JPH0663111B2 - Surface treatment method for sliding member of copper clad laminate - Google Patents
Surface treatment method for sliding member of copper clad laminateInfo
- Publication number
- JPH0663111B2 JPH0663111B2 JP2013532A JP1353290A JPH0663111B2 JP H0663111 B2 JPH0663111 B2 JP H0663111B2 JP 2013532 A JP2013532 A JP 2013532A JP 1353290 A JP1353290 A JP 1353290A JP H0663111 B2 JPH0663111 B2 JP H0663111B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- thickness
- rhodium
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、銅張積層板の銅箔部分にロジウムめっきを施
して耐摩耗性を向上させ、スリップリングなどに好適な
摺動部材を形成するための表面処理方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention forms a sliding member suitable for a slip ring, etc. by applying rhodium plating to a copper foil portion of a copper clad laminate to improve wear resistance. The present invention relates to a surface treatment method for performing
（発明の背景） 空中線と送受信機とを導波管を介して連結した形式の空
中線装置、あるいはアームが回転運動するロボット装置
などにおいては、空中線やアームなどの回転体と、送受
信機やロボット装置本体などの静止体との間で、電気信
号の伝達を行うことが必要である。この電気信号の伝達
にはスリップリングが従来より用いられている。従来の
スリップリングは、回転体と静止体のいずれか一方に回
転体の回転軸と同軸になるように複数の導電性の円板を
設け、回転体と静止体の他方にこの円板に面接触するブ
ラシ（摺動子）を設け、円板とブラシとの間で電気信号
の伝達を行わせるものである。(Background of the Invention) In an antenna device of a type in which an antenna and a transceiver are connected via a waveguide, or in a robot device in which an arm rotates, a rotating body such as an antenna or arm, and a transceiver or robot device. It is necessary to transmit an electric signal with a stationary body such as the main body. A slip ring has been conventionally used for transmitting this electric signal. A conventional slip ring is provided with a plurality of conductive discs on either the rotating body or the stationary body so as to be coaxial with the rotation axis of the rotating body, and the surface of the disc on the other side of the rotating body and the stationary body. A brush (slider) that comes into contact is provided, and an electric signal is transmitted between the disc and the brush.
このように常時回転しているものに用いられるスリップ
リングは、その表面の摩耗が激しい。そこで従来のもの
は、銅製の円板にニッケルの下地めっきを施した後ロジ
ウムめっきを行っていた。しかし銅製の円板を用いるた
め、スリップリングの重量が重くなるという問題があっ
た。The surface of the slip ring used for the one that is constantly rotating in this way is severely worn. Therefore, in the conventional one, rhodium plating is performed after nickel undercoat is applied to a copper disk. However, since the disc made of copper is used, there is a problem that the weight of the slip ring becomes heavy.
またプリント配線板をそのままスイッチのコンタクト
（接点）、コミュテータ（整流子）、計算機用のコード
板、プリントアマチュア（接極子）などの摺動部品とし
て利用するものもあるが（フラッシュプリント配線
板）、このようなものにもロジウムめっきを施すことが
広く行なわれている。There are also those that use the printed wiring board as it is as sliding parts such as switch contacts, commutators (commutators), computer code boards, printed armatures (armatures) (flash printed wiring boards), Rhodium plating is also widely applied to such products.
第３図は従来の銅張積層板の断面図である。この図にお
いて符号２は絶縁層であり、ガラス布等の基材にエポキ
シ樹脂を含浸させたシート（プリプレグ）を重ね、加圧
加熱処理したものである。この絶縁層２の両面あるいは
片面には銅箔４が積層されている。この絶縁層２と銅箔
４とで公知のガラス基材エポキシ樹脂銅張積層板６が形
成される。FIG. 3 is a sectional view of a conventional copper clad laminate. In this figure, reference numeral 2 is an insulating layer, which is obtained by stacking a sheet (prepreg) impregnated with an epoxy resin on a base material such as glass cloth, and pressurizing and heating. Copper foil 4 is laminated on both sides or one side of the insulating layer 2. The insulating layer 2 and the copper foil 4 form a known glass-based epoxy resin copper-clad laminate 6.
