material 14 by a dispenser, and the like are applied. At this time, the negative pressure is controlled in the case of screen printing, or the supply amount of the conductive material 14 is controlled in the case of dispenser, so that the conductive material 14 is formed at one end of the through hole 18 in the axial direction. In FIG. 4, it does not reach the lower end.

Next, as shown in FIGS. 5 and 6, the mother laminate 16 has grooves 19 along the dividing lines 17 (FIG. 3).
Is formed, for example, by a dicing saw. Groove 19
Is selected to have such a depth that the conductive material 14 in the through hole 18 is divided into a plurality of portions so that the portions are electrically independent of each other. Even if the conductive material 14 is provided to such an extent that the penetrability of the through hole 18 is impaired, the above-described groove 19
Is formed in a state in which the through hole 18 has been penetrated again,
Further, it is possible to provide an exposed side surface to the conductive material 14 in the through hole 18.

Next, as shown in FIGS. 5 and 6, if necessary, slits 20 and 21 are provided on the bottom surface of the groove 19 and the lower surface of the mother laminate 16 opposed thereto. Either of the slits 20 and 21 may be omitted.

FIG. 6 shows conductive films 22 and 23 to be used as internal circuit elements. Further, a state where the conductive film 22 is electrically connected to the conductive material 14 is also illustrated.

Next, the mother laminate 16 is fired to sinter the ceramic contained in the mother insulating sheet constituting the mother laminate 16. Thereafter, as necessary, a conductive film and / or a resistive film are formed on the front and back surfaces of the mother laminate 16, an overcoat is applied, and a solder resist is applied. If necessary, the conductive material 14 to be the external electrode 13 and other conductive films are plated.

When the above steps are completed, the mother laminate 1
Since the plurality of laminated electronic components 11 included in 6 are electrically independent of each other, the conductive material 14 existing in each portion of the through hole 18 divided by the groove 19 is used as an external electrode. Thus, the characteristics of the individual laminated electronic components 11 can be measured.

As described above, after the characteristics are measured, circuit conductors for composite use and other electronic components are mounted on the laminated electronic component 11 determined to be non-defective as required. The steps described so far can be efficiently performed in the state of the mother laminate 16. Note that the multilayer electronic component 11 may be shipped at this stage.

Next, in order to obtain a plurality of mechanically independent laminated electronic components 11, the mother laminated body 16
(FIG. 3), i.e. complete division along the groove 19 (FIGS. 5 and 6). This splitting is easily achieved by splitting the mother laminate 16 along the grooves 19, like splitting a chocolate. The slits 20 and 21 described above
Makes such divisions easier. Such division may be achieved by cutting with a dicing saw having a blade thickness smaller than the width of the groove 19.

Thus, the multilayer electronic component 11 shown in FIGS. 1 and 2 is obtained. As can be seen from the above description, the step 15 is a result of the formation of the groove 19 described above. When the laminate 12 is divided into two parts by a boundary surface corresponding to the position of the step 15, the external electrodes 13 are formed only in one part. For this reason, the protruding portion 24 is formed on the external electrode 13 on the main surface side of the multilayer electronic component 11 shown in FIG. 2, but on the main surface side shown in FIG. Not extended. Therefore, the main surface shown in FIG. 1 can be widely used as a mounting surface for other electronic components without being interfered by the external electrodes 13.

Next, the multilayer electronic component 11 is casing as required. This casing covers, for example, when a circuit conductor and other electronic components are mounted on the main surface of the laminated electronic component 11 shown in FIG. 1, for example.

Although the present invention has been described with reference to the embodiment shown in FIGS. 1 to 6, several other modifications are possible within the scope of the present invention.

For example, the steps from the step of applying the conductive material 14 to the through holes 18 to the step of forming the slits 20 and 21 may be performed after the step of firing the mother laminate 16. Further, as described above, when the conductive material 14 is provided in the through hole 18 after the firing step,
The conductive material 14 may be applied by dry plating.

At least some of the steps after the firing step in the above-described embodiment may be omitted or the order thereof may be changed.

The method shown in FIGS. 7 and 8 may be employed in order to provide the conductive material 14 in the through hole 18 so as not to reach one end. That is, first, as shown in FIG. 7, the conductive material 14 is provided in the through hole 18 over the entire area. At this time,
The conductive material 14 forms an overhang 24 on the upper end side of the through hole 18, but preferably does not form such an overhang on the other end side. next,
As shown in FIG. 8, a drill or the like is operated from the lower end side of the through hole 18, and a hole 25 having a predetermined depth is formed on the other end side, whereby the conductive material 14 is placed on the lower end side. Removed. The diameter of the hole 25 is
Is selected to be the same as or slightly larger than the diameter of In this way, as in the case shown in FIG.
A state is formed in the through hole 18 so as not to reach one end in the axial direction.

It is preferable that the above-described hole 25 is formed from the side where the overhanging portion of the conductive material 14 is not formed.
This is because it is preferable that the diameter of the hole 25 be as small as possible in order to increase the effective mounting area of the main surface of the multilayer electronic component 11 as much as possible. This is because it is preferable to form the hole 25 from the side where no is formed.

