JPH0670936B2 - Monolithic ceramic capacitors - Google Patents

Monolithic ceramic capacitors

Info

Publication number
JPH0670936B2
JPH0670936B2 JP2069495A JP6949590A JPH0670936B2 JP H0670936 B2 JPH0670936 B2 JP H0670936B2 JP 2069495 A JP2069495 A JP 2069495A JP 6949590 A JP6949590 A JP 6949590A JP H0670936 B2 JPH0670936 B2 JP H0670936B2
Authority
JP
Japan
Prior art keywords
ceramic capacitor
monolithic ceramic
external electrode
metal powder
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2069495A
Other languages
Japanese (ja)
Other versions
JPH03270004A (en
Inventor
薫 西澤
幸一郎 ▲吉▼本
次郎 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2069495A priority Critical patent/JPH0670936B2/en
Publication of JPH03270004A publication Critical patent/JPH03270004A/en
Publication of JPH0670936B2 publication Critical patent/JPH0670936B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Conductive Materials (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は積層セラミックコンデンサに係り、特に、安価
でしかも信頼性の高い積層セラミックコンデンサに関す
る。
The present invention relates to a monolithic ceramic capacitor, and more particularly to an inexpensive and highly reliable monolithic ceramic capacitor.

[従来の技術] 積層セラミックコンデンサは、セラミック誘電体と、そ
の内部に設けられた内部電極及びこの内部電極に導通す
る外部電極とで主に構成されている。従来、この積層セ
ラミックコンデンサの外部電極は、貴金属粉末とガラス
フリットとを混合したものを有機ビヒクルに混練し、こ
れをセラミック誘電体に塗布した後、600〜800℃程度の
温度で焼成して製造されており、このようにして製造さ
れた外部電極表面には、はんだ付け性向上、耐熱性向上
のためにNiめっき膜、Snめっき膜又はSn/Pbめっき膜が
電気めっき法により形成されて使用に供される。
[Prior Art] A monolithic ceramic capacitor is mainly composed of a ceramic dielectric, an internal electrode provided inside the ceramic dielectric, and an external electrode electrically connected to the internal electrode. Conventionally, the external electrodes of this monolithic ceramic capacitor are manufactured by kneading a mixture of noble metal powder and glass frit into an organic vehicle, applying this to a ceramic dielectric, and then firing at a temperature of about 600 to 800 ° C. On the surface of the external electrode manufactured in this way, Ni plating film, Sn plating film or Sn / Pb plating film is formed by electroplating method to improve solderability and heat resistance. Be used for.

[発明が解決しようとする課題] 外部電極がこのようにして製造された従来の積層セラミ
ックコンデンサでは、 高温焼成を必要とするため、製造コストが高くつ
く。
[Problems to be Solved by the Invention] In the conventional monolithic ceramic capacitor in which the external electrodes are manufactured in this manner, high temperature firing is required, and thus the manufacturing cost is high.

焼成条件やガラスフリットの耐めっき液性、その他
焼結状態等の影響により、得られる積層セラミックコン
デンサの品質やめっき膜との接着強度が左右されるた
め、信頼性の高い積層セラミックコンデンサを得ること
が難しい。
Since the quality of the obtained monolithic ceramic capacitor and the adhesion strength with the plating film are affected by the firing conditions, the resistance of the glass frit to the plating solution, and other conditions such as the sintering state, it is necessary to obtain a highly reliable monolithic ceramic capacitor. Is difficult.

外部電極が高硬度の金属焼結構造であるため、温度
サイクルで誘電体にクラックを発生させるおそれがあ
る。
Since the external electrode has a high-hardness metal sintered structure, cracks may occur in the dielectric during temperature cycling.

等の問題点があった。There were problems such as.

本発明は上記従来の問題点を解決し、高特性で信頼性の
高い積層セラミックコンデンサであって、低コストで製
造することができる積層セラミックコンデンサを提供す
ることを目的とする。
An object of the present invention is to solve the above conventional problems and to provide a monolithic ceramic capacitor having high characteristics and high reliability, which can be manufactured at low cost.