この積層板６の銅箔４にはニッケルめっき層８が６〜30
μｍ程度形成され、この上にロジウムめっき層10が0.1
〜0.5μｍ程度形成される。なおロジウムめっきに先行
して、下地面（銅箔表面、銅めっき層表面、ニッケルめ
っき層表面）をソフトエッチングにより活性化すること
も従来より行われていた。このソフトエッチングは、め
っき層とその下地面との反応性を高めめっき層間の密着
性を向上させるための処理であり、従来はこのソフトエ
ッチングに塩酸や硫酸などの強酸を用いていた。The copper foil 4 of the laminated plate 6 has a nickel plating layer 8 of 6 to 30.
about 10 μm, and the rhodium plating layer 10 is 0.1
About 0.5 μm is formed. Prior to rhodium plating, it has been conventionally performed to activate the underlying surface (copper foil surface, copper plating layer surface, nickel plating layer surface) by soft etching. This soft etching is a treatment for increasing the reactivity between the plating layer and the underlying surface thereof and improving the adhesion between the plating layers. Conventionally, a strong acid such as hydrochloric acid or sulfuric acid has been used for this soft etching.
このように従来のロジウムめっきは、銅の上にニッケル
めっきを行い、さらにロジウムめっきを行うものであ
り、ロジウムめっき層の厚さは0.1μｍ程度でせいぜい
0.5μｍが限度であった。As described above, the conventional rhodium plating is to perform nickel plating on copper and then rhodium plating. The thickness of the rhodium plating layer is about 0.1 μm at most.
The limit was 0.5 μm.
一般にロジウムめっき層を用いた摺動部分の耐摩耗性
は、ロジウムめっきの厚さにほぼ比例することが知られ
ている。そこで耐摩耗性を向上させるためにロジウムめ
っき層を厚くすることが考えられる。しかしロジウムは
硬度が高いため厚付けめっきとしたときには内部応力が
大きくなり、亀裂が生じたり剥離あるいは被めっき材の
変形が起ることがあった。また厚付けめっきをすると、
強酸を用いたソフトエッチングによる下地表面の粗粒化
の影響もあって粗粒めっき面が生成され、この表面の研
磨を行う必要が生じる。このため研磨作業が増え、また
めっきの一部が無駄になって不経済でもあった。It is generally known that the wear resistance of the sliding portion using the rhodium plating layer is almost proportional to the thickness of the rhodium plating. Therefore, it is possible to increase the thickness of the rhodium plating layer in order to improve the wear resistance. However, since rhodium has a high hardness, internal stress becomes large when thick plating is applied, which may cause cracks, peeling, or deformation of the material to be plated. When thick plating is applied,
Coarse-grained plated surfaces are generated due to the effect of roughening of the underlying surface by soft etching using a strong acid, and it becomes necessary to polish this surface. For this reason, the polishing work is increased, and a part of the plating is wasted, which is uneconomical.
（発明の目的） 本発明はこのような事情に鑑みなされたものであり、銅
張積層板へのロジウムの厚付けめっきを可能にし、この
結果、銅製の円板を用いることなく銅張積層板を用いて
スリップリングを構成することを可能にし、またスリッ
プリングの軽量化も可能にする銅張積層板の摺動部材の
表面処理方法を提供することも目的とする。(Object of the invention) The present invention has been made in view of such circumstances, and enables thick plating of rhodium on a copper-clad laminate, and as a result, a copper-clad laminate without using a copper disc. It is also an object of the present invention to provide a surface treatment method for a sliding member of a copper-clad laminate, which makes it possible to form a slip ring by using, and also enables the weight of the slip ring to be reduced.
またロジウムの厚付けめっきにより、コンタクト部分
（あるいは摺動部分）を一体に形成したプリント配線板
等におけるコンタククト部分の耐摩耗性を向上する表面
処理方法を提供することを他の目的とする。Another object of the present invention is to provide a surface treatment method for improving wear resistance of a contact portion in a printed wiring board or the like in which a contact portion (or a sliding portion) is integrally formed by rhodium plating.