In the above-described embodiment, the conductive material 14
Is provided so as not to reach one end of the through hole 18 in the axial direction, but regions where the conductive material is not provided may be formed at both ends of the through hole in the axial direction.

Further, the cross-sectional shape of the through hole 18 is circular, but may be changed to another shape such as a square.

The insulating sheet used in the present invention is not limited to a ceramic sheet, but may be replaced with an insulating sheet made of another material.

Further, the present invention is not limited to a multilayer electronic component in which all of the plurality of external electrodes are formed based on the conductive material provided in the through hole, and some of the external electrodes are formed by another method. It can also be applied to laminated electronic components.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a laminated electronic component 11 according to an embodiment of the present invention from one main surface side.

2 is a perspective view showing the laminated electronic component 11 shown in FIG. 1 from the other main surface side.

FIG. 3 is a perspective view showing a mother laminate 16 prepared to obtain the multilayer electronic component 11 shown in FIG.

FIG. 4 is a cross-sectional view showing a state in which a conductive material 14 is provided in a through hole 18 of the mother laminate 16 shown in FIG.

FIG. 5 is an enlarged cross-sectional view showing a state in which a groove 19 and slits 20 and 21 are formed at a position passing through a through hole 18 after the step shown in FIG.

FIG. 6 is an enlarged perspective view showing a part of the mother laminate 16 in the state shown in FIG.

FIG. 7 shows a mother laminate 1 according to another embodiment of the present invention.
6 is a cross-sectional view showing a state where a conductive material 14 is provided in a through hole 18 of FIG.

8 is a cross-sectional view showing a state in which the conductive material 14 has been removed at the lower end side of the through hole 18 after the step shown in FIG. 7;

FIG. 9 is a perspective view showing the appearance of a conventional multilayer electronic component 1 which is of interest to the present invention.

[Explanation of symbols]

 Reference Signs List 11 laminated electronic component 12 laminated body 13 external electrode 14 conductive material 16 mother laminated body 17 dividing line 18 through hole 19 groove 22, 23 conductive film (internal circuit element)

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ identification code FI H05K 3/40 H05K 3/40 D 3/46 3/46 N W (58) Investigation field (Int.Cl. ⁷ , DB name) ) H01G 4/00-4/42

Claims (4)

(57) [Claims] 1. A laminate in which a plurality of insulating sheets are laminated with an internal circuit element interposed therebetween, and an external member electrically connected to the internal circuit element and formed on an outer surface of the laminate. An electrode, wherein the external electrode is formed by exposing the inside of a through hole provided in the laminate and provided with a conductive material by dividing the laminate, and wherein the conductive material is The through hole is formed so as not to reach at least one end in the axial direction, and at least the conductive material among a plurality of main surfaces may reach the end.
The main surface on the other side constitutes the mounting surface for electronic components. 2. A plurality of laminated electronic components are obtained by dividing along a predetermined dividing line, and an internal circuit for each of the laminated electronic components is provided in each area defined by the dividing lines. Prepare a mother laminate, in which a plurality of mother insulating sheets are laminated with these internal circuit elements interposed so as to distribute the elements, a through hole at a position passing through the dividing line of the mother laminate. A conductive material electrically connected to the internal circuit element is provided in the through hole so as not to reach at least one end in the axial direction, and the mother laminate is arranged along the dividing line. To make sure that at least the conductive material of the plurality of main surfaces reaches the end.
A method for manufacturing a laminated electronic component, comprising: a main surface on a non-existent side ; 3. A plurality of laminated electronic components are obtained by dividing along a predetermined dividing line, and an internal circuit for each of the laminated electronic components is provided in each area defined by the dividing lines. In order to distribute the elements, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a through hole is provided at a position passing through the dividing line, and the through hole is provided in the through hole. Preparing a mother laminate provided with a conductive material electrically connected to the internal circuit element so as not to reach at least one end in the axial direction, dividing the conductive material in the through hole into a plurality of portions A groove is formed in the mother laminate along the dividing line so that the respective portions are electrically independent of each other, and each of the divided portions of the conductive material is used as an external electrode to form an individual laminated electron. Measuring the characteristics of goods, comprising the steps, characteristic measurement method of a multilayer electronic component. 4. A plurality of laminated electronic components are obtained by dividing along a predetermined dividing line, and an internal circuit for each of the laminated electronic components is provided in each area defined by the dividing lines. In order to distribute the elements, a plurality of mother insulating sheets are laminated with these internal circuit elements interposed, and a through hole is provided at a position passing through the dividing line, and the through hole is provided in the through hole. A mother laminate is provided with a conductive material electrically connected to the internal circuit element so as not to reach one end in the axial direction. The mother laminate has a conductive material in the through hole. A groove is formed along the division line so that each part is electrically independent from each other, and at least the conductive material among a plurality of main surfaces reaches an end.
An assembly of laminated electronic components, the main surface of the other side constituting the mounting surface of the electronic component.