JP2009099766A - Coil component, and mounting structure thereof - Google Patents

Coil component, and mounting structure thereof Download PDF

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JP2009099766A
JP2009099766A JP2007269856A JP2007269856A JP2009099766A JP 2009099766 A JP2009099766 A JP 2009099766A JP 2007269856 A JP2007269856 A JP 2007269856A JP 2007269856 A JP2007269856 A JP 2007269856A JP 2009099766 A JP2009099766 A JP 2009099766A
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coil component
ground electrode
substrate
electrode layer
mounting structure
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JP4900186B2 (en
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Hiroshi Fukushima
弘 福嶋
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a coil component which can be magnetically shielded almost completely, and to provide a mounting structure thereof. <P>SOLUTION: The coil component 1 has an insulator 12 containing a coil main body 11, a ground electrode 13, and external electrodes 14-1 and 14-2. The ground electrode 13 covers the insulator 12 while exposing only a reverse surface 12c. Both end portions 11a and 11b of the coil body 11 are connected to the external electrodes 14-1 and 14-2. A substrate 2 has a ground electrode 21 on a surface 2a, and also has a non-ground region 23 formed in the ground electrode layer 21. Pads 24-1 and 24-2 are disposed in the non-ground region 23, and connected to a line 22. The external electrodes 14-1 and 14-2 and pads 24-1 and 24-2 are connected to each other, the end 13a of the ground electrode 13 is connected to the ground electrode layer 21, and the coil component 1 is mounted on the surface 2a of the substrate 2 in a state wherein solder 3 is stuck on a connection part. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、不要磁気の影響を防止するための磁気シールド構造を備えたコイル部品及びその実装構造に関するものである。   The present invention relates to a coil component having a magnetic shield structure for preventing the influence of unnecessary magnetism and a mounting structure thereof.

従来この種のコイル部品としては、例えば、特許文献１に開示の技術がある。
図１２は、従来のコイル部品を示す斜視図である。
このコイル部品１００は、表面実装型のリードレスコイルであり、図１２に示すように、巻線又は積層等によるインダクタンス形成部（図示省略）をコイル外装剤１０２の内部に有し、コイル電極１０３をコイル外装剤１０２の外面に有している。そして、コイル電極１０３が設けられている部位以外のコイル外装材１０２の部位に、アース用のシールドケース電極１０４を有するシールドケース１０１を設けた構成になっている。このシールドケース１０１は、コイル電極１０３と接触しないように形状が設定され、シールドケース電極１０４は、使用回路上のアースに接続することができるようになっている。 Conventionally, as this type of coil component, for example, there is a technique disclosed in Patent Document 1.
FIG. 12 is a perspective view showing a conventional coil component.
This coil component 100 is a surface-mount type leadless coil, and has an inductance forming part (not shown) formed by winding, lamination, or the like inside the coil exterior agent 102 as shown in FIG. Is provided on the outer surface of the coil sheathing agent 102. The shield case 101 having the shield case electrode 104 for grounding is provided at a portion of the coil exterior material 102 other than the portion where the coil electrode 103 is provided. The shape of the shield case 101 is set so as not to contact the coil electrode 103, and the shield case electrode 104 can be connected to the ground on the circuit used.

実開平０３−００００１１号公報Japanese Utility Model Publication No. 03-000011

しかし、上記した従来の技術は、次のような問題がある。
シールドケース１０１が、コイル電極１０３と接触しないようにしなければならないため、隙間１０５をシールドケース１０１とコイル電極１０３との間に設けなければならい。このため、インダクタンス形成部から放射された磁界が隙間１０５から漏れるおそれがあり、完全な磁気シールド構造を実現することは不可能であった。 However, the conventional technique described above has the following problems.
Since it is necessary to prevent the shield case 101 from coming into contact with the coil electrode 103, a gap 105 must be provided between the shield case 101 and the coil electrode 103. For this reason, the magnetic field radiated from the inductance forming portion may leak from the gap 105, and it has been impossible to realize a complete magnetic shield structure.

この発明は、上述した課題を解決するためになされたもので、ほぼ完全に磁気シールドすることができるコイル部品及びその実装構造を提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a coil component that can be almost completely magnetically shielded and a mounting structure thereof.

上記課題を解決するために、請求項１の発明に係るコイル部品は、巻線型又は積層型のコイル本体を内包した絶縁体と、絶縁体の下面の大半を露出させた状態で、この下面以外の上面及び側面の全てを覆ったグランド用電極と、絶縁体の下面の露出部分に島状に設けられ且つコイル本体の両端がそれぞれ接続された１対の外部電極とを備える構成とした。
かかる構成により、コイル部品を基板の表面に配して、その１対の外部電極を基板の線路に接続されたパッドに接続すると共に、グランド用電極を接地することができる。かかる状態で、基板の線路に信号や電源を流すと、この信号等がパッド及び外部電極を通じて、コイル本体に入，出力する。このとき、磁界が、コイル本体から発生し、絶縁体の上面及び側面から外部に放射されるおそれがある。しかし、この発明のコイル部品は、絶縁体の下面の大半を露出させた状態で、グランド用電極を絶縁体の下面以外の上面及び側面の全てを覆った構成をとっているので、絶縁体の上面及び側面から外部に放射しようとする磁界は、このグランド用電極によってシールドされる。 In order to solve the above-described problem, the coil component according to the invention of claim 1 includes an insulator including a coiled or laminated coil body, and a portion other than the lower surface in a state where most of the lower surface of the insulator is exposed. And a pair of external electrodes provided in an island shape on the exposed portion of the lower surface of the insulator and connected to both ends of the coil body, respectively.
With this configuration, the coil component can be arranged on the surface of the substrate, the pair of external electrodes can be connected to the pad connected to the line of the substrate, and the ground electrode can be grounded. In this state, when a signal or power is supplied to the line on the substrate, the signal or the like enters and outputs to the coil body through the pad and the external electrode. At this time, a magnetic field is generated from the coil body and may be radiated to the outside from the top and side surfaces of the insulator. However, the coil component according to the present invention has a configuration in which the ground electrode is covered on all of the upper surface and the side surface other than the lower surface of the insulator in a state where most of the lower surface of the insulator is exposed. A magnetic field to be radiated to the outside from the upper surface and the side surface is shielded by the ground electrode.