（発明の構成） 本発明によればこの目的は、基材および樹脂からなる絶
縁層の表面に銅箔を施した銅張積層板に、ロジウム厚付
けめっきを施す表面処理方法において、前記銅箔の表面
に、過硫安溶液によるソフトエッチング、25〜30μｍ厚
さの湿式銅めっき、過硫安溶液によるソフトエッチン
グ、10〜20μｍ厚さの湿式ニッケルめっき、過硫安溶液
によるソフトエッチング、0.1〜0.2μｍ厚さの湿式金め
っきの順にそれぞれ処理を行った後、1.0〜2.5μｍ厚さ
のロジウム厚付けめっきを行うことを特徴とする銅張積
層板の摺動部材の表面処理方法により達成される。(Structure of the Invention) According to the present invention, the object is to provide a surface treatment method in which rhodium thick plating is applied to a copper clad laminate having a copper foil on the surface of an insulating layer made of a base material and a resin. On the surface of, soft etching with ammonium persulfate solution, wet copper plating with a thickness of 25 to 30 μm, soft etching with ammonium persulfate solution, wet nickel plating with a thickness of 10 to 20 μm, soft etching with ammonium persulfate solution, 0.1 to 0.2 μm thickness It is achieved by a method of surface-treating a sliding member of a copper-clad laminate characterized by performing a wet gold plating process in this order, and then performing a rhodium plating process with a thickness of 1.0 to 2.5 μm.
（実施例） 第１図は本発明により表面処理した銅張積層板の断面
図、第２図はその処理工程を示す流れ図である。(Example) FIG. 1 is a cross-sectional view of a copper clad laminate subjected to surface treatment according to the present invention, and FIG. 2 is a flow chart showing the treatment process.
この実施例は前記第３図における銅張積層板６と同様
に、ガラス布基材エポキシ樹脂絶縁層２に銅箔４を張り
付けたものである。In this embodiment, similar to the copper clad laminate 6 in FIG. 3, a copper foil 4 is attached to a glass cloth base epoxy resin insulation layer 2.
この積層板６（厚さ約1.6mm）は、その表面の銅箔４が
表面研磨される（第３図、ステップ100）。この表面研
磨は、エメリー研磨によりガラス布目を平滑にするもの
である。この表面は次にトリクレン脱脂処理（ステップ
102）、アルカリ脱脂処理（ステップ104）などの脱脂処
理が行われ、さらに水洗される。このように表面処理を
行った後、銅、ニッケル、金のめっきが順番に行われ
る。The copper foil 4 on the surface of the laminated plate 6 (thickness of about 1.6 mm) is polished (FIG. 3, step 100). This surface polishing is to smooth the glass cloth by emery polishing. This surface is then degreased with trichlene (step
102), alkaline degreasing treatment (step 104) and other degreasing treatments, and further washing with water. After the surface treatment is performed in this manner, copper, nickel, and gold are sequentially plated.
まず、前記の表面処理をした積層板６を20％過硫安（過
硫化アンモニウム、（NH４）２Ｓ２Ｏ８）溶液中に常温
で浸漬時間20秒処理し、積層板６の銅箔４の表面をソフ
トエッチングして十分水洗を行う（ステップ106）。次
に酸エッチング（酸洗）を行い、表面に生じた酸化膜を
除去する（ステップ108）。その後直ちに硫酸銅浴を用
いて銅めっきを行い（ステップ110）、約27μｍの厚さ
の銅めっき層20を形成する。First, the surface-treated laminated plate 6 was immersed in a 20% ammonium persulfate (ammonium persulfide, (NH 4 ) 2 S 2 O 8 ) solution at room temperature for 20 seconds for 20 seconds to dip the copper foil 4 of the laminated plate 6. The surface of the is soft-etched and sufficiently washed with water (step 106). Next, acid etching (pickling) is performed to remove the oxide film formed on the surface (step 108). Immediately thereafter, copper plating is performed using a copper sulfate bath (step 110) to form a copper plating layer 20 having a thickness of about 27 μm.
