JP2002164631A - Batch process wiring board and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently deposit a plating metal layer to the side conductor of the wiring board obtained by dividing the batch-process wiring board. SOLUTION: In the batch-process wiring board, multiple wiring board areas 11 are arranged in a flat mother board 10 by a plurality of rows. Notches 12 passing through the mother board 10 are formed from the other end side of the mother board 10 on a boundary dividing the respective rows so that one end side of the mother board 10 becomes a connected state. Side conductors 3 passing through the mother board 10 are exposed to the sides of the respective wiring board areas 11 in the notches 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-cavity wiring board for manufacturing a small-sized wiring board for mounting electronic components such as a semiconductor element and a piezoelectric vibrator, and a method of manufacturing the wiring board. .

[0002]

2. Description of the Related Art Conventionally, a small-sized wiring board for mounting electronic components such as a semiconductor element and a piezoelectric vibrator has a structure in which electrodes of the electronic components are electrically connected to the upper surface of a substantially rectangular flat insulating base. And a plurality of side conductors each of which is electrically connected to the side surface of the insulating base. Then, the electronic component is mounted on the upper surface of the insulating base, and each electrode of the electronic component is electrically connected to the wiring conductor via an electrical connection means such as solder or a bonding wire. An electronic device is obtained by fixing, for example, a resin sealing material so as to cover the components and sealing the electronic component with the resin sealing material.
The electronic device is mounted on the external electric circuit board by bonding the side conductor to the wiring conductor of the external electric circuit board via a conductive bonding material such as solder, and the electronic component to be mounted is connected to the external electric circuit. It will be electrically connected.

[0003] By the way, such a small-sized wiring board has recently become several m in size due to the recent demand for miniaturization of electronic devices.
In order to facilitate the handling of a large number of wiring boards and to efficiently manufacture the wiring boards and electronic devices, a large number of pieces from a single large-area motherboard are used. Are manufactured in the form of a so-called multi-cavity wiring board in which a plurality of wiring boards are simultaneously and intensively obtained.

This multi-cavity wiring board is formed by forming a large number of wiring board regions, each of which becomes a small-sized wiring board, in a matrix on a substantially flat mother board made of an electrically insulating material such as ceramics. A plurality of wiring conductors are formed on the upper surface of each wiring board area, and a plurality of column-shaped conductors for side conductors to which the respective wiring conductors are electrically connected are formed on the boundary of each wiring board area. It is buried so as to penetrate the substrate up and down.

Then, the electronic components are mounted on the upper surface of each wiring board region, and the electrodes of the electronic components are electrically connected to the wiring conductors of each wiring board region, and then the electronic components are sealed with a resin sealing material. After stopping, if the mother board is divided on the boundary line of each wiring board area, a large number of electronic devices formed by exposing the side conductor formed by dividing the columnar conductor to the side face of the wiring board are simultaneously intensive. It is produced in.

[0006] Such a multi-cavity wiring board usually has a thickness of 1 to 10 µm in order to improve the electrical connection between the electrodes of the electronic component and the wiring conductor.
A nickel plating layer having a thickness of about m and a gold plating layer having a thickness of about 0.1 to 3 μm are applied to the surface of the wiring conductor before mounting the electronic component. In addition, after the mother board is divided into electronic devices, in order to improve the connection between the side conductors exposed due to the separation of the columnar conductors and the wiring conductors of the external electric circuit board, a usual method is used. If present, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are adhered to the surface of the side conductor.

[0007]

However, in such a conventional multi-cavity wiring board, the columnar conductor is divided on the side surface of each wiring board by dividing the mother board on the boundary of each wiring board area. Since the formed side conductor is exposed, a plating metal layer such as a nickel plating layer or a gold plating layer can be applied to the surface of the side conductor of each wiring board unless the mother board is divided. Therefore, there is a problem that the workability of attaching a plating metal layer such as a nickel plating layer or a gold plating layer to the side conductor of each wiring board becomes extremely complicated.

