JPH069509Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JPH069509Y2
JPH069509Y2 JP1988139062U JP13906288U JPH069509Y2 JP H069509 Y2 JPH069509 Y2 JP H069509Y2 JP 1988139062 U JP1988139062 U JP 1988139062U JP 13906288 U JP13906288 U JP 13906288U JP H069509 Y2 JPH069509 Y2 JP H069509Y2
Authority
JP
Japan
Prior art keywords
external lead
lead terminal
semiconductor element
glass
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988139062U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0260242U (cg-RX-API-DMAC10.html
Inventor
公明 井口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1988139062U priority Critical patent/JPH069509Y2/ja
Publication of JPH0260242U publication Critical patent/JPH0260242U/ja
Application granted granted Critical
Publication of JPH069509Y2 publication Critical patent/JPH069509Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP1988139062U 1988-10-25 1988-10-25 半導体素子収納用パッケージ Expired - Lifetime JPH069509Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988139062U JPH069509Y2 (ja) 1988-10-25 1988-10-25 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988139062U JPH069509Y2 (ja) 1988-10-25 1988-10-25 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0260242U JPH0260242U (cg-RX-API-DMAC10.html) 1990-05-02
JPH069509Y2 true JPH069509Y2 (ja) 1994-03-09

Family

ID=31401972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988139062U Expired - Lifetime JPH069509Y2 (ja) 1988-10-25 1988-10-25 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH069509Y2 (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPH0260242U (cg-RX-API-DMAC10.html) 1990-05-02

Similar Documents

Publication Publication Date Title
US4355463A (en) Process for hermetically encapsulating semiconductor devices
US4012766A (en) Semiconductor package and method of manufacture thereof
US6815808B2 (en) Hollow airtight semiconductor device package
JPH08255862A (ja) リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
US4864470A (en) Mounting device for an electronic component
US4470507A (en) Assembly tape for hermetic tape packaging semiconductor devices
JPH11135682A (ja) 樹脂封止型半導体装置とその製造方法
JPH069509Y2 (ja) 半導体素子収納用パッケージ
JPH0723961Y2 (ja) 半導体素子収納用パッケージ
US6838765B2 (en) Semiconductor device and manufacturing method thereof
JP3127584B2 (ja) 樹脂製中空パッケージを用いた半導体装置
US7075188B2 (en) Circuit device and method for manufacturing the same
JP2508067Y2 (ja) 半導体素子収納用パッケ―ジ
JP4475788B2 (ja) 半導体装置の製造方法
JP3340455B2 (ja) Ｏリングパッケージ
JP2001177007A (ja) 半導体装置及びその製造方法
JP2875591B2 (ja) 半導体装置及びその製造方法
JPH0650991Y2 (ja) 半導体素子収納用パッケージ
JP2920066B2 (ja) 半導体装置及びその製造方法
JP2800806B2 (ja) 半導体装置及びその製造方法
JP2503029B2 (ja) 薄型構造の半導体装置の製造方法
JPH0625965Y2 (ja) ガラス封止形半導体素子収納用パッケージ
JPS6043660B2 (ja) 半導体装置
JPH02224362A (ja) 半導体装置の製造方法
JP3854206B2 (ja) 半導体装置