JPH113836A - Laminated electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic part that is low profile when a metal case is mounted, and has disposition pitches of an external electrode and a ground electrode which can be made narrow. SOLUTION: A laminated electrode part 10 has a rectangular parallelepiped- shaped laminate 11 constituted by laminating a plurality of insulation sheets with circuit elements put inside. By providing steps 12 to a plurality of positions of a rear surface 111 of the laminate 11, a first surface 111a and a plurality of second surfaces 111b recessed compared with the first surface 111a are formed. And a plurality of external electrodes 13 are formed on the first surface 111a, and one ground electrode 14 is formed on each of the second surfaces 111b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer electronic component having a circuit element disposed therein, and more particularly to an improvement in the structure of a ground electrode of the multilayer electronic component.

[0002]

2. Description of the Related Art FIG. 8 is a perspective view of a conventional laminated electronic component. For example, a multilayer electronic component 50 represented by a multilayer capacitor, a multilayer inductor, a multilayer circuit board, and a multilayer composite electronic component has a substantially rectangular parallelepiped laminate 51 in which an internal wiring pattern (not shown) is formed. The external electrode 52 and the ground electrode 53 are formed on the back surface 511 of the multilayer body 51. Although not shown, electronic components such as an IC chip and a chip capacitor are mounted on the surface of the multilayer body 51. Further, as shown in FIG. 9, in the case of the laminated electronic component 60 with a metal case, the ground electrode 53 is formed of a metal case 54 and a solder 55 which are put on the surface of the laminated electronic component 50 in order to reduce radiation and strengthen shielding. Connected. The end 54 a of the side surface of the metal case 54 is bent inward on the back surface of the multilayer electronic component 50 so as to be easily connected to the ground electrode 53 by the solder 55.

[0003]

However, in the above-mentioned conventional multilayer electronic component, when mounting the multilayer electronic component on the circuit board, the external electrodes on the back surface of the multilayer electronic component and the circuit pattern on the circuit board are not used. And the solder that connects the ground electrode on the back surface of the multilayer electronic component to the ground pattern on the circuit board.Therefore, when the amount of solder becomes excessive, Spreads around the external electrode and the ground electrode. Therefore, there is a risk that the external electrode and the ground electrode may be short-circuited, and it is difficult to reduce the arrangement pitch of the external electrode and the ground electrode.

Further, when the metal case is attached, the end of the side surface of the metal case is bent inward at the back surface of the laminated electronic component, so that the bent portion of the metal case and the thickness of the solder connecting the metal case and the ground electrode are formed. (T in FIG. 9), there is also a problem that it is difficult to reduce the height of the multilayer electronic component.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and the arrangement pitch of the external electrodes and the ground electrodes can be reduced, and the height can be reduced even when a metal case is attached. The purpose is to provide electronic components.

[0006]

In order to solve the above-mentioned problems, a laminated electronic component according to the present invention has a structure in which a plurality of insulating sheets are laminated in a state in which circuit elements are interposed, and a plurality of insulating sheets are laminated to each other. A laminated electronic device comprising a substantially rectangular parallelepiped laminate including side surfaces connecting the main surfaces, and including, on one principal surface of the laminate, a plurality of external electrodes electrically connected to the circuit element and a ground electrode. In the component, a first surface and a second surface that is recessed as compared to the first surface are formed by providing at least one step on one main surface of the laminate, and forming the first surface. The external electrode is provided on the surface,
Wherein the ground electrode is provided on the surface of.

According to the multilayer electronic component of the present invention, since the second surface formed by the step is concave, the multilayer electronic component is formed on the second surface of the multilayer electronic component when the multilayer electronic component is mounted on a circuit board. The solder for connecting the ground electrode and the ground pattern on the circuit board does not spread from the second surface on which the ground electrode is formed to the first surface on which the external electrode is formed. There is no danger of short circuit.

[0008] Further, a second surface that is recessed from the first surface is formed on one principal surface of the laminate that constitutes the laminated electronic component, and a ground electrode is formed on the second surface. In the case of a laminated electronic component with a metal case, the end of the side surface of the metal case is connected to the ground electrode provided on the second surface. Therefore, the end of the side surface of the metal case does not protrude from one main surface of the multilayer electronic component.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a perspective view of one embodiment of a laminated electronic component according to the present invention. The multilayer electronic component 10 is mounted on an appropriate circuit board in the illustrated chip-like form.
The back surface of the multilayer electronic component 10, that is, the surface facing the circuit board side is shown facing upward.