請求項２の発明は、請求項１に記載のコイル部品を、表面にグランド電極層を有する基板の表面に実装したコイル部品の実装構造であって、基板は、基板表面のグランド電極層内に設けられ且つコイル部品の下面の大きさ以下の大きさに設定された非グランド領域と、この非グランド領域内に配設された状態でこの非グランド領域の真下を通る線路に接続され且つコイル部品の１対の外部電極を接続可能な１対のパッドとを有し、コイル部品は、コイル部品の１対の外部電極が基板の１対のパッドに接続され且つグランド用電極の下面側の端部がグランド電極層上に接合された状態で、基板の表面に実装されている構成とした。
かかる構成により、信号や電源を、コイル部品が表面に実装された基板の線路に流すと、この信号等がパッド及び外部電極を通じて、コイル本体に入，出力し、コイル本体から発生した磁界が、絶縁体の上面，側面及び下面から外部に放射されるおそれがある。しかし、この発明のコイル部品の実装構造では、コイル部品の１対の外部電極が基板の１対のパッドに接続され且つグランド用電極の下面側の端部がグランド電極層上に接合された状態で、コイル部品が基板の表面に実装されているので、絶縁体の上面及び側面から外部に向かう磁界が、グランド用電極によってシールドされ、絶縁体の下面から非グランド領域を通って基板表面側に向かう磁界が、基板表面のグランド電極層によってシールドされる。 The invention of claim 2 is a coil component mounting structure in which the coil component according to claim 1 is mounted on the surface of a substrate having a ground electrode layer on the surface, and the substrate is in the ground electrode layer on the surface of the substrate. A non-ground region provided and set to a size equal to or less than the size of the lower surface of the coil component, and a coil component connected to a line passing directly below the non-ground region in a state of being disposed in the non-ground region. A pair of pads to which the pair of external electrodes can be connected, and the coil component includes a pair of external electrodes of the coil component connected to the pair of pads on the substrate and an end on the lower surface side of the ground electrode It was set as the structure mounted in the surface of the board | substrate in the state in which the part was joined on the ground electrode layer.
With this configuration, when a signal or a power source is passed through a line on a substrate on which a coil component is mounted, the signal or the like enters and outputs to the coil body through the pad and the external electrode, and the magnetic field generated from the coil body is There is a risk of radiation from the top, side and bottom surfaces of the insulator. However, in the coil component mounting structure according to the present invention, the pair of external electrodes of the coil component is connected to the pair of pads of the substrate, and the lower end of the ground electrode is joined to the ground electrode layer. Since the coil component is mounted on the surface of the substrate, the magnetic field going outward from the top surface and side surface of the insulator is shielded by the ground electrode, and passes from the bottom surface of the insulator through the non-ground region to the substrate surface side. The heading magnetic field is shielded by the ground electrode layer on the substrate surface.

請求項３の発明は、請求項２に記載のコイル部品の実装構造において、グランド用電極の下面側の端部とグランド電極層との接合部の全てに、隙間なく半田を付着した構成とする。
かかる構成により、グランド用電極の下面側の端部とグランド電極層との接合部の隙間から漏れようとする磁界を半田によってシールドすることができる。 According to a third aspect of the present invention, in the coil component mounting structure according to the second aspect of the present invention, the solder is adhered to all the joints between the lower surface side end of the ground electrode and the ground electrode layer. .
With this configuration, it is possible to shield the magnetic field that is about to leak from the gap between the joint between the lower surface side end of the ground electrode and the ground electrode layer with solder.

請求項４の発明は、請求項２又は請求項３に記載のコイル部品の実装構造において、線路を、上記基板の内部に配設し、コイル部品の下面以上の広さを有するグランド電極層を、基板の裏面であって且つ非グランド領域の真裏に位置する部位に設けた構成とする。
かかる構成により、コイル部品の下面から非グランド領域を通って基板裏面に向かう磁界が、基板裏面に設けられたグランド電極層によってシールドされる。 According to a fourth aspect of the present invention, in the coil component mounting structure according to the second or third aspect, the line is disposed inside the substrate, and a ground electrode layer having a width larger than the lower surface of the coil component is provided. The configuration is such that it is provided on the back surface of the substrate and at a position located directly behind the non-ground region.
With this configuration, the magnetic field from the lower surface of the coil component toward the back surface of the substrate through the non-ground region is shielded by the ground electrode layer provided on the back surface of the substrate.