The present invention has been devised in view of such a conventional problem, and has as its object to efficiently cover a side conductor of a wiring board obtained by dividing a multi-cavity wiring board with a plating metal layer. It is an object of the present invention to provide a multi-piece wiring board that can be attached and a method of manufacturing the wiring board.

[0009]

According to a multi-cavity wiring board of the present invention, a plurality of wiring board areas are provided in a plurality of rows in a flat mother board, and a mother board is formed on a boundary line separating each row of the wiring board areas. A notch that penetrates the substrate is formed from the other end of the motherboard so that one end of the motherboard is connected, and a side conductor that penetrates the motherboard is exposed on a side surface of each wiring board area in the notch. It is characterized by comprising.

In the method of manufacturing a wiring board according to the present invention, a plurality of wiring board areas are provided in a plurality of rows in a flat mother board, and the mother board is vertically arranged on a boundary line separating each row of the wiring board areas. A step of providing a plurality of penetrating columnar conductors corresponding to the respective wiring board regions, and one end of the mother board was connected to a notch for vertically dividing the columnar conductors on a boundary line of a row of the respective wiring board regions of the mother board. Forming from the other end side of the mother board so as to be in a state, exposing the side conductor formed by dividing the columnar conductor on the side face of each wiring board area in the cut, and then forming the side conductor in the mother board Applying a plating metal layer to the exposed surface.

According to the multi-cavity wiring board of the present invention, the side face penetrating the mother board is provided on the side face of each wiring board area in the cut formed on the boundary line separating each row of the wiring board area provided on the mother board. Since the conductor is exposed, the plated metal layer can be efficiently and simultaneously applied to the side conductors of a large number of wiring board regions arranged and formed on the motherboard.

According to the method of manufacturing a wiring board of the present invention, a columnar conductor is provided on a boundary line that divides each row of a wiring substrate region provided on a motherboard, and the motherboard is formed with a cut for vertically dividing the columnar conductor. By forming so as to be connected to one, the side conductor formed by dividing the columnar conductor on the side surface of each wiring board region being cut is exposed,
Next, since the plating metal layer is applied to the exposed surface of the side conductor in the mother board, the plating metal layer can be efficiently applied simultaneously to the side conductors in a large number of wiring board regions.

[0013]

Next, the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing an example of a multi-cavity wiring board of the present invention and a wiring board manufactured by the method of manufacturing a wiring board of the present invention, wherein 1 is an insulating base, 2 is a wiring conductor, and 3 is a wiring conductor. It is a side conductor.

A wiring board manufactured according to the present invention is shown in FIG.
As shown in FIG. 2, a substantially square plate-shaped insulating substrate 1 made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic is used. It has a plurality of wiring conductors 2 along the periphery. A semicircular notch 1a as shown by a broken line is formed on the side surface of the insulating base 1, and a semi-cylindrical side conductor 3 to which the wiring conductor 2 is connected is formed in the notch 1a. It is buried. The wiring conductor 2 and the side conductor 3 are formed from metallized metal powder such as tungsten or molybdenum / copper / silver.
And a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially applied. Then, the electronic component is mounted on the upper surface of the insulating base 1 and the electrodes of the electronic component are electrically connected to the wiring conductor 2 via electrical connecting means such as solder or bonding wire. An electronic device is obtained by sealing the electronic component by fixing a resin sealing material made of a resin such as an epoxy resin so as to cover the electronic component. Such an electronic device is mounted on the external electric circuit board by joining the side conductor 3 of the wiring board to the wiring conductor of the external electric circuit board via a conductive bonding material such as solder, and the electronic component mounted on the external electric circuit board is mounted. Each electrode is electrically connected to an external electric circuit board.

Next, a multi-cavity wiring board of the present invention for manufacturing the above-described wiring board will be described with reference to FIG.