The laminated electronic component 10 has a substantially rectangular parallelepiped laminate 11 in which a plurality of insulating sheets are laminated with a circuit element (not shown) interposed therebetween. By providing steps 12 at one of the main surfaces of the laminate 11, that is, at a plurality of locations on the back surface 111 of the laminate 11, the first surface 11
1a and a plurality of second surfaces 111b that are concave relative to the first surface 111a are formed. Then, the first surface 111
a, a plurality of external electrodes 13 are formed on the
One ground electrode 14 is formed on each of the surfaces 111b. The shape of the step 12 may be any of a circle, a square, or a combination thereof. Also,
The height of the step 12 is higher than the thickness of the metal case (not shown) and is about 0.01 to 0.3 mm.

In order to obtain the above-described laminated electronic component 10, a mother laminate 15 as shown in FIG. 2 is prepared.
Then, in the mother laminated body 15, portions separated by the cutting lines 16 become individual laminated electronic components 10. In FIG. 2, the external electrode 13 and the ground electrode 14 are omitted.

3 and 4 are cross-sectional views of the mother laminate 15 before and after pressing. First, as shown in FIG. 3, sheets are formed by a doctor blade method or the like, and ceramic green sheets 17 a to 17 m to form the mother laminate 15 are formed.
17e is obtained. And the ceramic green sheet 17
To allow electrical conduction in the thickness direction of the sheet, via holes 18 penetrating the sheet are formed in b to 17d by punching or the like.

Next, the ceramic green sheet 17
A conductive material forming the conductive film 19 or the resistive film 20 to be a circuit element (not shown) is provided on the b and 17c, and an external electrode (not shown) is provided on the ceramic green sheet 17d.
Alternatively, a conductive material forming the ground electrode 14 is printed. At this time, a conductive film 19,
The conductive material constituting the resistance film 20, the external electrode or the ground electrode 14 is filled, and electrical conduction in the thickness direction of the sheet is enabled. Then, the portion 21 serving as the step portion of the lowermost ceramic green sheet 17 e is removed by punching or the like to provide the step 12.

Next, the ceramic green sheet 17a
１７17e are stacked and pressed. Thus, a mother laminate 15 as shown in FIG. 4 is obtained. As shown in FIG. 5, since the external electrodes 13 and the ground electrodes 14 are printed as separate patterns so that the individual multilayer electronic components 10 are independent, they are electrically independent from each other. doing.

Next, in order to secure solderability and prevent solder erosion, the external electrode 13 and the ground electrode 14
Ni / Au, Ni / Sn, etc. are formed by plating. Next, as shown in FIG. 5, the mother laminate 15 is provided along the cutting line 16 (FIG. 2) on the back surface and the front surface of the mother laminate 15 so as to be opposed to each other.
2, 23 are provided. In addition, the slit 2 for break
Either of 2 and 23 may be omitted.

Next, the mother laminate 15 is connected to the external electrode 1.
3 and ground electrode 14, and circuit elements (not shown)
Together with the conductive film 19 or the resistive film 20 to be formed. The external electrode 13 and the ground electrode 1
4 is printed on the mother insulating sheet at the same time as the conductive film 19 or the resistive film 20 to be a circuit element (not shown),
It is common to fire integrally with the mother laminate 15, but after firing the mother laminate 15, the external electrodes 13 are fired.
Alternatively, the ground electrode 14 may be printed and printed.

Thereafter, if necessary, the mother laminated body 15
A conductive film or a resistive film (not shown) is formed on the surface of the substrate, and a protective film (not shown) is formed thereon. Next, on the surface 112 (FIG. 1) of the laminated electronic component 10 determined to be non-defective, another electronic component (not shown) for compounding is mounted as necessary.

In the above-described embodiment, the steps described so far can be efficiently performed in the state of the mother laminate 15. The shipment of the multilayer electronic component 10 may be performed at this stage.

Next, in order to obtain a plurality of mechanically independent laminated electronic components 10, the mother laminated body 15
Break slit 22 formed along (FIG. 2),
23 is completely divided. In this way,
The multilayer electronic component 10 shown in FIG. 1 is obtained.

Although not shown, the multilayer electronic component 10 is mounted on a circuit board, and the external electrodes 13 of the multilayer electronic component 10 and the circuit patterns on the circuit board,
The ground electrode 14 and the ground pattern on the circuit board are connected by solder.