請求項５の発明は、請求項４に記載のコイル部品の実装構造において、基板の表面のグランド電極層と裏面のグランド電極層とを接続する複数のスルーホールを所定間隔で設け、これら複数のスルーホールで、非グランド領域の周りを檻のように囲んだ構成とする。
かかる構成により、コイル部品の下面から基板内部に放射された磁界が、基板表面のグランド電極層と裏面のグランド電極層と非グランド領域の周りを檻のように囲んだ複数のスルーホールとによって、シールドされる。 According to a fifth aspect of the present invention, in the coil component mounting structure according to the fourth aspect, a plurality of through-holes connecting the ground electrode layer on the front surface of the substrate and the ground electrode layer on the back surface are provided at predetermined intervals. A through hole is used to surround the non-ground area like a ridge.
With this configuration, the magnetic field radiated into the substrate from the lower surface of the coil component is caused by the ground electrode layer on the surface of the substrate, the ground electrode layer on the back surface, and the plurality of through-holes surrounding the non-ground region like ridges. Shielded.

以上詳しく説明したように、請求項１の発明に係るコイル部品によれば、絶縁体の上面及び側面から外部に放射しようとする磁界が、グランド用電極によってシールドされるので、コイル部品から基板表面側に放射する磁界がほぼ完全にシールドされ、他の電子回路への磁気干渉を防止することができるという優れた効果がある。   As described above in detail, according to the coil component according to the first aspect of the present invention, since the magnetic field to be radiated to the outside from the upper surface and the side surface of the insulator is shielded by the ground electrode, The magnetic field radiated to the side is almost completely shielded, and magnetic interference with other electronic circuits can be prevented.

請求項２ないし請求項５の発明に係るコイル部品の実装構造によれば、コイル部品から基板の表面側に放射される磁界の全てを、コイル部品のグランド用電極と基板表面のグランド電極層によってほぼ完全にシールドすることができるという優れた効果がある。また、コイル部品にグランド用電極を設け、基板表面のグランド電極層を利用して、磁気シールドを図ることができる構成であるので、シールドケース等、特別なケースを用いて磁気シールドを図る一般のシールド構造よりも、低コストで磁気シールド構造を実現することができるという効果もある。
特に、請求項３の発明によれば、グランド用電極とグランド電極層との接合部の隙間から漏れようとする磁界を半田によって完全にシールドすることができるという効果がある。 According to the mounting structure of the coil component according to the inventions of claims 2 to 5, all of the magnetic field radiated from the coil component to the surface side of the substrate is caused by the ground electrode of the coil component and the ground electrode layer on the substrate surface. There is an excellent effect of being able to shield almost completely. In addition, since a ground electrode is provided on the coil component and the magnetic shield can be achieved by using the ground electrode layer on the surface of the substrate, the magnetic shield is generally achieved using a special case such as a shield case. There is also an effect that the magnetic shield structure can be realized at a lower cost than the shield structure.
In particular, according to the third aspect of the present invention, there is an effect that the magnetic field that is about to leak from the gap between the joint portions of the ground electrode and the ground electrode layer can be completely shielded by the solder.

さらに、請求項４の発明によれば、コイル部品から基板表面側に放射される磁界だけでなく、基板裏面側に放射される磁界をもシールドすることができるので、より高いシールド効果を得ることができる。
特に、請求項５の発明によれば、コイル部品の下面から放射された磁界が、基板表面のグランド電極層と裏面のグランド電極層とスルーホールとによって、シールドされるので、基板表面及び基板裏面側に放射される磁界だけでなく、基板内部を伝搬しようとする磁界をもシールドすることができ、磁気シールドのほぼ完全化を達成することができる。 Further, according to the invention of claim 4, since not only the magnetic field radiated from the coil component to the substrate surface side but also the magnetic field radiated to the substrate back side can be shielded, a higher shielding effect can be obtained. Can do.
In particular, according to the invention of claim 5, since the magnetic field radiated from the lower surface of the coil component is shielded by the ground electrode layer on the substrate surface, the ground electrode layer on the back surface, and the through hole, the substrate surface and the substrate back surface It is possible to shield not only the magnetic field radiated to the side but also the magnetic field that is about to propagate inside the substrate, and the magnetic shield can be almost completely completed.

以下、この発明の最良の形態について図面を参照して説明する。   The best mode of the present invention will be described below with reference to the drawings.

図１は、この発明の第１実施例に係るコイル部品の実装構造を示す概略断面図であり、図２は、コイル部品を透過して示す概略斜視図であり、図３は、コイル部品の実装構造を示す分解斜視図である。   FIG. 1 is a schematic cross-sectional view showing a mounting structure of a coil component according to a first embodiment of the present invention, FIG. 2 is a schematic perspective view showing the coil component through, and FIG. It is a disassembled perspective view which shows a mounting structure.

この実施例のコイル部品の実装構造は、図１に示すように、コイル部品１を、表面２ａにグランド電極層２１を有する基板２の表面２ａに実装したものである。なお、この実施例に適用されるのコイル部品１は、請求項１に係るコイル部品を具体的に実現したものである。   As shown in FIG. 1, the coil component mounting structure of this embodiment is such that the coil component 1 is mounted on the surface 2a of the substrate 2 having the ground electrode layer 21 on the surface 2a. The coil component 1 applied to this embodiment is a specific implementation of the coil component according to claim 1.