FIG. 2 is a perspective view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, wherein 10 is a mother board, 11 is a wiring board area, and 12 is a cut.

The mother substrate 10 is made of, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body,
It is a flat plate made of a ceramic material such as glass-ceramics, and a large number of wiring board regions 11 each of which serves as the above-described wiring board are formed in a plurality of rows in the center thereof. In addition, a notch 12 penetrating through the mother substrate 10 is formed from the other end of the mother substrate 10 on the boundary line of each column of the wiring substrate region 11 so that one end of the mother substrate 10 is connected.

A plurality of wiring conductors 2 are formed on the upper surface of each wiring board region 11 from the center to the cut 12, and further, on the side surface of each wiring board region 11 exposed in the cut 12, Side conductor 3 to which each wiring conductor 2 is connected
Is exposed.

As described above, according to the multi-cavity wiring board of the present invention, a large number of wiring board areas 11 are integrally formed in the mother board 10 and the side conductors 3 of each wiring board area 11 are formed.
Is exposed in the notch 12, so that each wiring board area 11
It is possible to simultaneously and efficiently apply a plating metal layer such as a nickel plating layer or a gold plating layer to the exposed surfaces of the wiring conductor 2 and the side conductor 3.

Then, after a plating metal layer such as a nickel plating layer or a gold plating layer is simultaneously applied to the exposed surfaces of the wiring conductors 2 and the side conductors 3 in each wiring board region 11, the upper surface of each wiring board region 11 is formed. The electronic component is mounted and each electrode of the electronic component is electrically connected to the wiring conductor 2 via an electrical connection means such as solder or a bonding wire, and thereafter, the electronic component is covered on the upper surface of each wiring board region 11. The electronic component is sealed by fixing a resin sealing material made of a resin such as an epoxy resin in the above-described manner.
By dividing into 11 units, it becomes possible to simultaneously and collectively manufacture a large number of electronic devices in which electronic components are mounted on the above-mentioned wiring board.

Next, a method of manufacturing a wiring board according to the present invention will be described.

First, as shown in the top view of FIG.
A ceramic green sheet 20 for 10 is prepared, and an elliptical through hole 20a for forming the side conductor 3 is formed in the ceramic green sheet 20. Such a ceramic green sheet 20 is formed by adding a suitable organic binder, a solvent, a plasticizer, a dispersant, and the like to the ceramic raw material powder and mixing the obtained ceramic slurry with a sheet forming technique such as a known doctor blade method. It is manufactured by forming a predetermined sheet shape. The through hole 20a is formed by punching the ceramic green sheet 20 with a punching die. In this example, the through hole 20a has an oval shape, but the through hole 20a may have another shape such as a circle or a rectangle.

Next, as shown in the sectional view of FIG. 4, the metal paste 23 for the side conductor 3 is filled in the through hole 20a of the ceramic green sheet 20 and the upper surface of the ceramic green sheet 20 The metal paste 22 is applied by printing. The metal pastes 22 and 23 are obtained by adding a suitable organic binder, a solvent, a plasticizer, a dispersant, and the like to a metal powder such as tungsten, molybdenum, copper, silver, or the like to form a paste, and after filling and printing. Is dried with warm air or far infrared rays to remove excess solvent in the paste.

Next, the above-mentioned ceramic green sheet 20
The metal pastes 22 and 23 are fired at a high temperature, and as shown in a perspective view in FIG. 5, a large number of wiring board regions 11 each having a plurality of wiring conductors 2 on the upper surface thereof are arranged in a plurality of rows in a mother board 10. A multi-cavity wiring board is formed which is formed and has column-shaped conductors 13 penetrating vertically through the motherboard 10 corresponding to each wiring board area 11 on the boundary line of each row of the wiring board area 11.