引き続き銅めっき面の微調整のためソフトエッチングを
先のステップ106と同様の処理液・処理条件で行い（ス
テップ112）、十分水洗した後ワット浴にてニッケルめ
っきを行う（ステップ114）。このようにして約14μｍ
厚さのニッケルめっき層22を形成する。Subsequently, in order to finely adjust the copper-plated surface, soft etching is performed under the same treatment solution and treatment conditions as in step 106 above (step 112), and after sufficiently washing with water, nickel plating is performed in a watt bath (step 114). In this way, about 14 μm
A nickel plating layer 22 having a thickness is formed.
次に前記と同様にソフトエッチングを行い（ステップ11
6）、銅・ニッケル・金からなる中間層の最終皮膜であ
る金めっき層24を青化金めっき浴を用いてにて約0.2μ
ｍの厚さに形成する。このように形成した中間めっき層
の表面はロジウムめっきを行うのに最適なものとなり、
この表面には、塩化ロジウム浴を用いて表層であるロジ
ウムめっき層26が約1.4μｍの厚さに形成される（ステ
ップ120）。この結果外観上良好でクレージング（クモ
の巣状クラック）がなく、中間層に密着性のよい適切な
ロジウムめっき層26の皮膜を得ることができる。Next, soft etching is performed as described above (step 11
6), about 0.2μ of gold plating layer 24, which is the final coating of the intermediate layer consisting of copper, nickel and gold, using a cyanide gold plating bath
It is formed to a thickness of m. The surface of the intermediate plating layer thus formed is the most suitable for rhodium plating,
On this surface, a rhodium plating layer 26, which is a surface layer, is formed to a thickness of about 1.4 μm using a rhodium chloride bath (step 120). As a result, it is possible to obtain an appropriate film of the rhodium plating layer 26 which is good in appearance, has no crazing (spiderweb-like cracks), and has good adhesion to the intermediate layer.
次にこの構成の中間層が最も望ましいことを他の構成の
中間層の場合の皮膜状態と対比すると、次のようにな
る。Next, the fact that the intermediate layer of this constitution is most desirable is compared with the film state in the case of the intermediate layers of other constitutions as follows.
銅−金−ニッケルの場合： ロジウムめっきにクラック発生した。In the case of copper-gold-nickel: A crack occurred in the rhodium plating.
ニッケル−銅−金の場合： めっきが薄い時には銅−金間に部分的密着不良発生し、
まためっきが厚い時には形成したロジウム面が粗粒化し
た。In the case of nickel-copper-gold: When the plating is thin, partial adhesion failure occurs between copper and gold,
When the plating was thick, the formed rhodium surface became coarse.
金−銅−ニッケルの場合 ロジウムめっきの密着不良、クラック発生があった。In the case of gold-copper-nickel, poor adhesion of rhodium plating and cracking occurred.
金−ニッケル−銅の場合 ロジウムめっきの密着不良があった。In the case of gold-nickel-copper, there was poor adhesion of rhodium plating.
以上のように前記実施例の構成がロジウムめっきの下地
として最も望ましいものであることが明かになったもの
である。As described above, it has been clarified that the structure of the above-mentioned embodiment is the most desirable as the base of rhodium plating.
次にこれらの各めっき層20、22、24の厚さを種々に変化
させて、厚さ1.0〜2.5μｍのロジウムめっき層26を形成
した場合の実験結果を説明する。Next, the experimental results in the case where the rhodium plating layer 26 having a thickness of 1.0 to 2.5 μm is formed by variously changing the thicknesses of the plating layers 20, 22, 24 will be described.