コイル部品１は、表面実装型のコイル部品であり、図２にも示すように、巻線型又は積層型のコイル本体１１を内包した絶縁体１２と、グランド用電極１３と、１対の外部電極１４−１，１４−２とで構成されている。   The coil component 1 is a surface mount type coil component. As shown in FIG. 2, the coil component 1 includes an insulator 12 including a coiled or laminated coil body 11, a ground electrode 13, and a pair of external electrodes. 14-1 and 14-2.

絶縁体１２は、例えば、フェライト等の磁性体材料で形成された直方体状の部材であり、両端部１１ａ，１１ｂを除いて、コイル本体１１を完全に包含している。   The insulator 12 is a rectangular parallelepiped member made of a magnetic material such as ferrite, and completely includes the coil body 11 except for both end portions 11a and 11b.

グランド用電極１３は、図１に示すように、絶縁体１２の上面１２ａと４つの側面１２ｂとを完全に覆った状態で、絶縁体１２の外面に設けられている。これにより、絶縁体１２の下面１２ｃだけが外部に露出した状態になっている。   As shown in FIG. 1, the ground electrode 13 is provided on the outer surface of the insulator 12 so as to completely cover the upper surface 12 a and the four side surfaces 12 b of the insulator 12. As a result, only the lower surface 12c of the insulator 12 is exposed to the outside.

１対の外部電極１４−１，１４−２は、図３に示すように、このような絶縁体１２の下面１２ｃに島状に設けられている。
具体的には、図１に示すように、外部電極１４−１，１４−２は、絶縁体１２の下面１２ｃとほぼ面一になるように、絶縁体１２の下面１２ｃに埋め込まれており、下面１２ｃから露出したコイル本体１１の両端部１１ａ，１１ｂが、これら外部電極１４−１，１４−２にそれぞれ接続されている。 As shown in FIG. 3, the pair of external electrodes 14-1 and 14-2 is provided in an island shape on the lower surface 12 c of the insulator 12.
Specifically, as shown in FIG. 1, the external electrodes 14-1 and 14-2 are embedded in the lower surface 12 c of the insulator 12 so as to be substantially flush with the lower surface 12 c of the insulator 12. Both end portions 11a and 11b of the coil body 11 exposed from the lower surface 12c are connected to the external electrodes 14-1 and 14-2, respectively.

一方、基板２は、グランド電極層２１を表面２ａに有し、内部に線路２２を有している。
具体的には、図３に示すように、グランド電極層２１が、基板２の表面２ａ全面に形成され、非グランド領域２３がグランド電極層２１内に形成されている。そして、電源や信号を流す線路２２が基板２内に形成され、非グランド領域２３の真下を通っている。 On the other hand, the substrate 2 has a ground electrode layer 21 on the surface 2a and a line 22 inside.
Specifically, as shown in FIG. 3, the ground electrode layer 21 is formed on the entire surface 2 a of the substrate 2, and the non-ground region 23 is formed in the ground electrode layer 21. A line 22 for supplying power and signals is formed in the substrate 2 and passes directly under the non-ground region 23.

非グランド領域２３は、コイル部品１の下面１２ｃに対応した長方形状を成し、その大きさは、当該下面１２ｃの大きさ以下の大きさに設定されている。
そして、このような非グランド領域２３の内側には、１対のパッド２４−１，２４−２が配設されている。 The non-ground region 23 has a rectangular shape corresponding to the lower surface 12c of the coil component 1, and the size thereof is set to be equal to or smaller than the size of the lower surface 12c.
A pair of pads 24-1 and 24-2 are disposed inside the non-ground region 23.

パッド２４−１，２４−２は、コイル部品１の１対の外部電極１４−１，１４−２を接続するための部材である。
具体的には、パッド２４−１，２４−２は、外部電極１４−１，１４−２とほぼ同じ間隔で非グランド領域２３内に配設され、非グランド領域２３の真下を通る線路２２，２２にスルーホール２２ａ，２２ａを介して接続されている。 The pads 24-1 and 24-2 are members for connecting the pair of external electrodes 14-1 and 14-2 of the coil component 1.
Specifically, the pads 24-1 and 24-2 are disposed in the non-ground region 23 at substantially the same interval as the external electrodes 14-1 and 14-2, and the lines 22 that pass directly below the non-ground region 23, 22 is connected to through hole 22a, 22a.

コイル部品１は、基板２の非グランド領域２３上に位置させ、下面１２ｃを下側にして、外部電極１４−１，１４−２とパッド２４−１，２４−２とを接合させることで、コイル部品１が基板２の表面２ａ上に実装される。
具体的には、図１に示すように、外部電極１４−１，１４−２とパッド２４−１，２４−２とが接続され、グランド用電極１３の下面側の端部１３ａがグランド電極層２１上に接合されている。そして、半田３がかかる接合部に沿って付着され、接合部に発生する可能性のある微少な隙間が半田３によって覆われるようにしている。 The coil component 1 is positioned on the non-ground region 23 of the substrate 2 and the external electrodes 14-1 and 14-2 and the pads 24-1 and 24-2 are joined with the lower surface 12c facing downward. The coil component 1 is mounted on the surface 2 a of the substrate 2.
Specifically, as shown in FIG. 1, the external electrodes 14-1 and 14-2 and the pads 24-1 and 24-2 are connected, and the end 13 a on the lower surface side of the ground electrode 13 is a ground electrode layer. 21 is joined. Then, the solder 3 is attached along the joining portion, and a minute gap that may occur in the joining portion is covered with the solder 3.