[課題を解決するための手段] 本発明の積層セラミックコンデンサは、内部電極及び該
内部電極に導通する外部電極を有する積層セラミックコ
ンデンサにおいて、該外部電極は金属粉末を含有する熱
硬化性樹脂で構成され、かつ、該外部電極表面にめっき
が施されてなることを特徴とする。
[Means for Solving the Problems] The monolithic ceramic capacitor of the present invention is a monolithic ceramic capacitor having an internal electrode and an external electrode electrically connected to the internal electrode, the external electrode being made of a thermosetting resin containing a metal powder. In addition, the surface of the external electrode is plated.

以下に本発明を詳細に説明する。The present invention will be described in detail below.

本発明の積層セラミックコンデンサの外部電極を構成す
る金属粉末としては、特に制限はなく、従来の積層セラ
ミックコンデンサの外部電極に用いられているものを好
適に使用することができる。具体的には、銀(Ag)粉
末、パラジウム(Pd)粉末等の貴金属粉末、ニッケル
(Ni)粉末等の金属粉末、或いはこれらの混合粉末等を
用いることができる。また、このような金属粉末の粒径
についても特に制限はなく、従来採用されている粒径の
ものを用いることができる。
The metal powder forming the external electrode of the monolithic ceramic capacitor of the present invention is not particularly limited, and those used for the external electrode of the conventional monolithic ceramic capacitor can be preferably used. Specifically, a noble metal powder such as silver (Ag) powder or palladium (Pd) powder, a metal powder such as nickel (Ni) powder, or a mixed powder thereof can be used. The particle size of such metal powder is also not particularly limited, and those having a particle size conventionally used can be used.

熱硬化性樹脂としては180〜250℃の温度で硬化するもの
が好ましい。熱硬化性樹脂の具体例としてはフェノール
樹脂、キシレン樹脂、ウレタン樹脂等が挙げられる。
As the thermosetting resin, those that cure at a temperature of 180 to 250 ° C. are preferable. Specific examples of the thermosetting resin include phenol resin, xylene resin and urethane resin.

このような熱硬化性樹脂は、金属粉末と混合してペース
トとし、予め内部電極が形成された誘電体に塗布した
後、加熱硬化することにより容易に外部電極とすること
ができる。なお、このペーストの調製にあたり、ペース
トの粘度が高過ぎる場合には、必要に応じて適当な溶
剤、例えば、ブチルカルビトール等を混合使用する。こ
の場合、金属粉末、熱硬化性樹脂及び溶剤の配合割合に
は特に制限はないが、通常の場合、金属粉末50〜80重量
%、熱硬化性樹脂5〜20重量%、溶剤5〜30重量%の範
囲で適宜決定される。
Such a thermosetting resin can be easily formed into an external electrode by mixing it with a metal powder to form a paste, applying the paste to a dielectric having an internal electrode formed in advance, and then curing the paste by heating. In preparing the paste, if the viscosity of the paste is too high, an appropriate solvent such as butyl carbitol is mixed and used if necessary. In this case, the mixing ratio of the metal powder, the thermosetting resin and the solvent is not particularly limited, but in the usual case, the metal powder is 50 to 80% by weight, the thermosetting resin is 5 to 20% by weight, and the solvent is 5 to 30% by weight. It is appropriately determined within the range of%.

本発明の積層セラミックコンデンサは、外部電極を形成
するにあたり、金属粉末、熱硬化性樹脂及び必要に応じ
て溶剤の所定量を混合してなるペーストを塗布した後、
加熱硬化させること以外は、従来の積層セラミックコン
デンサと同様に製造することができる。なお、上記加熱
硬化は、通常、用いた熱硬化性樹脂の硬化温度、例えば
180〜250℃で30分程度行なう。
The multilayer ceramic capacitor of the present invention, when forming the external electrode, after applying a paste prepared by mixing a predetermined amount of metal powder, thermosetting resin and solvent if necessary,
It can be manufactured in the same manner as a conventional monolithic ceramic capacitor except that it is cured by heating. The heat curing is usually a curing temperature of the thermosetting resin used, for example,
Perform at 180-250 ℃ for about 30 minutes.

このようにして形成された外部電極にめっきを施す方法
としては、電気めっき法又は無電解めっき法が挙げられ
る。また、めっきの材質、厚さは従来と同様で良く、一
般には所定厚さのNi,Sn,又は、Sn/Pbめっき膜が形成さ
れる。
Examples of the method of plating the external electrode thus formed include electroplating and electroless plating. The material and thickness of plating may be the same as conventional ones, and generally, a Ni, Sn, or Sn / Pb plating film having a predetermined thickness is formed.