Next, a notch 12 for vertically dividing the columnar conductor 13 is formed on a boundary line of each row of the wiring board region 11 arranged and formed on the mother board 10 such that one end of the mother board 10 is connected. From the other end side of 10, a cutting device 20 such as a diamond cutter is used, and as shown in FIG.
A multi-cavity wiring board of the present invention is obtained by exposing side conductors 3 formed by cutting columnar conductors 13 into the side surfaces of respective wiring board regions 11 at cutouts 12 vertically.

Finally, a plating metal layer such as a nickel plating layer or a gold plating layer is simultaneously deposited on the exposed surfaces of the wiring conductors 2 and the side conductors 3 in each of the wiring board regions 11 arranged and formed on the mother board 10. Thus, according to the method for manufacturing a wiring board of the present invention, a large number of wiring board areas 11
And a plurality of columnar conductors 13 vertically penetrating the motherboard 10 on a boundary line separating each row of the wiring board area 11 are provided corresponding to each wiring board area 11 and then provided on the motherboard 10 A cut 12 for vertically dividing the columnar conductor 13 is formed from the other end of the mother board 10 so as to be connected to one end of the mother board 10 on a boundary line of each column of the provided wiring board area 10, and the cut is formed. Column conductors 13 on the side of each wiring board area 11 in 12
Is exposed, and then the plating metal layer is applied to the exposed surfaces of the wiring conductors 2 and the side conductors 3 in the motherboard 10, so that a large number of wiring board areas are formed.
A plating metal layer such as a nickel plating layer or a gold plating layer can be simultaneously and efficiently applied to the eleven wiring conductors 2 and the side conductors 3.

[0028]

According to the multi-cavity wiring board of the present invention,
The mother board is provided on the side surface of each wiring board area in the cut formed from the other end of the mother board so that one end of the mother board is connected to a boundary line separating each row of the wiring board area provided on the mother board. Since the side conductors penetrating through the substrate are exposed, it is possible to simultaneously and efficiently apply the plating metal layer to the side conductors of a large number of wiring board regions arranged and formed on the motherboard.

Further, according to the method of manufacturing a wiring board of the present invention, one end of the mother board is connected to a notch for vertically dividing the columnar conductor on a boundary line separating each row of the wiring board area provided on the mother board. By forming from the other end side so as to be in a state, the side conductor formed by dividing the columnar conductor on the side surface of each wiring board area in the cut is exposed, and the exposed surface of the side conductor in the mother board is plated metal. Since the layers are applied, the plated metal layer can be efficiently and simultaneously applied to the side conductors of a large number of wiring board regions.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a wiring board manufactured by a multi-cavity wiring board and a method of manufacturing a wiring board according to the present invention.

FIG. 2 is a perspective view showing an example of an embodiment of a multi-cavity wiring board of the present invention.

FIG. 3 is a top view for explaining the method for manufacturing a wiring board according to the present invention.

FIG. 4 is a cross-sectional view for explaining the method for manufacturing a wiring board according to the present invention.

FIG. 5 is a perspective view for explaining the method for manufacturing a wiring board according to the present invention.

[Explanation of symbols]

 3 Side conductor 10 Mother board 11 Wiring board area 12 Cut 13 Column conductor

Claims (2)

[Claims] 1. A state in which a plurality of wiring board regions are provided in a plurality of rows in a flat mother board, and a notch penetrating the mother board is connected to one end of the mother board on a boundary line separating each row. A multi-cavity wiring board formed from the other end of the mother board so that a side conductor penetrating the mother board is exposed on a side face of each wiring board area in the cut. 2. A plurality of wiring board regions are provided in a plurality of rows in a flat mother board, and a plurality of columnar conductors penetrating vertically through the mother board are provided on each of the wiring board areas on a boundary dividing each row. And a notch for vertically dividing the columnar conductor on the boundary line of the mother board is formed from the other end of the mother board so that one end of the mother board is connected. Exposing a side conductor formed by dividing the columnar conductor to the side surface of each wiring board region in the cut, and then depositing a plating metal layer on an exposed surface of the side conductor in the mother substrate. A method of manufacturing a wiring board.