次に、この実施例のコイル部品の実装構造が示す作用及び効果について説明する。
図４は、この実施例のコイル部品の実装構造が示す作用及び効果を説明するための模式的断面図である。なお、磁界の方向を理解し易くするため、コイル部品１と基板２との内部のハッチングは除いた。
図４に示すように、信号Ｓを、基板２内部の線路２２に流すと、この信号Ｓは、パッド２４−１，２４−２及びコイル部品１の外部電極１４−１，１４−２を通じて、コイル本体１１を入力した後、外部電極１４−１，１４−２及びパッド２４−１，２４−２を通じて線路２２側に出力される。
このとき、信号Ｓが、コイル本体１１を流れるので、磁界がコイル本体１１から発生し、この磁界がコイル部品１や基板２を通じて、外部に放射されるおそれがある。
しかし、この実施例では、上記したように、コイル部品１のグランド用電極１３の下面側の端部１３ａがグランド電極層２１上に隙間なく接合され、しかも、この接合部が半田３で覆われているので、コイル部品１内部の磁界が、少なくとも基板２の表面側（図４の上方側）に漏れることはない。
すなわち、コイル本体１１から絶縁体１２の上面１２ａや側面１２ｂ側に向かう磁界Ｈ１は、グランド用電極１３によってシールドされる。そして、グランド用電極１３とグランド電極層２１との接合部に向かう磁界Ｈ２は、隙間がほとんどない接合部と半田３とによってシールドされる。さらに、基板２の非グランド領域２３を通り抜けて基板２内部から表面２ａ側に向かう磁界Ｈ３は、グランド電極層２１によってシールドされる。 Next, the operation and effect of the coil component mounting structure of this embodiment will be described.
FIG. 4 is a schematic cross-sectional view for explaining the operation and effect of the coil component mounting structure of this embodiment. In order to facilitate understanding of the direction of the magnetic field, hatching inside the coil component 1 and the substrate 2 was omitted.
As shown in FIG. 4, when the signal S is passed through the line 22 inside the substrate 2, the signal S passes through the pads 24-1 and 24-2 and the external electrodes 14-1 and 14-2 of the coil component 1. After the coil body 11 is input, it is output to the line 22 side through the external electrodes 14-1 and 14-2 and the pads 24-1 and 24-2.
At this time, since the signal S flows through the coil body 11, a magnetic field is generated from the coil body 11, and this magnetic field may be radiated to the outside through the coil component 1 and the substrate 2.
However, in this embodiment, as described above, the end 13a on the lower surface side of the ground electrode 13 of the coil component 1 is joined to the ground electrode layer 21 without a gap, and this joint is covered with the solder 3. Therefore, the magnetic field inside the coil component 1 does not leak at least to the surface side of the substrate 2 (upper side in FIG. 4).
That is, the magnetic field H <b> 1 from the coil body 11 toward the upper surface 12 a and the side surface 12 b of the insulator 12 is shielded by the ground electrode 13. Then, the magnetic field H <b> 2 directed toward the joint between the ground electrode 13 and the ground electrode layer 21 is shielded by the joint 3 and the solder 3 having almost no gap. Furthermore, the magnetic field H3 that passes through the non-ground region 23 of the substrate 2 and travels from the inside of the substrate 2 toward the surface 2a is shielded by the ground electrode layer 21.

このように、この実施例のコイル部品の実装構造によれば、コイル本体１１から放射される磁界Ｈ１〜Ｈ３が、グランド用電極１３と、グランド用電極１３とグランド電極層２１との接合部及び半田３と、グランド電極層２１とによってシールドされるので、基板２の表面２ａ側に実装された他の電子回路への磁気干渉を防止することができる。   Thus, according to the coil component mounting structure of this embodiment, the magnetic fields H1 to H3 radiated from the coil body 11 are applied to the ground electrode 13, the joint between the ground electrode 13 and the ground electrode layer 21, and Since it is shielded by the solder 3 and the ground electrode layer 21, magnetic interference to other electronic circuits mounted on the surface 2a side of the substrate 2 can be prevented.

次に、この発明の第２実施例について説明する。
図５は、この発明の第２実施例に係るコイル部品の実装構造を示す概略断面図であり、図６は、グランド用電極の端部を折り曲げない場合の実装構造を示す概略断面図であり、図７は、この実施例に適用されるコイル部品の斜視図である。 Next explained is the second embodiment of the invention.
FIG. 5 is a schematic cross-sectional view showing the mounting structure of the coil component according to the second embodiment of the present invention, and FIG. 6 is a schematic cross-sectional view showing the mounting structure when the end portion of the ground electrode is not bent. FIG. 7 is a perspective view of a coil component applied to this embodiment.