[作用] 本発明の積層セラミックコンデンサは、外部電極が金属
粉末を熱硬化性樹脂で成形硬化してなるものであるた
め、高温焼成を必要としない。このため、製造コストが
低廉化される。また、本発明の積層セラミックコンデン
サの外部電極には、高い接着強度にてめっき膜を容易に
形成することができる。このため、コンデンサの電気的
特性を損なうことなくはんだ付け性、耐熱性を付与する
ことができる上に、品質の安定した信頼性の高い積層セ
ラミックコンデンサが得られる。このような外部電極を
有する積層セラミックコンデンサでは、外部電極の熱歪
による誘電体内のクラック発生も防止される。
[Operation] The multilayer ceramic capacitor of the present invention does not require high temperature firing because the external electrodes are formed by molding and curing metal powder with a thermosetting resin. Therefore, the manufacturing cost is reduced. In addition, a plating film can be easily formed on the external electrodes of the monolithic ceramic capacitor of the present invention with high adhesive strength. Therefore, it is possible to provide solderability and heat resistance without deteriorating the electrical characteristics of the capacitor, and at the same time, it is possible to obtain a highly reliable multilayer ceramic capacitor with stable quality. In the monolithic ceramic capacitor having such external electrodes, cracking in the dielectric body due to thermal strain of the external electrodes is also prevented.

[実施例] 以下に実施例及び比較例を挙げて、本発明をより具体的
に説明する。
[Examples] The present invention will be described more specifically with reference to Examples and Comparative Examples below.

実施例1、比較例1 下記配合のAgペーストを、鉛ペロブスカイト系のセラミ
ック誘電体に塗布し、次いで200℃で30分加熱して硬化
させた後、下記電気めっき法にてめっきを施して、本発
明の積層セラミックコンデンサを製造した。
Example 1 and Comparative Example 1 An Ag paste having the following composition was applied to a lead perovskite-based ceramic dielectric, which was then heated at 200 ° C. for 30 minutes to cure and then plated by the following electroplating method, A multilayer ceramic capacitor of the present invention was manufactured.

Agペースト配合(重量%) Ag粉末(平均粒径2μm):75 熱硬化性樹脂:6.2 溶剤:残部 電気めっき法 Niスルファミン酸浴、Sn/Pbスルホン酸浴を用い、バレ
ルめっき処理した。
Ag paste formulation (% by weight) Ag powder (average particle size 2 μm): 75 Thermosetting resin: 6.2 Solvent: balance Electroplating method Ni sulfamic acid bath and Sn / Pb sulfonic acid bath were used for barrel plating.

得られた積層セラミックコンデンサの諸特性を下記方法
に従って調べ、従来の焼成型外部電極に同様にめっきを
施してなる積層セラミックコンデンサ(比較例1)と比
較した。
Various characteristics of the obtained monolithic ceramic capacitor were examined according to the following methods and compared with a monolithic ceramic capacitor (Comparative Example 1) obtained by similarly plating a conventional firing type external electrode.

結果を第1表に示す。The results are shown in Table 1.

なお、試験は試料30個について行ない(ただし、耐湿負
荷試験は20個、外部電極引張試験は10個)、容量、tan
δ、引張強度については最大、最小及び平均値を示し
た。また、絶縁抵抗については最大、最小値を示した。
The test is performed on 30 samples (however, 20 for moisture resistance load test and 10 for external electrode tensile test), capacity, tan
Regarding δ and tensile strength, the maximum, minimum and average values were shown. Also, the insulation resistance showed the maximum and minimum values.

容量(nF),tanδ(%) 1KHz、1Vで測定した。The capacity (nF) and tan δ (%) were measured at 1 KHz and 1 V.

絶縁抵抗(Ω) 25V、DC5秒印加後、30秒後の値を示す。Insulation resistance (Ω) 25V, after applying DC 5 seconds, shows the value 30 seconds later.

温度サイクル耐久性 −25℃(30分)→常温(3分)→+85℃(30分)の熱サ
イクルを100サイクル行ない、容量低下の生じた試料個
数で示した。
Temperature cycle durability The heat cycle of −25 ° C. (30 minutes) → normal temperature (3 minutes) → + 85 ° C. (30 minutes) was performed 100 times, and the number of samples in which the capacity decreased was shown.