（厚さ） 銅 :15〜25 μｍ ニッケル: 5〜10 金 ： 〜0.1 （外観・見栄え） 銅、ニッケルが薄く、ロジウムめっきに密着不良、クラ
ックが発生 （厚さ） 銅 :25〜30 μｍ ニッケル:10〜20 金 ： 〜0.1 （外観・見栄え） ロジウムめっきがニッケルより部分剥離を発生 （厚さ） 銅 :25〜30 μｍ ニッケル:10〜20 金 :0.1〜0.2 （外観・見栄え） 良好 （厚さ） 銅 :25〜30 μｍ ニッケル:10〜20 金 :0.2〜0.3 （外観・見栄え） 金粒子が粗粒化し、均一なロジウムめっきが得られな
い。(Thickness) Copper: 15 to 25 μm Nickel: 5 to 10 Gold: to 0.1 (Appearance and appearance) Copper and nickel are thin, poor adhesion to rhodium plating, and cracks (thickness) Copper: 25 to 30 μm Nickel : 10 to 20 gold: to 0.1 (appearance and appearance) Rhodium plating causes partial peeling from nickel (thickness) Copper: 25 to 30 μm Nickel: 10 to 20 gold: 0.1 to 0.2 (appearance and appearance) Good (thickness) Copper: 25 to 30 μm Nickel: 10 to 20 Gold: 0.2 to 0.3 (Appearance and appearance) Gold particles become coarse and uniform rhodium plating cannot be obtained.
（厚さ） 銅 :25〜30 μｍ ニッケル:20〜30 金 :0.1〜0.2 （外観・見栄え） ニッケルに白濁変色が生じ、ロジウムがその部分より剥
離した。(Thickness) Copper: 25 to 30 μm Nickel: 20 to 30 Gold: 0.1 to 0.2 (Appearance and appearance) Nickel was clouded and discolored, and rhodium was peeled off from that portion.
（厚さ） 銅 :30〜50 μｍ ニッケル:10〜20 金 :0.1〜0.2 （外観・見栄え） 銅の焼け部にロジウムめっきのピンホールが発生した。(Thickness) Copper: 30 to 50 μm Nickel: 10 to 20 Gold: 0.1 to 0.2 (Appearance and appearance) Rhodium-plated pinholes were found in the burnt part of copper.
以上の実験結果から各めっき層の厚さは、のものが最
も好ましいことが解った。From the above experimental results, it was found that the thickness of each plating layer is most preferable.
なおこの実施例では、積層板６としてガラス布基材エポ
キシ樹脂銅張積層板６を用いているが、本発明はガラス
基材メラミン樹脂積層板等他の積層板であってもよい。
また通常のプリント配線板やフラッシュプリント配線板
などのコンタクト部分にも適用でき、本発明はこれらを
包含する。In this embodiment, the glass cloth-based epoxy resin copper clad laminate 6 is used as the laminate 6, but the present invention may be another laminate such as a glass-based melamine resin laminate.
Further, the present invention can be applied to a contact portion such as an ordinary printed wiring board or a flash printed wiring board.
（発明の効果） この発明は以上のように、銅箔の表面に銅、ニッケル、
金をそれぞれ過硫安溶液によるソフトエッチング下地処
理を施した後に湿式メッキを施しその上にロジウムめっ
きを行うものであるから、厚付けのロジウムめっきを形
成することができ、ロジウムの内部応力のために亀裂や
剥離が生じることがなく、また粗粒メッキ面が発生する
こともなく、良好なロジウムめっき層を得ることができ
る。(Effects of the Invention) As described above, the present invention is characterized in that copper, nickel,
Since each gold is subjected to soft etching undercoating with ammonium persulfate solution, wet plating is performed and then rhodium plating is performed on it, thick rhodium plating can be formed. A good rhodium plating layer can be obtained without causing cracks or peeling and without generating a coarse-grained plated surface.
この発明はスリップリングに適用すれば軽量な積層板を
用いて大幅な軽量化が可能であり、また導体と絶縁層表
面の高さを同一とし凹凸の無いフラッシュプリント配線
板のコンタクト部分に適用すれば、その耐摩耗性を格段
に向上させることが可能である。If this invention is applied to a slip ring, it can be significantly reduced in weight by using a lightweight laminate, and it can be applied to the contact portion of a flash printed wiring board where the conductor and insulating layer surfaces have the same height and there is no unevenness. If so, its wear resistance can be remarkably improved.