この実施例は、外部電極１４−１，１４−２の絶縁体下面１２ｃへの形成状態が、上記第１実施例と異なる。
すなわち、図１に示したように、第１実施例では、コイル部品１の外部電極１４−１，１４−２を絶縁体１２の下面１２ｃに埋め込んで、外部電極１４−１，１４−２と下面１２ｃとがほぼ面一になるように設定したが、この実施例で適用されるコイル部品１では、図５に示すように、外部電極１４−１，１４−２を絶縁体１２の下面１２ｃに埋め込まず、平坦の下面１２ｃ上に形成した。
このように、外部電極１４−１，１４−２を平坦な下面１２ｃに形成すると、図６に示すように、微少な隙間Ｇが生じるおそれがある。
しかし、外部電極１４−１，１４−２の厚さは、例えば、１０μｍであり、非常に薄い。このため、コイル部品１を基板２側に押圧することで、隙間Ｇはほとんど生じないと考えられる。しかも、半田３でグランド用電極１３とグランド電極層２１との接合部を覆っているので、隙間Ｇが生じたとしても、半田３によって覆われることとなる。 This embodiment is different from the first embodiment in the formation state of the external electrodes 14-1 and 14-2 on the insulator lower surface 12c.
That is, as shown in FIG. 1, in the first embodiment, the external electrodes 14-1 and 14-2 of the coil component 1 are embedded in the lower surface 12c of the insulator 12, and the external electrodes 14-1 and 14-2 Although the lower surface 12c is set to be substantially flush with the lower surface 12c, in the coil component 1 applied in this embodiment, the external electrodes 14-1 and 14-2 are connected to the lower surface 12c of the insulator 12 as shown in FIG. And formed on the flat lower surface 12c.
As described above, when the external electrodes 14-1 and 14-2 are formed on the flat lower surface 12 c, a slight gap G may be generated as shown in FIG. 6.
However, the thicknesses of the external electrodes 14-1 and 14-2 are, for example, 10 μm and very thin. For this reason, it is thought that the clearance gap G hardly arises by pressing the coil component 1 to the board | substrate 2 side. Moreover, since the solder 3 covers the joint between the ground electrode 13 and the ground electrode layer 21, even if the gap G is generated, the solder 3 covers the joint.

この実施例では、万が一、製造誤差や半田付け不良等が生じた場合においても、隙間の発生を可能な限り防止すべく、図７に示すように、グランド用電極１３の端部１３ａを下面１２ｃ側に折り曲げた。
これにより、図５に示すように、グランド用電極１３の端部１３ａがグランド電極層２１上に完全に当接し、図６に示すような隙間Ｇは生じない。したがって、製造誤差や半田付け不良等が生じた場合においても、隙間が生じる可能性が非常に低くなる。
その他の構成、作用及び効果は、上記第１実施例と同様であるので、その記載は省略する。 In this embodiment, in the unlikely event that a manufacturing error, a soldering failure, or the like occurs, the end 13a of the ground electrode 13 is provided on the lower surface 12c as shown in FIG. Folded to the side.
As a result, as shown in FIG. 5, the end 13a of the ground electrode 13 is completely in contact with the ground electrode layer 21, and the gap G as shown in FIG. 6 does not occur. Therefore, even when a manufacturing error, soldering failure, or the like occurs, the possibility that a gap will be generated becomes very low.
Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.

次に、この発明の第３実施例について説明する。
図８は、この発明の第３実施例に係るコイル部品の実装構造を示す概略断面図である。なお、磁界の方向を理解し易くするため、コイル部品１と基板２との内部のハッチングは除いた。
この実施例は、基板２の裏面にも、グランド電極層を設けた点が、上記第１及び第２実施例と異なる。 Next explained is the third embodiment of the invention.
FIG. 8 is a schematic sectional view showing a coil component mounting structure according to a third embodiment of the present invention. In order to facilitate understanding of the direction of the magnetic field, hatching inside the coil component 1 and the substrate 2 was omitted.
This embodiment differs from the first and second embodiments in that a ground electrode layer is also provided on the back surface of the substrate 2.

すなわち、図８に示すように、グランド電極層２５を基板２の裏面２ｂに設けた。
具体的には、グランド電極層２５の大きさを、コイル部品１の下面１２ｃよりも若干大きく設定した。そして、グランド電極層２５を基板２の非グランド領域２３の真裏に位置する部位に設けた。 That is, as shown in FIG. 8, the ground electrode layer 25 is provided on the back surface 2 b of the substrate 2.
Specifically, the size of the ground electrode layer 25 was set slightly larger than the lower surface 12 c of the coil component 1. Then, the ground electrode layer 25 was provided at a position located directly behind the non-ground region 23 of the substrate 2.

これにより、コイル部品１のコイル本体１１で生じ、非グランド領域２３を抜けて、基板２の裏面２ｂ側に向かう磁界Ｈ４が、裏面２ｂに設けられたグランド電極層２５によってシールドされる。この結果、上記第１及び第２実施例の実装構造よりも高いシールド効果を得ることができる。   As a result, the magnetic field H4 generated in the coil body 11 of the coil component 1 and passing through the non-ground region 23 toward the back surface 2b of the substrate 2 is shielded by the ground electrode layer 25 provided on the back surface 2b. As a result, a higher shielding effect than the mounting structures of the first and second embodiments can be obtained.

なお、この実施例では、グランド電極層２５の大きさを、コイル部品１の下面１２ｃよりも若干大きく設定して、基板２の非グランド領域２３の真裏に配置したが、グランド電極層２５は、コイル部品１の下面１２ｃ以上の広さならば、その機能を発揮する。したがって、図９に示すように、グランド電極層２５を基板２の裏面２ｂ全面に設けることもできる。
その他の構成、作用及び効果は、上記第１及び第２実施例と同様であるので、その記載は省略する。 In this embodiment, the size of the ground electrode layer 25 is set slightly larger than that of the lower surface 12c of the coil component 1 and is arranged directly behind the non-ground region 23 of the substrate 2. If it is wider than the lower surface 12c of the coil component 1, its function is exhibited. Therefore, as shown in FIG. 9, the ground electrode layer 25 can be provided on the entire back surface 2 b of the substrate 2.
Other configurations, operations, and effects are the same as those in the first and second embodiments, and thus description thereof is omitted.