At this time, the second electrode for forming the ground electrode 14 is formed.
Of the first surface 11b forming the external electrode 13
1a, the solder for connecting the ground electrode 14 on the second surface 111b and the ground pattern on the circuit board is mounted on the second surface when the electronic component 10 is mounted on the circuit board. It does not spread from 111b to the first surface 111a. Therefore, the external electrode 13 and the ground electrode 14
Since there is no danger of short-circuiting, the arrangement pitch of the external electrode 13 and the ground electrode 14 can be made fine, and the miniaturization of the multilayer electronic component 10 becomes possible.

FIG. 6 is a cross-sectional view of a laminated electronic component with a metal case in the case where a metal case is placed on the surface of the laminated electronic component 10 thus obtained. In the laminated electronic component 30 with a metal case, the metal case 24 covered on the laminated electronic component 10 is laminated by connecting the end 24 a of the side surface to the ground electrode 14 formed on the laminated electronic component 10 by solder 25. It is fixed to the electronic component 10.

At this time, the laminated electronic component 10 is
Since the ground electrode 14 is provided on the second surface 111b formed to be depressed as compared to the second surface 11a, the end portion 24a on the side surface of the metal case 24 is formed like the laminated electronic component 30 with the metal case. Even when connected to the ground electrode 14 provided on the surface 111b, the end 24a of the side surface of the metal case 24 does not protrude from one main surface of the multilayer electronic component 10. Therefore, the height of the laminated electronic component 30 with a metal case can be reduced.

FIG. 7 is a sectional view showing another laminated electronic component with a metal case. Laminated electronic component 30 with metal case
a, the end 26a on the side surface of the metal case 26 is bent in the direction of the step 12 of the multilayer electronic component 10, and the end 26a on the side surface of the metal case 26 and the ground electrode 14 are connected via the solder 27. Then, the end 26a on the side surface of the metal case 26 and the ground electrode 14 are connected more firmly.

[0025]

According to the multilayer electronic component of the present invention, a step is provided on one principal surface of the laminate constituting the multilayer electronic component,
A first surface on which an external electrode is formed and a second surface on which a ground electrode is formed while being recessed as compared with the first surface.
When the multilayer electronic component is mounted on the circuit board, the solder connecting the ground electrode on the second surface to the ground pattern on the circuit board is used for mounting the multilayer electronic component on the circuit board. The second surface does not spread to the first surface on which the external electrodes are formed. Therefore, there is no danger of short-circuiting between the ground electrode and the external electrode, so that the arrangement pitch of the external electrode and the ground electrode can be reduced, and the size of the multilayer electronic component can be reduced.

When a metal case is attached to the laminated electronic component to form a laminated electronic component with a metal case, a ground electrode is provided on a second surface formed to be depressed with respect to the first surface. The end of the side of the metal case
Even when connected to the ground electrode provided on the surface of the laminated electronic component, the end of the side surface of the metal case does not protrude from one main surface of the multilayer electronic component. Therefore, the height of the laminated electronic component with a metal case can be reduced.

Further, also in the laminated electronic component with a metal case, the solder for connecting the end of the side surface of the metal case and the ground electrode provided on the second surface is formed by the second electrode on which the ground electrode is formed. The first where the external electrode is formed from the surface
Therefore, a short circuit between the ground electrode and the external electrode can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a laminated electronic component according to the present invention.

FIG. 2 is a perspective view showing a mother laminate prepared for obtaining the multilayer electronic component shown in FIG.

FIG. 3 is a sectional view showing the mother laminate shown in FIG. 2 before pressing.

FIG. 4 is a cross-sectional view showing the mother laminate shown in FIG. 2 after pressing.

FIG. 5 is an enlarged perspective view showing the mother laminate shown in FIG. 2;

FIG. 6 is a cross-sectional view showing a laminated electronic component with a metal case.

FIG. 7 is a cross-sectional view illustrating another laminated electronic component with a metal case.

FIG. 8 is a perspective view showing a conventional laminated electronic component.

FIG. 9 is a cross-sectional view showing a conventional laminated electronic component with a metal case.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 laminated electronic component 11 laminated body 111 one main surface 111 a first surface 111 b second surface 12 step 13 external electrode 14 ground electrode 17 a to 17 e insulating sheet

Claims (1)

[Claims] 1. A laminate having a substantially rectangular parallelepiped shape comprising a plurality of insulating sheets laminated with a circuit element interposed therein to form opposing main surfaces and side surfaces connecting the main surfaces, A laminated electronic component comprising a plurality of external electrodes and a ground electrode electrically connected to the circuit element on one main surface of the laminate, wherein at least one step is provided on one principal surface of the laminate. Forming a first surface and a second surface that is recessed relative to the first surface, wherein the external electrode is provided on the first surface, and the ground electrode is provided on the second surface. A laminated electronic component characterized by being manufactured.