信頼性(高温負荷試験) +125℃、DC32V印加を1000時間行ない、劣化の有無を調
べた。
Reliability (high temperature load test) + 125 ° C, DC32V was applied for 1000 hours to check for deterioration.

外部電極引張試験 外部電極の引張強度を測定した。External electrode tensile test The tensile strength of the external electrode was measured.

信頼性(耐湿負荷試験) +85℃、85%RH、DC16V印加を1000時間行ない、劣化の
有無を調べた。
Reliability (moisture resistance load test) + 85 ° C, 85% RH, DC16V was applied for 1000 hours to check for deterioration.

第1表より、本発明の積層セラミックコンデンサは高特
性でしかも品質安定性に優れる上に、外部電極の接着強
度も高く、著しく信頼性の高い積層セラミックコンデン
サであることが明らかである。
From Table 1, it is clear that the monolithic ceramic capacitor of the present invention is a monolithic ceramic capacitor having high characteristics and excellent quality stability as well as high adhesive strength of external electrodes, and extremely high reliability.

[発明の効果] 以上詳述した通り、本発明の積層セラミックコンデンサ
によれば、各種特性に優れ、しかも品質の安定性にも優
れる上に、外部電極の接着強度も高く、著しく信頼性の
高い積層セラミックコンデンサであって、低コストで製
造することが可能な積層セラミックコンデンサが提供さ
れる。
[Effects of the Invention] As described in detail above, according to the monolithic ceramic capacitor of the present invention, not only is it excellent in various characteristics and also in stability of quality, but also the adhesive strength of external electrodes is high, and the reliability is extremely high. Provided is a monolithic ceramic capacitor which can be manufactured at low cost.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】内部電極及び該内部電極に導通する外部電
極を有する積層セラミックコンデンサにおいて、該外部
電極は金属粉末を含有する熱硬化性樹脂で構成され、か
つ、該外部電極表面にめっきが施されてなることを特徴
とする積層セラミックコンデンサ。
1. A monolithic ceramic capacitor having an internal electrode and an external electrode electrically connected to the internal electrode, wherein the external electrode is made of a thermosetting resin containing metal powder, and the surface of the external electrode is plated. A laminated ceramic capacitor characterized by being formed.
JP2069495A 1990-03-19 1990-03-19 Monolithic ceramic capacitors Expired - Lifetime JPH0670936B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2069495A JPH0670936B2 (en) 1990-03-19 1990-03-19 Monolithic ceramic capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2069495A JPH0670936B2 (en) 1990-03-19 1990-03-19 Monolithic ceramic capacitors

Publications (2)

Publication Number Publication Date
JPH03270004A JPH03270004A (en) 1991-12-02
JPH0670936B2 true JPH0670936B2 (en) 1994-09-07

Family

ID=13404355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2069495A Expired - Lifetime JPH0670936B2 (en) 1990-03-19 1990-03-19 Monolithic ceramic capacitors

Country Status (1)

Country Link
JP (1) JPH0670936B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10116708A (en) * 1996-10-14 1998-05-06 Mitsubishi Materials Corp Chip-type thermistor and manufacture thereof
JP3067698B2 (en) * 1997-06-27 2000-07-17 松下電器産業株式会社 Manufacturing method of multilayer ceramic electronic component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170102A (en) * 1984-02-14 1985-09-03 日東電工株式会社 Chip part
JPS60206884A (en) * 1984-03-30 1985-10-18 Nitto Electric Ind Co Ltd Electrically conductive paste composition
JPS62242324A (en) * 1986-04-14 1987-10-22 松下電器産業株式会社 Chip capacitor
JPH0217829B2 (en) * 1982-11-11 1990-04-23 Fujitsu Ltd

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217829U (en) * 1988-07-21 1990-02-06

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217829B2 (en) * 1982-11-11 1990-04-23 Fujitsu Ltd
JPS60170102A (en) * 1984-02-14 1985-09-03 日東電工株式会社 Chip part
JPS60206884A (en) * 1984-03-30 1985-10-18 Nitto Electric Ind Co Ltd Electrically conductive paste composition
JPS62242324A (en) * 1986-04-14 1987-10-22 松下電器産業株式会社 Chip capacitor

Also Published As

Publication number Publication date
JPH03270004A (en) 1991-12-02

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