次に、この発明の第４実施例について説明する。
図１０は、この発明の第４実施例に係るコイル部品の実装構造を示す概略断面図であり、図１１は、基板２の平面図である。なお、図１０において、磁界の方向を理解し易くするため、コイル部品１と基板２との内部のハッチングは除いた。
この実施例は、複数のスルーホールを設けた点が、上記第３実施例と異なる。
具体的には、図１０に示すように、複数のスルーホール２６を基板２の表面２ａのグランド電極層２１と裏面２ｂのグランド電極層２５との間に接続した。このとき、スルーホール２６は、ほぼ半田３の下側に半田３に沿って形成され、且つその間隔は、一定の間隔に設定されている。
これにより、図１１に示すように、複数のスルーホール２６が、非グランド領域２３を下側から檻のように囲み、図１０に示すように、グランド電極層２５とスルーホール２６とによる室が、非グランド領域２３の下側に画成された状態になる。 Next explained is the fourth embodiment of the invention.
FIG. 10 is a schematic sectional view showing a coil component mounting structure according to the fourth embodiment of the present invention, and FIG. In FIG. 10, the hatching inside the coil component 1 and the substrate 2 is omitted for easy understanding of the direction of the magnetic field.
This embodiment differs from the third embodiment in that a plurality of through holes are provided.
Specifically, as shown in FIG. 10, a plurality of through holes 26 were connected between the ground electrode layer 21 on the front surface 2a of the substrate 2 and the ground electrode layer 25 on the back surface 2b. At this time, the through holes 26 are formed substantially along the solder 3 on the lower side of the solder 3, and the interval is set to a constant interval.
As a result, as shown in FIG. 11, the plurality of through holes 26 surround the non-ground region 23 like a ridge from the lower side, and as shown in FIG. 10, a chamber formed by the ground electrode layer 25 and the through holes 26 is formed. Thus, a state defined below the non-ground region 23 is obtained.

かかる構成により、コイル部品１のコイル本体１１で生じ、非グランド領域２３を抜けて、基板２の裏面２ｂ側に向かう磁界Ｈ４はグランド電極層２５によってシールドされ、非グランド領域２３を抜けて、基板２の内部を伝わろうとする磁界Ｈ５は、檻状の複数のスルーホール２６によってシールドされる。この結果、磁気シールドのほぼ完全化を達成することができる。
その他の構成、作用及び効果は、上記第３実施例と同様であるので、その記載は省略する。 With this configuration, the magnetic field H4 that is generated in the coil body 11 of the coil component 1 and passes through the non-ground region 23 toward the back surface 2b of the substrate 2 is shielded by the ground electrode layer 25, passes through the non-ground region 23, and passes through the substrate. 2 is shielded by a plurality of bowl-shaped through holes 26. As a result, the magnetic shield can be almost completely completed.
Since other configurations, operations, and effects are the same as those of the third embodiment, description thereof is omitted.

なお、この発明は、上記実施例に限定されるものではなく、発明の要旨の範囲内において種々の変形や変更が可能である。
例えば、上記各実施例では、半田３を、コイル部品１のグランド用電極１３と基板２のグランド電極層２１との接合部に付着させた例を示したが、半田３を当該接合部に付着させない構造の実装構造を、この発明の範囲から除外する意ではない。
また、上記各実施例では、線路２２が基板２の内部に設けられた例を示したが、線路２２は、非グランド領域２３の真下を通っておれば良く、基板２の裏面２ｂに設けても良いことは勿論である。 In addition, this invention is not limited to the said Example, A various deformation | transformation and change are possible within the range of the summary of invention.
For example, in each of the above embodiments, the solder 3 is attached to the joint between the ground electrode 13 of the coil component 1 and the ground electrode layer 21 of the substrate 2. However, the solder 3 is attached to the joint. It is not intended to exclude a mounting structure having a structure that is not allowed from the scope of the present invention.
In each of the above embodiments, the line 22 is provided inside the substrate 2. However, the line 22 only needs to pass directly under the non-ground region 23, and is provided on the back surface 2b of the substrate 2. Of course, it is also good.

この発明の第１実施例に係るコイル部品の実装構造を示す概略断面図である。It is a schematic sectional drawing which shows the mounting structure of the coil components which concern on 1st Example of this invention. コイル部品を透過して示す概略斜視図である。It is a schematic perspective view which permeate | transmits and shows a coil component. コイル部品の実装構造を示す分解斜視図である。It is a disassembled perspective view which shows the mounting structure of coil components. 第１実施例のコイル部品の実装構造が示す作用及び効果を説明するための模式的断面図である。It is typical sectional drawing for demonstrating the effect | action and effect which the mounting structure of the coil components of 1st Example shows. この発明の第２実施例に係るコイル部品の実装構造を示す概略断面図である。It is a schematic sectional drawing which shows the mounting structure of the coil components which concern on 2nd Example of this invention. グランド用電極の端部を折り曲げない場合の実装構造を示す概略断面図である。It is a schematic sectional drawing which shows the mounting structure when the edge part of the electrode for grounds is not bent. 第２実施例に適用されるコイル部品の斜視図である。It is a perspective view of the coil components applied to 2nd Example. この発明の第３実施例に係るコイル部品の実装構造を示す概略断面図である。It is a schematic sectional drawing which shows the mounting structure of the coil components which concern on 3rd Example of this invention. 第３実施例の一変形例を示す概略断面図である。It is a schematic sectional drawing which shows the modification of 3rd Example. この発明の第４実施例に係るコイル部品の実装構造を示す概略断面図である。It is a schematic sectional drawing which shows the mounting structure of the coil components which concern on 4th Example of this invention. 基板の平面図である。It is a top view of a board | substrate. 従来のコイル部品を示す斜視図である。It is a perspective view which shows the conventional coil components.