第１図は本発明により表面処理した銅張積層板の断面
図、第２図はその処理工程を示す流れ図である。また第
３図は従来の銅張積層板の断面図である。 ２……絶縁層、 ４……銅箔、 ６……積層板、 20……銅めっき層、 22……ニッケルめっき層、 24……金めっき層、 26……ロジウムめっき層。FIG. 1 is a cross-sectional view of a copper clad laminate having a surface treated according to the present invention, and FIG. 2 is a flow chart showing the treatment process. FIG. 3 is a sectional view of a conventional copper clad laminate. 2 ... Insulating layer, 4 ... Copper foil, 6 ... Laminated plate, 20 ... Copper plating layer, 22 ... Nickel plating layer, 24 ... Gold plating layer, 26 ... Rhodium plating layer.
Claims (2)
箔を施した銅張積層板に、ロジウム厚付けめっきを施す
表面処理方法において、 前記銅箔の表面に、過硫安溶液によるソフトエッチン
グ、25〜30μｍ厚さの湿式銅めっき、過硫安溶液による
ソフトエッチング、10〜20μｍ厚さの湿式ニッケルめっ
き、過硫安溶液によるソフトエッチング、0.1〜0.2μｍ
厚さの湿式金めっきの順にそれぞれ処理を行った後、1.
0〜2.5μｍ厚さのロジウム厚付けめっきを行うことを特
徴とする銅張積層板の摺動部材の表面処理方法。1. A surface treatment method for plating a copper clad laminate having a copper foil on the surface of an insulating layer made of a base material and a resin, by plating with rhodium plating, wherein the surface of the copper foil is softened with an ammonium persulfate solution. Etching, wet copper plating with a thickness of 25 to 30 μm, soft etching with ammonium persulfate solution, wet nickel plating with a thickness of 10 to 20 μm, soft etching with ammonium persulfate solution, 0.1 to 0.2 μm
After performing wet gold plating in the order of thickness, 1.
A surface treatment method for a sliding member of a copper-clad laminate, which comprises performing rhodium thick plating having a thickness of 0 to 2.5 μm.
脂とで形成されている請求項（１）の銅張積層板の摺動
部材の表面処理方法。2. The surface treatment method for a sliding member of a copper clad laminate according to claim 1, wherein the insulating layer is made of a glass cloth substrate and an epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013532A JPH0663111B2 (en) | 1990-01-25 | 1990-01-25 | Surface treatment method for sliding member of copper clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013532A JPH0663111B2 (en) | 1990-01-25 | 1990-01-25 | Surface treatment method for sliding member of copper clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03223486A JPH03223486A (en) | 1991-10-02 |
| JPH0663111B2 true JPH0663111B2 (en) | 1994-08-17 |
Family
ID=11835773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013532A Expired - Fee Related JPH0663111B2 (en) | 1990-01-25 | 1990-01-25 | Surface treatment method for sliding member of copper clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0663111B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06158189A (en) * | 1992-11-26 | 1994-06-07 | Hitachi Ltd | Method for heating and dissolving metal and device therefor |
| JP2003342787A (en) * | 2002-05-24 | 2003-12-03 | Toyo Metallizing Co Ltd | Method of producing flexible printed circuit board |
| CN107447237B (en) | 2016-05-30 | 2021-04-20 | 史莱福灵有限公司 | Slip ring with reduced contact noise |
| EP3252187B1 (en) * | 2016-05-30 | 2020-04-29 | Schleifring GmbH | Slipring with reduced contact noise |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5576089A (en) * | 1978-11-30 | 1980-06-07 | Electroplating Eng Of Japan Co | Rhodium-ruthenium alloy film coated product and production thereof |
| JPS5687689A (en) * | 1979-12-18 | 1981-07-16 | Sumitomo Metal Ind Ltd | Manufacture of steel sheet electroplated with ni-zn alloy |
-
1990
- 1990-01-25 JP JP2013532A patent/JPH0663111B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03223486A (en) | 1991-10-02 |
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