符号の説明Explanation of symbols

１…コイル部品、 ２…基板、 ２ａ…表面、 ２ｂ…裏面、 ３…半田、 １１…コイル本体、 １１ａ，１１ｂ，１３ａ…端部、 １２…絶縁体、 １２ａ…上面、 １２ｂ…側面、 １２ｃ…下面、 １３…グランド用電極、 １４−１，１４−２…外部電極、 ２１，２５…グランド電極層、 ２２ａ，２６…スルーホール、 ２３…非グランド領域、 ２４−１，２４−２…パッド、 Ｇ…隙間、 Ｈ１〜Ｈ５…磁界、 Ｓ…信号。   DESCRIPTION OF SYMBOLS 1 ... Coil component, 2 ... Board | substrate, 2a ... Front surface, 2b ... Back surface, 3 ... Solder, 11 ... Coil main body, 11a, 11b, 13a ... End part, 12 ... Insulator, 12a ... Upper surface, 12b ... Side surface, 12c ... Lower surface, 13 ... Ground electrode, 14-1, 14-2 ... External electrode, 21, 25 ... Ground electrode layer, 22a, 26 ... Through-hole, 23 ... Non-ground region, 24-1, 24-2 ... Pad, G: Gap, H1-H5: Magnetic field, S: Signal.

Claims (5)

巻線型又は積層型のコイル本体を内包した絶縁体と、
上記絶縁体の下面の大半を露出させた状態で、この下面以外の上面及び側面の全てを覆ったグランド用電極と、
上記絶縁体の上記下面の露出部分に島状に設けられ且つ上記コイル本体の両端がそれぞれ接続された１対の外部電極と
を備えることを特徴とするコイル部品。 An insulator containing a coiled or laminated coil body;
With most of the lower surface of the insulator exposed, a ground electrode covering all of the upper surface and side surfaces other than the lower surface;
A coil component comprising: a pair of external electrodes provided in an island shape on the exposed portion of the lower surface of the insulator and connected to both ends of the coil body. 請求項１に記載のコイル部品を、表面にグランド電極層を有する基板の当該表面に実装したコイル部品の実装構造であって、
上記基板は、基板表面の上記グランド電極層内に設けられ且つコイル部品の上記下面の大きさ以下の大きさに設定された非グランド領域と、この非グランド領域内に配設された状態でこの非グランド領域の真下を通る線路に接続され且つ上記コイル部品の１対の外部電極を接続可能な１対のパッドとを有し、
上記コイル部品は、上記コイル部品の１対の外部電極が上記基板の１対のパッドに接続され且つ上記グランド用電極の上記下面側の端部が上記グランド電極層上に接合された状態で、基板の表面に実装されている、
ことを特徴とするコイル部品の実装構造。 A coil component mounting structure in which the coil component according to claim 1 is mounted on the surface of a substrate having a ground electrode layer on the surface,
The substrate is provided in the ground electrode layer on the substrate surface and is set in a size equal to or smaller than the size of the lower surface of the coil component, and the substrate is disposed in the non-ground region. A pair of pads connected to a line passing directly under the non-ground region and capable of connecting a pair of external electrodes of the coil component;
In the coil component, a pair of external electrodes of the coil component are connected to a pair of pads of the substrate, and an end portion on the lower surface side of the ground electrode is bonded onto the ground electrode layer. Mounted on the surface of the board,
A coil component mounting structure characterized by that. 請求項２に記載のコイル部品の実装構造において、
上記グランド用電極の上記下面側の端部と上記グランド電極層との接合部の全てに、隙間なく半田を付着した、
ことを特徴とするコイル部品の実装構造。 In the mounting structure of the coil component according to claim 2,
Solder was attached to all of the junctions between the lower electrode end of the ground electrode and the ground electrode layer without any gaps,
A coil component mounting structure characterized by that. 請求項２又は請求項３に記載のコイル部品の実装構造において、
上記線路を、上記基板の内部に配設し、
上記コイル部品の上記下面以上の広さを有するグランド電極層を、上記基板の裏面であって且つ上記非グランド領域の真裏に位置する部位に設けた、
ことを特徴とするコイル部品の実装構造。 In the mounting structure of the coil component according to claim 2 or 3,
The line is disposed inside the substrate,
A ground electrode layer having a width equal to or larger than the lower surface of the coil component is provided on a back surface of the substrate and located at a position directly behind the non-ground region.
A coil component mounting structure characterized by that. 請求項４に記載のコイル部品の実装構造において、
上記基板の表面のグランド電極層と裏面のグランド電極層とを接続する複数のスルーホールを所定間隔で設け、これら複数のスルーホールで、上記非グランド領域の周りを檻のように囲んだ、
ことを特徴とするコイル部品の実装構造。 In the mounting structure of the coil component according to claim 4,
A plurality of through holes connecting the ground electrode layer on the front surface of the substrate and the ground electrode layer on the back surface are provided at predetermined intervals, and the plurality of through holes surround the non-ground region like a ridge,
A coil component mounting structure characterized by that.
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